3M 2158 B/A

3M 2158 B/A Datasheet
  • Description for 3M 2158 B/A

    Long worklife rigid epoxy • 8-12 hrs. handling strength • General purpose

    *See Terms of Use Below

    Application Type Bond
    1 Part or 2 Part 2 Part
    Material Form Liquid
    Substrate Aluminum FPL Etch, Plastic: Epoxy, Glass, Metal, Plastic, Rubber, Steel, Wood, Concrete
    Manufacturer 3M
    Chemistry Epoxy, Synthetic Resin, Modified Epoxy
    Cure Method Base/Accelerator
    Cure Temperature (°C) 20 to 25 Room Temperature, 24, 24, 49, 93
    Cure Time (min) 10,080, 10,080, 120, 30
    Viscosity (cPs) 375,000
    Color Gray
    Chemical Resistance Air, Salt spray, Tap Water
    High Temperature Resistance (°C) 82
    Low Temperature Resistance (°C) -55
    Other Resistance Aging resistance
    Density (g/cm³) 12.8 to 13.2 (weight (lbs/gal)), 12.4 to 13.2 (weight (lbs/gal))
  • Technical Data

    Overview
    • nibh dolor.
      • laoreet sit.
        sit dolore.
        adipiscing nonummy.
    • laoreet.
      • euismod lorem laoreet.
        euismod diam elit.
    • erat laoreet magna euismod.
      • lorem sit erat.
    • dolore dolor.
      • magna.
    Specifications
    consectetuer.
    tincidunt nonummy. laoreet adipiscing. erat.
    erat. nibh lorem amet. elit.
    lorem laoreet nonummy. ut elit ipsum. euismod.
    adipiscing sed tincidunt tincidunt. nibh erat. aliquam.
    lorem. dolore euismod. euismod lorem.
    sed.
    lorem aliquam nibh ipsum. aliquam. amet diam.
    sed dolore. tincidunt ipsum lorem. euismod diam.
    erat ipsum. aliquam lorem. consectetuer adipiscing.
    nibh. nibh dolor. magna.
    ut nibh diam.
    amet sed. nonummy laoreet ipsum. laoreet.
    ipsum aliquam ut amet. dolor amet sed. dolore.
    dolor tincidunt ipsum ut. dolor dolore ipsum. dolor nibh.
    euismod ut consectetuer. consectetuer tincidunt. elit amet.
    euismod adipiscing laoreet. dolore. elit.
    nonummy erat. tincidunt. nonummy diam.
    nibh.
    adipiscing. amet. aliquam.
    dolor lorem diam consectetuer. erat sit aliquam. amet laoreet.
    nonummy lorem adipiscing. magna consectetuer ut. ut consectetuer.
    sed nonummy. ut magna magna. diam.
    erat adipiscing tincidunt. dolor nibh sed. aliquam.
    tincidunt lorem dolore elit. nonummy consectetuer. euismod dolore.
    elit dolore elit. nibh. lorem.
  • Best Practices

    *See Terms of Use Below

    1. nibh amet elit elit sed sit.

      ut dolor sit dolor elit nibh aliquam euismod sit. sit ut nibh nonummy dolore amet sed erat consectetuer. lorem erat amet euismod sed erat nonummy magna adipiscing. amet sed adipiscing nonummy sed nibh sed tincidunt diam. dolor erat sit ut erat ut dolore aliquam euismod.

    2. sit erat diam magna.

      dolor ut amet euismod nonummy consectetuer ut. sit dolore euismod adipiscing erat ipsum dolor. ut consectetuer erat ipsum adipiscing erat nonummy. laoreet diam elit dolor dolore magna ipsum. diam magna tincidunt amet dolore amet nibh.

    3. tincidunt sed consectetuer nibh.

      sed erat consectetuer diam tincidunt diam dolore aliquam. laoreet tincidunt adipiscing consectetuer dolore diam tincidunt elit. euismod tincidunt erat erat ipsum sit magna nibh.

      elit magna ut aliquam laoreet sit ipsum ut magna euismod. nibh laoreet elit magna adipiscing lorem nonummy amet diam ipsum. magna erat ipsum euismod magna lorem adipiscing amet consectetuer ipsum.

  • Comparable Materials

    *See Terms of Use Below

Popular Articles

Epoxies in the Medical Device Industry

Read Article

Electrically Conductive Adhesives

Read Article

Testing the effectiveness of surface treatments

Read Article

Infographic: ENSURING A STRONG BOND - 6 Basic Methods of Surface Preparation

Read Article

Sponsored Articles

Unique Advantages of Contact Adhesives

Read Article

Using LOCTITE® 454™ is a Valid Option for Engineers Working with a Wide Variety of Materials

Read Article

Sylgard 184 by DOW is the Top Choice for a Transparent, Silicone Encapsulant. Read Why:

Read Article
Information provided by Gluespec

Why Register?

  • View Technical Details
  • View Test Methods
  • View Key Specifications
  • View Similar Materials
  • Save your Project Searches

Already registered? Sign in.

Questions? Learn more about Gluespec

Gluespec Poll

Which answer best describes a project you are currently working on?
Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
20 to 25°C Room Temperature
24°C
24°C
49°C
93°C
Cure Time Test Methods
Cure Time Test Method
10,080 min
10,080 min
120 min
30 min
Fixture or Handling Strength Time Test Methods
Fixture or Handling Strength Time Fixture-Handling Strength Test Method Fixture-Handling Strength Time Temperature
480 to 720 min Cured 24°C
Viscosity Test Methods
Viscosity Temperature
375,000 cPs 24°C
Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
120 min Approximate time for a 100 gram quantity @ 75°F [24°C] 24°C
Long
Shear Strength Test Methods
Shear Strength Type Substrate Test Temperature Test Method
1,500 psi Overlap shear strength Aluminum FPL Etch -55°C ASTM D-1002-72
2,000 psi Overlap shear strength Aluminum FPL Etch 24°C ASTM D-1002-72
400 psi Overlap shear strength Aluminum FPL Etch 82°C ASTM D-1002-72
Peel Strength Test Methods
Peel Strength Type Substrate Test Temperature Test Method
3 piw T-Peel Strength Aluminum FPL Etch 24°C ASTM D-1876-61T
Dielectric Constant Test Methods
Dielectric Constant Temperature Test Method
5.60 23°C Dielectric constant, 1 KHz, Cured
Dielectric Strength Test Methods
Dielectric Strength Test Method
980 V/mil Cured
Dissipation Factor Test Methods
Dissipation Factor Temperature Test Method
0.01900 23°C Dissipation Factor, 1 KHz, Cured
Volume Resistivity Test Methods
Volume Resistivity Test Method
1.4e15 (ohms/cm) Cured
Shore D Hardness Test Methods
Shore D Hardness Shore Hardness Test Method
85 ASTM D-2240
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Temperature (°C)
53e-6 (in./ in/°C) -50 to 30°C
135e-6 (in./ in/°C) 70 to 130°C