3M 2086 Datasheet 3M 2086

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  • Description for 3M 2086

    350°F curing similar to 1386 but filled flow control

    *See Terms of Use Below

    Chemical Resistance Hydraulic Oil, Chemical Resistance: Fluid Resistance: Salt water, Salt spray, Chemical Resistance, White Gas
    Application Type Bond
    1 Part or 2 Part 1-Part
    Material Form Paste
    Substrate Etched Aluminum, Steel, Epoxy, Solvent Wiped cold rolled steel
    Manufacturer 3M
    Chemistry Epoxy, Epoxy: Modified Epoxy
    Cure Method Heat
    Cure Temperature (°C) 176 to 178
    Cure Time (min) 59 to 61
    Color Gray
    Creep Resistance Creep resistance
    High Temperature Resistance (°C) 177
    Low Temperature Resistance (°C) -55
    Volume Resistivity (O) 3.6e14 (ohms/cm)
    Density (g/cm³) 12 (weight (lbs/gal))

  • Technical Data for 3M 2086

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    Overview
    • Chemical Resistance
      • Chemical Resistance : Fluid Resistance : Water Resistance - Salt water
      • Chemical Resistance - Hydraulic Oil, Salt spray, White Gas
    • Application Type
    • 1 Part or 2 Part
      • 1-Part
    • Material Form
      • Paste
    • Substrate
      • Aluminum - Etched Aluminum
      • Steel - Solvent Wiped cold rolled steel
      • Epoxy
    • Chemistry
    • Cure Method
      • Heat
    • Color
      • Gray
    Specifications
    Cure Specs
    Cure Temperature (°C) 176 to 178
    Cure Time (min) 59 to 61
    Bond Strength
    Structural/Load-Bearing Structural
    General Bond Strength (psi) High
    Peel Strength (piw) High, 50 Test Method
    Shear Strength (psi) 5,500, 5,500, 5,300, 4,300, 3,500, 3,000, 5,000, 5,000, 2,200, 500, 3,340, 2,700, 2,360, 480, 130 Test Method
    Material Resistance
    Creep Resistance Creep resistance
    Environmental Resistance 100% relative humidity, Environmental resistance
    High Temperature Resistance (°C) 177
    Low Temperature Resistance (°C) -55
    Moisture/Humidity Resistance Moisture/humidity resistance
    Conductivity
    Dissipation Factor 0.01600, 0.22800 Test Method
    Filler Filled
    Dielectric Strength (V/mil) 123 Test Method
    Dielectric Constant 10.80, 11.40 Test Method
    Volume Resistivity (O) 3.6e14 (ohms/cm) Test Method
    Other Properties
    Coefficient of Thermal Expansion (CTE) 47e-6 (in./ in/°C) Test Method
    % Solids (%) 100
    Density (g/cm³) 12 (weight (lbs/gal))
    Business Information
    Shelf Life Details Refrigerated storage at 40°F (4°C) or below is suggested for optimum storage life. If 3M™ Scotch-Weld™ Structural Adhesive EC-2086 is refrigerated, it should be permitted to thoroughly warm to room temperature before opening in order to prevent moisture condensation of the adhesive surface. Rotate stock on a “first in – first out” basis.
    Shelf Life Temperature (°F) <40

  • Best Practices for 3M 2086

    *See Terms of Use Below

    1. Application

      EC-2086 can be applied by a spatula, knife coat, notched trowel, or by extruding into place. Standard equipment is available which allows pumping directly from five-gallon pails.

    2. Curing

      The only pressure needed during the cure of EC-2086 is that required to keep parts in alignment and to overcome distortion and thermal expansion in the adherends.

      The cure temperature may be varied from 330°F to 500°F (165°C to 260°C), depending on the materials being bonded, equipment available and bond properties desired. EC-2086 will wet the surface to which it has been applied. Heating at temperatures above 325°F (163°C) will chemically convert the adhesive into a high strength solvent-resistant bond.

      Cure time depends on the cure temperatures used, methods of heat application, production limitations and bond properties required. Since no two bonding operations are exactly alike, it is suggested that a few simple experiments be conducted, varying both temperature and cure time to determine optimum conditions for the particular application. Figure 1 is a guide from which an approximate cure cycle can be taken for various cure times or temperatures.

    3. Clean-Up

      Excess adhesive and equipment may be cleaned up, prior to curing, with Ketone type solvents.*

      *Note: When using solvents, extinguish all ignition sources and follow the manufacturer’s precautions and directions for use.

  • Comparable Materials for 3M 2086

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    Spec Engine® Results

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Peel Strength Test Methods
Peel Strength Type Cure Time Cure Temperature Substrate Test Temperature Test Method
High
50 piw T-peel strength 1.00 min 232°C Wiped Steel 24°C Cure Cycle: 1 minute @ 450°F (232°C), 50 psi.
Shear Strength Test Methods
Shear Strength Type Cure Time Cure Temperature Substrate Test Temperature Test Method
5,500 psi Overlap shear strength 40 to 60 min 24°C 177°C
5,500 psi Overlap shear strength 20 to 30 min 24°C 191°C
5,300 psi Overlap shear strength 15 to 20 min 24°C 204°C
4,300 psi Overlap shear strength 10 to 15 min 24°C 218°C
3,500 psi Overlap shear strength 5.00 to 7 min 24°C 232°C
3,000 psi Overlap shear strength 60 min 177°C Etched Aluminum -55°C Cure Cycle: 1 hour @ 350°F (177°C), 25 psi.
5,000 psi Overlap shear strength 60 min 177°C Etched Aluminum 24°C Cure Cycle: 1 hour @ 350°F (177°C), 25 psi.
5,000 psi Overlap shear strength 60 min 177°C Etched Aluminum 82°C Cure Cycle: 1 hour @ 350°F (177°C), 25 psi.
2,200 psi Overlap shear strength 60 min 177°C Etched Aluminum 121°C Cure Cycle: 1 hour @ 350°F (177°C), 25 psi.
500 psi Overlap shear strength 60 min 177°C Etched Aluminum 177°C Cure Cycle: 1 hour @ 350°F (177°C), 25 psi.
3,340 psi Overlap shear strength 1.00 min 232°C Solvent Wiped cold rolled steel -40°C Cure Cycle: 1 minute @ 450°F (232°C), 50 psi.
2,700 psi Overlap shear strength 1.00 min 232°C Solvent Wiped cold rolled steel 24°C Cure Cycle: 1 minute @ 450°F (232°C), 50 psi.
2,360 psi Overlap shear strength 1.00 min 232°C Solvent Wiped cold rolled steel 82°C Cure Cycle: 1 minute @ 450°F (232°C), 50 psi.
480 psi Overlap shear strength 1.00 min 232°C Solvent Wiped cold rolled steel 121°C Cure Cycle: 1 minute @ 450°F (232°C), 50 psi.
130 psi Overlap shear strength 1.00 min 232°C Solvent Wiped cold rolled steel 177°C Cure Cycle: 1 minute @ 450°F (232°C), 50 psi.
Dielectric Constant Test Methods
Dielectric Constant Temperature
10.80 23°C
11.40 60°C
Dielectric Strength Test Methods
Dielectric Strength Temperature
123 V/mil 23°C
Dissipation Factor Test Methods
Dissipation Factor Temperature
0.01600 23°C
0.22800 60°C
Volume Resistivity Test Methods
Volume Resistivity Temp (°C) Test Method
3.6e14 (ohms/cm) 23°C 500 Volts DC
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Temperature (°C)
47e-6 (in./ in/°C) -18 to 27°C