• Description for 3M 2158 B/A

    Long worklife rigid epoxy • 8-12 hrs. handling strength • General purpose

    *See Terms of Use Below

    Chemical Resistance Air, Salt spray, Tap Water
    Application Type Bond
    1 Part or 2 Part 2-Part
    Material Form Liquid
    Substrate Aluminum FPL Etch, Glass, Metal, Plastic, Rubber, Steel, Wood, Concrete, Epoxy
    Manufacturer 3M
    Chemistry Epoxy, Synthetic Resin, Epoxy: Modified Epoxy
    Cure Method Base/Accelerator
    Cure Temperature (°C) 20 to 25 Room Temperature, 24, 24, 49, 93
    Cure Time (min) 10,080, 10,080, 120, 30
    Viscosity (cPs) 375,000
    Color Gray
    Aging Resistance Aging resistance
    High Temperature Resistance (°C) 82
    Low Temperature Resistance (°C) -55
    Volume Resistivity (O) 1.4e15 (ohms/cm)
    Density (g/cm³) 12.8 to 13.2 (weight (lbs/gal)), 12.4 to 13.2 (weight (lbs/gal))
  • Technical Data for 3M 2158 B/A

    Overview
    • Chemical Resistance
      • Chemical Resistance - Air, Salt spray, Tap Water
    • Application Type
    • 1 Part or 2 Part
      • 2-Part
    • Material Form
      • Liquid
    • Substrate
    • Chemistry
      • Epoxy
      • Epoxy : Modified Epoxy
      • Other - Synthetic Resin
    • Cure Method
      • 2-Part Cure - Base/Accelerator
    • Color
      • Gray
    Specifications
    Cure Specs
    Cure Temperature (°C) 20 to 25 Room Temperature, 24, 24, 49, 93 Test Method
    Cure Time (min) 10,080, 10,080, 120, 30 Test Method
    Viscosity (cPs) 375,000 Test Method
    Fixture or Handling Strength Time (min) 480 to 720 Test Method
    Work / Pot Time (min) 120, Long Test Method
    Mix Ratio 1:1 (by volume), 1:1 (by weight)
    Bond Strength
    Structural/Load-Bearing Structural
    General Bond Strength (psi) High
    Peel Strength (piw) 3 Test Method
    Shear Strength (psi) 1,500, 2,000, 400 Test Method
    Material Resistance
    Aging Resistance Aging resistance
    Environmental Resistance Excellent
    High Temperature Resistance (°C) 82
    Low Temperature Resistance (°C) -55
    Moisture/Humidity Resistance Moisture/humidity resistance
    Conductivity
    Dissipation Factor 0.01900 Test Method
    Dielectric Strength (V/mil) 980 Test Method
    Dielectric Constant 5.60 Test Method
    Thermal Conductivity (W/m°K) 0.49
    Volume Resistivity (O) 1.4e15 (ohms/cm) Test Method
    Hardness
    Shore D Hardness 85 Test Method
    Flexibility Rigid
    Other Properties
    Glass Transition Temp (Tg) (°C) 52
    Coefficient of Thermal Expansion (CTE) 53e-6 (in./ in/°C), 135e-6 (in./ in/°C) Test Method
    Density (g/cm³) 12.8 to 13.2 (weight (lbs/gal)), 12.4 to 13.2 (weight (lbs/gal))
    Business Information
    Shelf Life Details Store product at 60-80°F (15-27°C) for maximum storage life.;3M™ Scotch-Weld™ Epoxy Adhesive 2158 B/A has a storage life of two years in unopened containers. Rotate stock on a “first in-first out” basis.
    Shelf Life Temperature (°F) 59 to 81
    Shelf Life (mon) 24
  • Best Practices for 3M 2158 B/A

    *See Terms of Use Below

    1. Surface Preparation

      For high strength structural bonds, paint, oxide films, oils, dust, mold release agents and all other surface contaminants must be completely removed. The amount of surface preparation depends on the required bond strength and the environmental aging resistance desired by the user.

      See vendor Technical Data Sheet for more information.

    2. Application

      Use gloves to minimize skin contact with adhesive.

      Application to the substrates should be made within 120 minutes. Larger quantities and/or higher temperatures will reduce this working time.

      Join the adhesive coated surfaces and allow to cure at 60°F (16°C) or above until firm. Heat, up to 200°F (93°C), will speed curing.

      Keep parts from moving until handling strength is reached. Contact pressure is necessary. Maximum shear strength is obtained with a 3-5 mil bond line.

    3. Mixing

      This product consists of two parts. Mix thoroughly by weight or volume in the proportions specified in the Uncured Properties Section. Mix approximately 15 seconds after a uniform color is obtained.

    4. Clean-Up

      Excess uncured adhesive can be cleaned up with ketone type solvents.*

      *Note: When using solvents, extinguish all ignition sources, including pilot lights, and follow manufacturer’s precautions and directions for use.

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    *See Terms of Use Below

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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
20 to 25°C Room Temperature
24°C
24°C
49°C
93°C
Cure Time Test Methods
Cure Time Test Method
10,080 min
10,080 min
120 min
30 min
Fixture or Handling Strength Time Test Methods
Fixture or Handling Strength Time Fixture-Handling Strength Test Method Fixture-Handling Strength Time Temperature
480 to 720 min Cured 24°C
Viscosity Test Methods
Viscosity Temperature
375,000 cPs 24°C
Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
120 min Approximate time for a 100 gram quantity @ 75°F [24°C] 24°C
Long
Peel Strength Test Methods
Peel Strength Type Substrate Test Temperature Test Method
3 piw T-Peel Strength Aluminum FPL Etch 24°C ASTM D-1876-61T
Shear Strength Test Methods
Shear Strength Type Substrate Test Temperature Test Method
1,500 psi Overlap shear strength Aluminum FPL Etch -55°C ASTM D-1002-72
2,000 psi Overlap shear strength Aluminum FPL Etch 24°C ASTM D-1002-72
400 psi Overlap shear strength Aluminum FPL Etch 82°C ASTM D-1002-72
Dielectric Constant Test Methods
Dielectric Constant Temperature Test Method
5.60 23°C Dielectric constant, 1 KHz, Cured
Dielectric Strength Test Methods
Dielectric Strength Test Method
980 V/mil Cured
Dissipation Factor Test Methods
Dissipation Factor Temperature Test Method
0.01900 23°C Dissipation Factor, 1 KHz, Cured
Volume Resistivity Test Methods
Volume Resistivity Test Method
1.4e15 (ohms/cm) Cured
Shore D Hardness Test Methods
Shore D Hardness Shore Hardness Test Method
85 ASTM D-2240
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Temperature (°C)
53e-6 (in./ in/°C) -50 to 30°C
135e-6 (in./ in/°C) 70 to 130°C