-
Description for Dow Dowsil 3-6371 UV Gel
• One-part • Very soft • Translucent • UV cure • Low temperature gel • Flexible • Moisture secondary cure.Brand Dowsil Chemical Resistance Resistance to some fuels, Chemical Resistance: Resistance to some solvents Application Type Potting, Seal 1 Part or 2 Part 1-Part Material Form Gel Industry Isolate circuits from the harmful effects of moisture, PCB system assemblies, Smart Meters, E-Mobility Solutions, Smart Home Devices, Electronics Devices, Optoelectronics, Isolate circuits from the harmful effects of other contaminants, Protect circuits from thermal stresses, Protect interconnections from thermal stresses, Protect interconnections from mechanical stresses, Protect circuits from mechanical stresses Manufacturer Dow Chemistry Controlled volatility, Silicone, Solvent-free Cure Method Addition cure, UV cure, Moisture cure Cure Time (min) 0.42 Viscosity (cPs) 850, Controlled flow Color Light amber, Translucent High Temperature Resistance (°C) 200 Low Temperature Resistance (°C) -45, -55, Low Other Resistance Cure in place to form cushioning Volume Resistivity (O) 1.9E+12 (ohm*cm) Stress Relief Stress relief Light Refractive Index (RI) High -
Technical Data for Dow Dowsil 3-6371 UV Gel
Overview
-
Chemical Resistance
- Chemical Resistance - Resistance to some fuels
- Chemical Resistance : Relative Solvent Resistance - Resistance to some solvents
-
Application Type
- Pottant / Encapsulant - Potting
- Sealant - Seal
-
1 Part or 2 Part
- 1-Part
-
Material Form
- Gel
-
Industry
- Smart Meters
- Smart Home Devices
- E-Mobility Solutions
- Electronics - Isolate circuits from the harmful effects of moisture, Electronics Devices, Optoelectronics, Isolate circuits from the harmful effects of other contaminants, Protect circuits from thermal stresses, Protect interconnections from thermal stresses, Protect circuits from mechanical stresses, Protect interconnections from mechanical stresses
- Printed Circuit Board (PCB) - PCB system assemblies
- Industrial - Delicate components
- Other - Sensitive applications
-
Chemistry
- Solvent-Free
- Other - Controlled volatility
- Silicone
-
Application Method
- Dispenser - Automated dispensing equipment, Manually
- Other - Meter mix equipment
-
Cure Method
- UV / Visible Light - UV cure
- Moisture / Condensation Cure - Moisture cure
- Other - Addition cure
-
Color
- Translucent
- Red - Light amber
-
Brand
- Dowsil
Specifications
Cure Specs
Cure Time (min) 0.42 Test Method Viscosity (cPs) 850, Controlled flow Test Method Work / Pot Time (min) 10,080 Test Method Thixotropic Thixotropic Material Resistance
Dimensional Stability (%) Dimensional stability High Temperature Resistance (°C) 200 Test Method Low Temperature Resistance (°C) -45, -55, Low Test Method Moisture/Humidity Resistance Moisture resistance, Humidity resistance Other Resistance Cure in place to form cushioning Conductivity
Dissipation Factor 0.00470, 0.00006 Test Method Dielectric Strength (V/mil) Electrical insulation for high voltages, 300 Test Method Dielectric Constant 2.81, 2.81 Test Method Volume Resistivity (O) 1.9E+12 (ohm*cm) Test Method Hardness
Stress Relief Stress relief Flexibility Resilient, Flexible, Very soft Other Properties
Light Refractive Index (RI) High Specific Gravity 0.980 Test Method Coefficient of Thermal Expansion (CTE) 385 (Linear (micron/m °C or ppm )) Business Information
Shelf Life Details Storage conditions and shelf life (“Use By” date) are indicated on the product label. Shelf Life Temperature (°F) 77 Shelf Life Type "Use By” date Shelf Life (mon) 12 Not Good For
Don't Use For Sulfur, Some solder flux residues, Polysulfones, Other sulfur containing materials, Unsaturated hydrocarbon plasticizers, Polysulfides, Organotin compounds, Other organometallic compounds Don't Use With Silicone rubber containing organotin catalyst, Certain materials, Curing agents, Plasticizers -
-
Best Practices for Dow Dowsil 3-6371 UV Gel
-
Application
Gels can be dispensed manually or by using one of the available types of meter mix equipment.
-
Mixing
Some gels are supplied in bladder packs that avoid direct air contact with the liquid gel components, allowing use of air pressure over the pack in a pressure pot for dispensing. Do not apply air pressure directly to the liquid gel surface (without the bladder pack) as the gel can become supersaturated with air and bubbling can occur when the material is dispensed and cured. Use of bladder packs prevents bubbling, maintains cleanliness and avoids gel contamination.
