• Description for 3M 3748

    Good thermal shock resistance • Non-corrosive to copper for many electronic applications • Bonds polyolefins

    *See Terms of Use Below

    Application Type Bond
    1 Part or 2 Part 1 Part
    Material Form Sticks
    Substrate Acrylic, Ceramic, FRP, Copper, Fabric, Epoxy Glass FR-4, Carbon, Paper, ABS, Polycarbonate, Polypropylene, Corrugated, Plastic: Phenolic, Glass, Metal, Plastics, Polypropylene (High Density) , Douglas Fir, PolyEthylene, Uncoated Card Board, Polyolefins, Uncoated Chipboard, Polystyrene Foam, Coated Cardboard, Polyethylene (High Density) , Coated Chipboard
    Industry Conductors, Electronics: Printed circuit Boards, Electronics: Connectors, Electronics: Coil, Electrical, Electronics, Instruments, Solder, Bundle Wires
    Manufacturer 3M
    Chemistry Hot melt, Polyolefin
    Cure Method Hot melt
    Viscosity (cPs) 12,500, 6,500, 4,000, 5,000
    Color Off White
    High Temperature Resistance (°C) Good, Good thermal shock resistance, 79
    Key Specifications FDA (U.S. Food & Drug Administration) and/or CFIA (Canadian Food Inspection Agency): Applicable 21 CFR 175.105, UL 94 - V2
  • Technical Data

    Overview
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    Specifications
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  • Best Practices

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Softening Point Test Methods
Softening Point Unit Test Method
144°C ASTM E-28-99
145°C ASTM E-28-6-7; Ball & Ring Melt Point
144°C ASTM E28-67; Ball & Ring Melt Point
Viscosity Test Methods
Viscosity Test Method Temperature
12,500 cPs Brookfield Thermosel Viscometer. 160°C
6,500 cPs Brookfield Thermosel Viscometer. 180°C
4,000 cPs Brookfield Thermosel Viscometer. 200°C
5,000 cPs Brookfield Thermosel Viscometer in Centipoise. 191°C
Work / Pot Time Test Methods
Work / Pot Time Test Method
0.75 min 1/8" semicircular bead, Douglas Fir to Douglas Fir.
Peel Strength Test Methods
Peel Strength Type Substrate Test Method
High
45 piw 180° Peel strength Douglas Fir C-3168
43 piw 180° Peel strength Epoxy Glass FR-4 C-3168
35 piw 180° Peel strength Polyethylene (High Density) C-3168
35 piw 180° Peel strength Polypropylene (High Density) C-3168
45 piw 180° Peel strength ABS C-3168
18 piw Canvas to Douglas Fir
Tensile Strength Test Methods
Tensile Strength Test Temperature
2.6 (Mpa) 22°C
Shear Strength Test Methods
Shear Strength Type Substrate Test Method
235 to 240 psi Overlap shear strength Douglas Fir C-3096
200 to 210 psi Overlap shear strength Epoxy Glass FR-4 C-3096
233 psi Overlap shear strength Polyethylene (High Density) C-3096
221 to 260 psi Overlap shear strength Polypropylene (High Density) C-3096
220 to 270 psi Overlap shear strength ABS C-3096
250 psi Douglas Fir to Douglas Fir
High Temperature Resistance Test Methods
High Temperature Resistance Test Method
Good
79°C Temperature at which adhesive fails
Good thermal shock resistance
Dielectric Constant Test Methods
Dielectric Constant Temperature Test Method
2.30 23°C ASTM D 150, 1 KHz
Dielectric Strength Test Methods
Dielectric Strength Test Method
1,300 V/mil 1 KHz (ASTM D 149)
Dissipation Factor Test Methods
Dissipation Factor Temperature Test Method
0.00100 23°C ASTM D 150, 1 KHz
Volume Resistivity Test Methods
Volume Resistivity Test Method
7.0e17 (ohms/cm) (ASTM D 257) at 500 Volts