Exhibits good moisture and chemical resistance and is suitable for use at intermediate “in service” temperatures up to 225ºF. Because of its low shrinkage and low exotherm, it can be used as a potting compound where glass and strain sensitive elements are being potted.;
A general purpose adhesive, combines low toxicity with good physical properties. This two-part adhesive has a non-critical mixing ratio with 1:1 used most frequently. The mix ratio can be varied to obtain a more flexible or more rigid bond by increasing or decreasing respectively, the concentration of Part B.;
It is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited for applications where medium to high dispense speeds, high dot profile, high wet strength and good electrical characteristics are required.;
One part thixotropic, heat curing epoxy adhesives. It can also be used as a small mass potting compounds, staking or damming adhesives, or polymer systems where the application requires low shrinkage and excellent adhesion to a wide variety of plastics, metals and circuit board materials. ;
2024 T3 Al Abraded / MEK Wipe; Metal; Plastic
An off-white, versatile, filled paste resin that has low coefficient of thermal expansion making it ideal for bonding porcelain, glass and ceramics. Exhibits excellent wetting properties and provides strong bonds to rigid materials. Versatility is achieved by selecting one of four recommended activators. Non-metallic oxide fillers provide excellent electrical insulation properties.;
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