-
Deairing/Degassing
If possible, the potential for entrapment and incorporation of gas (typically air) should be considered during design of the part and selection of a process to dispense the gel. This is especially important with higher-viscosity and faster curing gels. Degassing at > 28 inches (10–20 mm) Hg vacuum may be necessary to ensure a void-free, protective layer
-
Testing
If a substrate or material is questionable with respect to potentially causing inhibition of cure, it is recommended that a small scale compatibility test be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured gel indicates incompatibility and inhibition of cure.
-
Removal
In the manufacture of PCB system assemblies, salvage or rework of damaged or defective units is often required. Removal of Dow dielectric gels to allow necessary repairs can be assisted by using Dow OS fluids. Digestive stripping agents, such as SU100 Silicone Sealant/Adhesive Remover from Silicones Unlimited, can also be used. In addition, if only one component needs to be replaced, a soldering iron may be applied directly through the gel to remove the component. After work has been completed, the repaired area should be cleaned with forced air or a brush, dried, and patched with additional silicone gel.
-
-
Comparable Materials for Dow Dowsil 3-6371 UV Gel
Spec Engine® Results
-
AS1420(CHT)A one-part, heat cured, non-corrosive, neutral cure, silicone adhesive sealant and potting material, It is addition cure product which is solvent free, excellent thermal conductivity.
-
AS1420-180(CHT)
A heat cured, non-corrosive, neutral cure, 1-part, silicone adhesive sealant. It is one in a range of Addition cure products which are solvent free.
-
Elastosil N10 Transparent(Wacker)Wacker Elastosil N10 Transparent is a 1-Part Neutral cure Solvent-free Liquid used to Pot and Encapsulate Silicone Rubber, Metals and Many substrates
- Compare All
Closest Results from this Manufacturer
-
Dowsil 3140 RTV Coating(Dow)• A one part component • Room temperature cure • coating with good flowability • Polydimethylsiloxane adhesive • Pin sealing • self-leveling • solder joint coverage • good flame resistance
- Compare All
-
Popular Articles
Silicones in LED Lighting | Gluespec
Read Article
Testing the effectiveness of surface treatments
Read Article
Infographic: ENSURING A STRONG BOND - 6 Basic Methods of Surface Preparation
Read Article
What Are the Differences Between Adhesives and Sealants?
Read ArticleSponsored Articles
Unique Advantages of Contact Adhesives
Read Article
Using LOCTITE® 454™ is a Valid Option for Engineers Working with a Wide Variety of Materials
Read Article
Sylgard 184 by DOW is the Top Choice for a Transparent, Silicone Encapsulant. Read Why:
Read Article
Case Study: Creating reliable, corrosion-free bonds with LORD® 406 acrylic adhesive
Read ArticleFeatured Ads
Cure Time Test Methods
| Cure Time | Test Method |
|---|---|
| 0.42 min | UV Cure, Time to 90% Gel Hardness (15 mm Thickness @ 4000 mJ/cm²), Specification Writers: These values are not intended for use in preparing specifications. |
Viscosity Test Methods
| Viscosity | Test Method |
|---|---|
| 850 cPs | Specification Writers: These values are not intended for use in preparing specifications. |
| Controlled flow |
Work / Pot Time Test Methods
| Work / Pot Time | Test Method | Temperature |
|---|---|---|
| 10,080 min | Time to double initial viscosity initial mixed viscosity for two-part products at room temperature. This property is sometimes referred to as pot life., Moisture secondary cure converts a 5-mm-thick layer to a nonflow gel after 7 days at ambient conditions. | 25°C |
High Temperature Resistance Test Methods
| High Temperature Resistance | Test Method |
|---|---|
| 200°C | For long periods |
Low Temperature Resistance Test Methods
| Low Temperature Resistance | Test Method |
|---|---|
| -45°C | For long periods |
| -55°C | |
| Low |
Dielectric Constant Test Methods
| Dielectric Constant | Test Method |
|---|---|
| 2.81 | At 100 Hz, Specification Writers: These values are not intended for use in preparing specifications. |
| 2.81 | At 100 kHz, Specification Writers: These values are not intended for use in preparing specifications. |
Dielectric Strength Test Methods
| Dielectric Strength | Test Method |
|---|---|
| Electrical insulation for high voltages | |
| 300 V/mil | Specification Writers: These values are not intended for use in preparing specifications. |
Dissipation Factor Test Methods
| Dissipation Factor | Test Method |
|---|---|
| 0.00470 | At 100 hz, Specification Writers: These values are not intended for use in preparing specifications. |
| 0.00006 | At 100 kHz, Specification Writers: These values are not intended for use in preparing specifications. |
Volume Resistivity Test Methods
| Volume Resistivity | Test Method |
|---|---|
| 1.9E+12 (ohm*cm) | Specification Writers: These values are not intended for use in preparing specifications. |
Specific Gravity Test Methods
| Specific Gravity | Test Method |
|---|---|
| 0.980 | Uncured, Specification Writers: These values are not intended for use in preparing specifications. |
