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Electrically Conductive Adhesives Grid


Loctite Ablestik CT 5047-2

Bond; 2 Part; Paste (Comp. A); Epoxy; Part A/Part B;
Two component, general purpose, room temperature cure. Adhesive - Electrically Conductive;
Manufacturer: Henkel
Substrate: Aluminum

Loctite Ablestik 56C w/ Cat 11

Bond; 2 Part; Thixotropic Paste (Adhesive); Epoxy; 2-Part Cure;
Two component, high temperature, general purpose. Adhesive - Electrically Conductive;
Manufacturer: Henkel
Substrate: Aluminum; Ceramics; Glass; Metals; Plastics

FE7004A+B

Bond; 2 Part; Liquid; 100%solids; Part A/Part B;
Bonds to most metals and rigid plastics, rubber, concrete, wood, ceramics and most other fabricating materials. Features high shear strength with high impact, chemical and water resistance.;
Manufacturer: HB Fuller
Substrate: Ceramics; Concrete; Fabricating materials; Metals; Rigid plastics; Rubber; Wood

Loctite Ablestik 64C

Bond; 2 Part; Liquid (Component B); Epoxy; 2-Part Cure;
A low cost, two component, non-silver, electrically conductive epoxy adhesive.;

SEC1233

Bond; 2 Part; Paste; Epoxy; Part A/Part B;
A silver filled, two component, room temperature curing epoxy adhesive. It provides excellent electrical conductivity useful in many electronic applications.;
Manufacturer: Resinlab
Substrate: 2024 T3 Al Abraded; Metals

SEC1222

Bond; 2 Part; Paste; Epoxy; 2-Part Cure;
A silver filled, two component, room temperature curing epoxy adhesive. It is designed to cure completely at room temperature.;
Manufacturer: Resinlab
Substrate: 2024 T3 Al Abraded; Various metals

XCE-3104MT

Bond; 1 Part; Paste; Epoxy; Heat;
A one component, thermosetting, electrically conductive adhesive that is a lead-free alternative to solder for surface mount device (SMD) interconnect formation. ;
Manufacturer: Henkel
Substrate: Aluminum Lead Frame; Gold (Au); Lead; Nickel; OSP-copper

9703

Bond; 1 Part; Transfer tape; Acrylic; Pressure Sensitive;
Electrically Conductive Adhesive • Pressure sensitive adhesive • electrically conductive and offers good adhesion to common PCB substrates such as copper, gold, FR-4 epoxy, DuPont™ Kapton™ polyimide and polyester films • ;
Manufacturer: 3M
Substrate: Aluminum; Copper; FR-4 epoxy; Gold; Metals; polyimide; Stainless Steel

TF E2213F

Bond; 1 Part; B-Staged Film; Epoxy; Heat;
A high performance electrically conductive B-staged film adhesive specially formulated for bonding to gold or gold plated substrates. ;
Manufacturer: Resin Designs
Substrate: Aluminum; Gold, Gold plated substrates; Nickel

Threadlocking Varnish

Bond; 1 Part; Liquid; Solvent-based; Solvent;
Threadlocking Varnish is a solvent-based, fast drying securing and marking varnish with good adhesion to many materials.;
Manufacturer: WEICON
Substrate: Screw M10

Comprehensive,
Quality Database

Gluespec's goal is to help you build better products by curating a comprehensive and quality-tested database of adhesive materials. Your research goals demand that Gluespec does not limit the number of manufacturers or materials in its database. Data is quality-checked and updated as needed when new data sheets or key specs are released.

Bond

2 Part

Liquid (Comp. B)

;

Paste (Comp. A)

Aluminum

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Bond

2 Part

Thixotropic Paste (Adhesive)

Aluminum

;

Ceramics

;

Glass

;

Metals

;

Plastics

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Bond

2 Part

Liquid

Ceramics

;

Concrete

;

Fabricating materials

;

Metals

;

Rigid plastics

;

Rubber

;

Wood

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Bond

2 Part

Liquid (Component B)

;

Paste (Component A)

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Bond

2 Part

Paste

2024 T3 Al Abraded

;

Metals

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Bond

2 Part

Paste

2024 T3 Al Abraded

;

Various metals

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Bond

;

Mask stencil

1 Part

Paste

Aluminum Lead Frame

;

Gold (Au)

;

Lead

;

Nickel

;

OSP-copper

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Bond

;

EMI/RFI shield

;

EMI/RFI shield

;

Gaskets

1 Part

Transfer tape

Aluminum

;

Copper

;

FR-4 epoxy

;

Gold

;

Metals

;

polyimide

;

Stainless Steel

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Bond

;

EMI/RFI grounding

;

EMI/RFI grounding

1 Part

B-Staged Film

Aluminum

;

Gold, Gold plated substrates

;

Nickel

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Bond

;

Seal

;

Threadlocking

;

Varnish

1 Part

Liquid

Screw M10

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