| Application Type | Bond |
|---|---|
| 1 Part or 2 Part | 1 Part |
| Material Form | Paste |
| Substrate | Etched Aluminum, Steel, Solvent Wiped cold rolled steel |
| Manufacturer | 3M |
| Chemistry | Epoxy, Modified Epoxy |
| Cure Method | Heat |
| Cure Temperature (°C) | 176 to 178 |
| Cure Time (min) | 59 to 61 |
| Color | Gray |
| Chemical Resistance | Hydraulic Oil, Salt spray, salt water, White Gas, Chemical Resistance |
| High Temperature Resistance (°C) | 177 |
| Low Temperature Resistance (°C) | -55 |
| Other Resistance | Creep resistance |
| Density (g/cm³) | 12 (weight (lbs/gal)) |
EC-2086 can be applied by a spatula, knife coat, notched trowel, or by extruding into place. Standard equipment is available which allows pumping directly from five-gallon pails.
The only pressure needed during the cure of EC-2086 is that required to keep parts in alignment and to overcome distortion and thermal expansion in the adherends.
The cure temperature may be varied from 330°F to 500°F (165°C to 260°C), depending on the materials being bonded, equipment available and bond properties desired. EC-2086 will wet the surface to which it has been applied. Heating at temperatures above 325°F (163°C) will chemically convert the adhesive into a high strength solvent-resistant bond.
Cure time depends on the cure temperatures used, methods of heat application, production limitations and bond properties required. Since no two bonding operations are exactly alike, it is suggested that a few simple experiments be conducted, varying both temperature and cure time to determine optimum conditions for the particular application. Figure 1 is a guide from which an approximate cure cycle can be taken for various cure times or temperatures.
Excess adhesive and equipment may be cleaned up, prior to curing, with Ketone type solvents.*
*Note: When using solvents, extinguish all ignition sources and follow the manufacturer’s precautions and directions for use.
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| Shear Strength | Type | Cure Time | Cure Temperature | Substrate | Test Temperature | Test Method |
|---|---|---|---|---|---|---|
| 5,500 psi | Overlap shear strength | 40 to 60 min | 24°C | 177°C | ||
| 5,500 psi | Overlap shear strength | 20 to 30 min | 24°C | 191°C | ||
| 5,300 psi | Overlap shear strength | 15 to 20 min | 24°C | 204°C | ||
| 4,300 psi | Overlap shear strength | 10 to 15 min | 24°C | 218°C | ||
| 3,500 psi | Overlap shear strength | 5.00 to 7 min | 24°C | 232°C | ||
| 3,000 psi | Overlap shear strength | 60 min | 177°C | Etched Aluminum | -55°C | Cure Cycle: 1 hour @ 350°F (177°C), 25 psi. |
| 5,000 psi | Overlap shear strength | 60 min | 177°C | Etched Aluminum | 24°C | Cure Cycle: 1 hour @ 350°F (177°C), 25 psi. |
| 5,000 psi | Overlap shear strength | 60 min | 177°C | Etched Aluminum | 82°C | Cure Cycle: 1 hour @ 350°F (177°C), 25 psi. |
| 2,200 psi | Overlap shear strength | 60 min | 177°C | Etched Aluminum | 121°C | Cure Cycle: 1 hour @ 350°F (177°C), 25 psi. |
| 500 psi | Overlap shear strength | 60 min | 177°C | Etched Aluminum | 177°C | Cure Cycle: 1 hour @ 350°F (177°C), 25 psi. |
| 3,340 psi | Overlap shear strength | 1.00 min | 232°C | Solvent Wiped cold rolled steel | -40°C | Cure Cycle: 1 minute @ 450°F (232°C), 50 psi. |
| 2,700 psi | Overlap shear strength | 1.00 min | 232°C | Solvent Wiped cold rolled steel | 24°C | Cure Cycle: 1 minute @ 450°F (232°C), 50 psi. |
| 2,360 psi | Overlap shear strength | 1.00 min | 232°C | Solvent Wiped cold rolled steel | 82°C | Cure Cycle: 1 minute @ 450°F (232°C), 50 psi. |
| 480 psi | Overlap shear strength | 1.00 min | 232°C | Solvent Wiped cold rolled steel | 121°C | Cure Cycle: 1 minute @ 450°F (232°C), 50 psi. |
| 130 psi | Overlap shear strength | 1.00 min | 232°C | Solvent Wiped cold rolled steel | 177°C | Cure Cycle: 1 minute @ 450°F (232°C), 50 psi. |
| Peel Strength | Type | Cure Time | Cure Temperature | Substrate | Test Temperature | Test Method |
|---|---|---|---|---|---|---|
| High | ||||||
| 50 piw | T-peel strength | 1.00 min | 232°C | Wiped Steel | 24°C | Cure Cycle: 1 minute @ 450°F (232°C), 50 psi. |
| Dielectric Constant | Temperature |
|---|---|
| 10.80 | 23°C |
| 11.40 | 60°C |
| Dielectric Strength | Temperature |
|---|---|
| 123 V/mil | 23°C |
| Dissipation Factor | Temperature |
|---|---|
| 0.01600 | 23°C |
| 0.22800 | 60°C |
| Volume Resistivity | Temp (°C) | Test Method |
|---|---|---|
| 3.6e14 (ohms/cm) | 23°C | 500 Volts DC |
| Coefficient of Thermal Expansion (CTE) | CTE Temperature (°C) |
|---|---|
| 47e-6 (in./ in/°C) | -18 to 27°C |
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