• Description for 3M 3738

    High delivery rate and long bonding range • General purpose for foundry sand cores, wood bonding, corrugated, selected plastics and chipboard

    *See Terms of Use Below

    Manufacturer 3M
    Application Type Bond, Seal
    1 Part or 2 Part 1 Part
    Material Form Stick, Pellets
    Substrate Fabric, ABS, Uncoated Cardboard, FRP, Plastic, Wood, PolyEthylene, Uncoated Chipboard, Polyolefins, Chipboard, Polystyrene Foam, Douglas fir, Rigid Vinyl, Many plastics
    Chemistry Jet melt, Hot melt
    Cure Method Hot melt
    Viscosity (cPs) 2,875
    Color Tan
    High Temperature Resistance (°C) 54
    Key Specifications Applicable 21 CFR 175.105, UL 94 - V2
  • Technical Data

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  • Best Practices

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  • Comparable Materials

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Viscosity Test Methods
Viscosity Test Method Temperature
2,875 cPs Brookfield Thermosel Viscometer in Centipoise. 191°C
Work / Pot Time Test Methods
Work / Pot Time Test Method
0.83 min 1/8" semicircular bead, Douglas Fir to Douglas Fir.
Softening Point Test Methods
Softening Point Unit Test Method
86.0°C ASTM E-28-99
86.0°C ASTM E28-67
Shear Strength Test Methods
Shear Strength Substrate Test Temperature
375 psi Douglas Fir 22°C
Tensile Strength Test Methods
Tensile Strength Test Temperature
360 psi 22°C
Peel Strength Test Methods
Peel Strength Substrate Test Temperature
13 piw Canvas bonded to Douglas Fir 22°C
High Temperature Resistance Test Methods
High Temperature Resistance Test Method
54°C Highest temperature that the adhesive will support a 2 psi dead load
Flash Point Test Methods
Flash Point Test Method
550.4°F ASTM D 92-72