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Description for Elantas (Altana) Conap CE-1171
A single-component acrylic conformal coating that has been formulated in Rule 66 exempt solvents. Provides fast drying time and reparability as well as to providing humidity resistance and hydrolytic stability. Cured films maintain excellent adhesion to phenolic and epoxy glass laminates even in adverse environmental conditions.Brand Cytec, Conap Application Type Bond, Conformal Coat 1 Part or 2 Part 1-Part Material Form Liquid Substrate Glass, Phenolic, Epoxy Industry components, Electrical, Electronics, Printed circuitry Manufacturer Elantas (Altana) Chemistry Acrylic Cure Method Solvent Cure Temperature (°C) 25, 60 Cure Time (min) 1,440, 60, Fast Viscosity (cPs) 900 Color Slight Haze, low luster, Amber, Slight Haze, Slight Haze, low luster Fungus Resistance Fungus resistance High Temperature Resistance (°C) 125 Low Temperature Resistance (°C) -65 Volume Resistivity (O) 2.5e15 (ohms/cm) Key Specifications IPC-CC-830B, UL Recognized, Mil-Spec (United States Military Standard): I-46058-C: MIL-STD-810B; MIL-I-46058C, Type AR, Mil-Spec (United States Military Standard): MIL-STD-810B; MIL-I-46058C, Type AR -
Technical Data for Elantas (Altana) Conap CE-1171
Overview
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Application Type
- Conformal Coating - Conformal Coat
- Adhesive - Bond
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1 Part or 2 Part
- 1-Part
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Material Form
- Liquid
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Substrate
- Glass
- Phenolic
- Epoxy
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Industry
- Electronics - components, Electrical, Printed circuitry
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Chemistry
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Application Method
- Brush
- Spray
- Dip
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Cure Method
- Solvent
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Color
- Clear / Transparent - Slight Haze, low luster
- Off-White - Slight Haze, low luster
- Red - Amber, Slight Haze
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Key Specifications
- IPC (Association Connecting Electronics Industries) - IPC-CC-830B
- UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association) - UL Recognized
- Mil-Spec (United States Military Standard) : I-46058-C : Type AR - MIL-STD-810B; MIL-I-46058C, Type AR
- Mil-Spec (United States Military Standard) : STD-810B - MIL-STD-810B; MIL-I-46058C, Type AR
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Brand
- Conap
- Cytec
Specifications
Cure Specs
Cure Temperature (°C) 25, 60 Cure Time (min) 1,440, 60, Fast Viscosity (cPs) 900 Test Method Tack Free Time (min) 20, 15 Test Method Work / Pot Time (min) Indefinate Bond Strength
General Bond Strength (psi) Excellent Material Resistance
Flame Resistance Flame resistance Fungus Resistance Fungus resistance High Temperature Resistance (°C) 125 Low Temperature Resistance (°C) -65 Conductivity
Dissipation Factor 0.01000 Test Method Insulation Resistance (O) >1.5e13 (ohms), Insulation resistance, 2.5e10 (ohms), 1.0e13 (ohms) Test Method Dielectric Strength (V/mil) 1500 V.A.C. Test Method Dielectric Constant 2.50 to 3.00 Test Method Volume Resistivity (O) 2.5e15 (ohms/cm) Test Method Hardness
Flexibility Excellent, Flexibility - No cracking or crazing in bend over 1/8" diameter mandrel Test Method Other Properties
Specific Gravity 0.980 Test Method Flash Point (°F) 64.4 Test Method % Solids (%) 30 Business Information
Shelf Life Details Maintain containers at temperatures of 149°C-185°C(65°F-85°F) and keep securely closed when not in use. CONAP CE-1171 has a shelf life of 18 months from date of manufacture when stored in original, unopened containers at 149°C-185°C(65°F-85°F.) Shelf Life Temperature (°F) 65 to 85 Shelf Life Type From date of manufacture Shelf Life (mon) 18 -
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Best Practices for Elantas (Altana) Conap CE-1171
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Application
CONAP® CE-1171 is a high performance conformal coating specifically designed as an electrical insulating coating for printed circuitry and components. The ultimate performance of the cured film is dependent on process controls used in application of coating. Cleanliness of substrate is a major factor in promoting adhesion and preventing under-film corrosion. Assemblies must be clean, oil-free, and dry. For specific information, please contact your local Cytec Industries Inc. Regional Sales Manager or request Technical Bulletin C-115 Cytec's Customer Service Department.
CE-1171 may be applied by spraying, dipping, or brushing. If viscosity reduction is desired, dilution of 10-20% by weight with CONAP® S-22 solvent is recommended for most applications. S-22 Solvent meets Rule 66 exemption criteria.
PLEASE NOTE: For spray applications, dilution up to 1 to 1 by volume may be necessary to avoid cobwebbing.
CE-1171 may be sprayed with most conventional air spray equipment.
Two coats are recommended for optimum protection. A total cured film thickness of 2 ± 1 mil is recommended. CE-1171 may be re-coated, if desired, after the previous film is tack-free.
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Tack Free Time Test Methods
Tack Free Time | Tack Free Temperature |
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20 min | 25°C |
15 min | 60°C |
Viscosity Test Methods
Viscosity | Test Method | Temperature |
---|---|---|
900 cPs | Brookfield Viscosity @ 25°C, cps | 25°C |
Dielectric Constant Test Methods
Dielectric Constant | Temperature | Test Method |
---|---|---|
2.50 to 3.00 | 25°C | Dielectric Constant @ 100 Hz |
Dielectric Strength Test Methods
Dielectric Strength | Test Method |
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1500 V.A.C. | No flashoer or breakdown (1500 VAC) |
Dissipation Factor Test Methods
Dissipation Factor | Temperature | Test Method |
---|---|---|
0.01000 | 25°C | Dissipation Factor @ 100 Hz |
Insulation Resistance Test Methods
Insulation Resistance | Temperature | Test Method |
---|---|---|
>1.5e13 (ohms) | 25°C | Initially @ 25°C and 50% R.H, 2.0 mil film |
Insulation resistance | 65°C | After 10 Days @ 65°C and 95% R.H, 2.0 mil film |
2.5e10 (ohms) | 25°C | After conditioning 24 hours @ 25°C and 50% R.H, 2.0 mil film |
1.0e13 (ohms) |
Volume Resistivity Test Methods
Volume Resistivity | Temp (°C) |
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2.5e15 (ohms/cm) | 25°C |
Flexibility Test Methods
Flexibility | Test Method |
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Excellent | Flexibility Test Method |
Flexibility - No cracking or crazing in bend over 1/8" diameter mandrel | MIL-I-46058C |
Flash Point Test Methods
Flash Point | Test Method |
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18.0°C | Closed Cup |
Specific Gravity Test Methods
Specific Gravity | Temperature |
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0.980 | 25°C |