3M 1469

Surface Preparation

A thoroughly cleaned, dry, grease free surface is essential for optimum performance. Cleaning methods which will produce a break free water film on metal surfaces are generally satisfactory. Surface preparations should be fully evaluated with the adhesive, especially if the need for resistance to specific environments is anticipated.

See Vendor Technical Data Sheet for more info.

Application

3M™ Scotch-Weld™ Epoxy Adhesive EC-1469 can be applied by a spatula, knife coating, notched trowel, or by extruding into place. Standard equipment is available which allows pumping directly from five-gallon pails. When extruded through a Pyles-Semco cartridge (3/32" orifice 55 psi line pressure), the delivery rate at 72°F (22°C) is approximately 40 grams/ minute. A lower viscosity for ease of application can be obtained by warming Scotch-Weld EC-1469 to 100-120°F (38-49°C). Note: Scotch-Weld EC-1469 may start to thicken if held at 120°F (49°C) for more than 3 hours.

Curing

Flow and Cure Initiation Temperatures: Normal flow and cure initiation temperatures for 3M™ Scotch-Weld™ Epoxy Adhesive EC-1469 are as follows: Flow Temperature: 60°F (16°C), Cure Initiation Temperature: 280-300°F (138-149°C)

Cure Pressure: The only pressure needed during the cure of Scotch-Weld EC-1469 is that required to keep parts in alignment and to overcome distortion and thermal expansion in the adherends.

Cure Temperature: The cure temperature may be varied from 300°F to 450°F (149°C to 232°C), depending on the materials being bonded, equipment available and bond properties desired. Scotch-Weld EC-1469 will wet the surface to which it has been applied. Heating at temperatures above 300°F (149°C) will chemically convert the adhesive into a high strength solvent-resistant bond. Cure temperatures in excess of 400°F (204°C) yield useful, but lower than optimum strengths. At these temperatures the time cycle must be determined for specific application. Bond line temperature rise rates from 2°F to 200°F (-17°C to 93°C) per minute can be used without affecting strength properties. Curing ovens must be vented to the outdoors.

Caution: Large volumes of Scotch-Weld EC-1469, if heated rapidly at temperatures above 300°F (149°C), will exotherm and char. This will generally occur if an adhesive thickness of greater than 1/8" thick is cured.

Cure Time: Cure time depends on the cure temperature used, methods of heat application, production limitations and bond properties required. Since no two bonding operations are exactly alike, it is suggested that a few simple experiments be conducted, varying both temperature and cure time to determine optimum conditions for the particular application.

Clean-Up

Excess adhesive and equipment may be cleaned up, prior to curing, with ketone* type solvent.

*Note: When using solvents, extinguish all ignition sources, including pilot lights, and follow manufacturer’s precautions and directions for use.