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Description for 3M 2086
350°F curing similar to 1386 but filled flow controlChemical Resistance Hydraulic Oil, Chemical Resistance: Fluid Resistance: Salt water, Salt spray, Chemical Resistance, White Gas Application Type Bond 1 Part or 2 Part 1-Part Material Form Paste Substrate Etched Aluminum, Steel, Epoxy, Solvent Wiped cold rolled steel Manufacturer 3M Chemistry Epoxy, Epoxy: Modified Epoxy Cure Method Heat Cure Temperature (°C) 176 to 178 Cure Time (min) 59 to 61 Color Gray Creep Resistance Creep resistance High Temperature Resistance (°C) 177 Low Temperature Resistance (°C) -55 Volume Resistivity (O) 3.6e14 (ohms/cm) Density (g/cm³) 12 (weight (lbs/gal)) -
Technical Data for 3M 2086
Overview
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Chemical Resistance
- Chemical Resistance : Fluid Resistance : Water Resistance - Salt water
- Chemical Resistance - Hydraulic Oil, Salt spray, White Gas
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Application Type
- Adhesive - Bond
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1 Part or 2 Part
- 1-Part
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Material Form
- Paste
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Cure Method
- Heat
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Color
- Gray
Specifications
Cure Specs
Cure Temperature (°C) 176 to 178 Cure Time (min) 59 to 61 Bond Strength
Structural/Load-Bearing Structural General Bond Strength (psi) High Peel Strength (piw) High, 50 Test Method Shear Strength (psi) 5,500, 5,500, 5,300, 4,300, 3,500, 3,000, 5,000, 5,000, 2,200, 500, 3,340, 2,700, 2,360, 480, 130 Test Method Material Resistance
Creep Resistance Creep resistance Environmental Resistance 100% relative humidity, Environmental resistance High Temperature Resistance (°C) 177 Low Temperature Resistance (°C) -55 Moisture/Humidity Resistance Moisture/humidity resistance Conductivity
Dissipation Factor 0.01600, 0.22800 Test Method Filler Filled Dielectric Strength (V/mil) 123 Test Method Dielectric Constant 10.80, 11.40 Test Method Volume Resistivity (O) 3.6e14 (ohms/cm) Test Method Other Properties
Coefficient of Thermal Expansion (CTE) 47e-6 (in./ in/°C) Test Method % Solids (%) 100 Density (g/cm³) 12 (weight (lbs/gal)) Business Information
Shelf Life Details Refrigerated storage at 40°F (4°C) or below is suggested for optimum storage life. If 3M™ Scotch-Weld™ Structural Adhesive EC-2086 is refrigerated, it should be permitted to thoroughly warm to room temperature before opening in order to prevent moisture condensation of the adhesive surface. Rotate stock on a “first in – first out” basis. Shelf Life Temperature (°F) <40 -
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Best Practices for 3M 2086
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Application
EC-2086 can be applied by a spatula, knife coat, notched trowel, or by extruding into place. Standard equipment is available which allows pumping directly from five-gallon pails.
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Curing
The only pressure needed during the cure of EC-2086 is that required to keep parts in alignment and to overcome distortion and thermal expansion in the adherends.
The cure temperature may be varied from 330°F to 500°F (165°C to 260°C), depending on the materials being bonded, equipment available and bond properties desired. EC-2086 will wet the surface to which it has been applied. Heating at temperatures above 325°F (163°C) will chemically convert the adhesive into a high strength solvent-resistant bond.
Cure time depends on the cure temperatures used, methods of heat application, production limitations and bond properties required. Since no two bonding operations are exactly alike, it is suggested that a few simple experiments be conducted, varying both temperature and cure time to determine optimum conditions for the particular application. Figure 1 is a guide from which an approximate cure cycle can be taken for various cure times or temperatures.
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Clean-Up
Excess adhesive and equipment may be cleaned up, prior to curing, with Ketone type solvents.*
*Note: When using solvents, extinguish all ignition sources and follow the manufacturer’s precautions and directions for use.
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Comparable Materials for 3M 2086
Spec Engine® Results
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Peel Strength Test Methods
Peel Strength | Type | Cure Time | Cure Temperature | Substrate | Test Temperature | Test Method |
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High | ||||||
50 piw | T-peel strength | 1.00 min | 232°C | Wiped Steel | 24°C | Cure Cycle: 1 minute @ 450°F (232°C), 50 psi. |
Shear Strength Test Methods
Shear Strength | Type | Cure Time | Cure Temperature | Substrate | Test Temperature | Test Method |
---|---|---|---|---|---|---|
5,500 psi | Overlap shear strength | 40 to 60 min | 24°C | 177°C | ||
5,500 psi | Overlap shear strength | 20 to 30 min | 24°C | 191°C | ||
5,300 psi | Overlap shear strength | 15 to 20 min | 24°C | 204°C | ||
4,300 psi | Overlap shear strength | 10 to 15 min | 24°C | 218°C | ||
3,500 psi | Overlap shear strength | 5.00 to 7 min | 24°C | 232°C | ||
3,000 psi | Overlap shear strength | 60 min | 177°C | Etched Aluminum | -55°C | Cure Cycle: 1 hour @ 350°F (177°C), 25 psi. |
5,000 psi | Overlap shear strength | 60 min | 177°C | Etched Aluminum | 24°C | Cure Cycle: 1 hour @ 350°F (177°C), 25 psi. |
5,000 psi | Overlap shear strength | 60 min | 177°C | Etched Aluminum | 82°C | Cure Cycle: 1 hour @ 350°F (177°C), 25 psi. |
2,200 psi | Overlap shear strength | 60 min | 177°C | Etched Aluminum | 121°C | Cure Cycle: 1 hour @ 350°F (177°C), 25 psi. |
500 psi | Overlap shear strength | 60 min | 177°C | Etched Aluminum | 177°C | Cure Cycle: 1 hour @ 350°F (177°C), 25 psi. |
3,340 psi | Overlap shear strength | 1.00 min | 232°C | Solvent Wiped cold rolled steel | -40°C | Cure Cycle: 1 minute @ 450°F (232°C), 50 psi. |
2,700 psi | Overlap shear strength | 1.00 min | 232°C | Solvent Wiped cold rolled steel | 24°C | Cure Cycle: 1 minute @ 450°F (232°C), 50 psi. |
2,360 psi | Overlap shear strength | 1.00 min | 232°C | Solvent Wiped cold rolled steel | 82°C | Cure Cycle: 1 minute @ 450°F (232°C), 50 psi. |
480 psi | Overlap shear strength | 1.00 min | 232°C | Solvent Wiped cold rolled steel | 121°C | Cure Cycle: 1 minute @ 450°F (232°C), 50 psi. |
130 psi | Overlap shear strength | 1.00 min | 232°C | Solvent Wiped cold rolled steel | 177°C | Cure Cycle: 1 minute @ 450°F (232°C), 50 psi. |
Dielectric Constant Test Methods
Dielectric Constant | Temperature |
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10.80 | 23°C |
11.40 | 60°C |
Dielectric Strength Test Methods
Dielectric Strength | Temperature |
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123 V/mil | 23°C |
Dissipation Factor Test Methods
Dissipation Factor | Temperature |
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0.01600 | 23°C |
0.22800 | 60°C |
Volume Resistivity Test Methods
Volume Resistivity | Temp (°C) | Test Method |
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3.6e14 (ohms/cm) | 23°C | 500 Volts DC |
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) | CTE Temperature (°C) |
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47e-6 (in./ in/°C) | -18 to 27°C |