3M 3738

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Description for 3M 3738

High delivery rate and long bonding range • General purpose for foundry sand cores, wood bonding, corrugated, selected plastics and chipboard

Application Type	Bond, Seal
1 Part or 2 Part	1 Part
Material Form	Stick, Pellets
Substrate	Fabric, ABS, Plastic: PolyEthylene, Plastic: Polystyrene Foam, Rigid Vinyl, Polycarbonate, Uncoated Cardboard, Plain and coated corrugated, FRP, Plastic, Wood, Paper, Polyolefins, Uncoated Chipboard, Many plastics, Chipboard, Douglas fir
Industry	Core
Manufacturer	3M
Chemistry	Jet melt, Hot melt
Cure Method	Hot melt
Viscosity (cPs)	2,875
Color	Tan
High Temperature Resistance (°C)	54
Density (g/cm³)	0.950
Key Specifications	FDA (U.S. Food & Drug Administration) and/or CFIA (Canadian Food Inspection Agency): Applicable 21 CFR 175.105, UL 94 - V2

Surface Preparation

Surfaces must be clean, dry and dust free. Wipe with a solvent such as isopropyl alcohol for plastic substrates to aid in removing oil and dirt.
Application

3M™ Hot Melt Adhesives are designed for application with a 3M™ Hot Melt Applicators. Read and follow the precautions and directions for use in the user’s manual before operating the applicator. 3M™ Hot Melt Adhesives are applied at 350-385°F, except the Low Melt (LM) series which are designed to be applied at 250-275°F. LM series are adhesives designed for lower temperature application but still yield long-lasting bonds. Extruded bead sizes can be customized using 3M™ applicator tips.

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