• Description for 3M 3748

    Good thermal shock resistance • Non-corrosive to copper for many electronic applications • Bonds polyolefins

    *See Terms of Use Below

    Application Type Bond
    1 Part or 2 Part 1 Part
    Material Form Sticks
    Substrate Acrylic, Ceramic, Copper, Epoxy, Epoxy Glass FR-4, Phenolic, Glass, Carbon, ABS, PolyEthylene, Polystyrene Foam, Polycarbonate, Polypropylene, Corrugated, Paper, Fabric, Flexible foam, FRP, Polyolefins, Metal, Plastics, Polyethylene (High Density) , Polypropylene (High Density) , Douglas Fir, Polystyrene Foam, Uncoated Card Board, Uncoated Chipboard, Coated Cardboard, Coated Chipboard
    Industry Coil, Conductors, Connectors, Printed circuit Boards, Electrical, Electronics, Instruments, Solder, Bundle Wires
    Manufacturer 3M
    Chemistry Hot melt
    Cure Method Hot melt
    Viscosity (cPs) 12,500, 6,500, 4,000, 5,000
    Color Off White
    High Temperature Resistance (°C) Good, 79, Good thermal shock resistance
    Durability Tough
    Key Specifications FDA (U.S. Food & Drug Administration) and/or CFIA (Canadian Food Inspection Agency): Applicable 21 CFR 175.105, UL 94 - V2
  • Technical Data for 3M 3748

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 1 Part
    • Material Form
      • Stick - Sticks
    • Substrate
      • Ceramic
      • Foam - Flexible foam, Polystyrene Foam
      • Polyolefin - Polyolefins
      • Glass
      • Metal - Carbon
      • Copper
      • Plastic - ABS, Plastics
      • Acrylic (PMMA) - Acrylic
      • Epoxy - Epoxy Glass FR-4
      • Phenolic
      • Polyethylene (LDPE, HDPE) - PolyEthylene, Polyethylene (High Density)
      • Polystyrene (PS) - Polystyrene Foam
      • Polycarbonate
      • Polypropylene - Polypropylene (High Density)
      • Wood - Corrugated, Douglas Fir, Uncoated Card Board, Uncoated Chipboard, Coated Cardboard, Coated Chipboard
      • Composites - FRP
      • Fabric
      • Paper
      • Other - Laminate, Canvas
    • Industry
      • Electronics - Conductors, Electrical, Instruments, Solder, Bundle Wires
      • Coils - Coil
      • Connectors
      • Printed Circuit Board (PCB) - Printed circuit Boards
      • Industrial - Box, Fasteners
    • Chemistry
    • Cure Method
      • Hotmelt - Hot melt
    • Color
      • Off-White - Off White
    • Key Specifications
      • UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association) - UL 94 - V2
      • FDA (U.S. Food & Drug Administration) and/or CFIA (Canadian Food Inspection Agency): 175.105 - Applicable 21 CFR 175.105
    Specifications
    Cure Specs
    Application Temperature (°F) 349 to 385
    Viscosity (cPs) 12,500, 6,500, 4,000, 5,000 Test Method
    Softening Point (°C) 144, 145, 144 Test Method
    Work / Pot Time (min) 0.75 Test Method
    Bond Strength
    Peel Strength (piw) High, 45, 43, 35, 35, 45, 18 Test Method
    Shear Strength (psi) 235 to 240, 200 to 210, 233, 221 to 260, 220 to 270, 250 Test Method
    Tensile Strength (psi) 2.6 (Mpa) Test Method
    Material Resistance
    High Temperature Resistance (°C) Good, 79, Good thermal shock resistance Test Method
    Conductivity
    Dissipation Factor 0.00100 Test Method
    Dielectric Strength (V/mil) 1,300 Test Method
    Dielectric Constant 2.30 Test Method
    Volume Resistivity (O) 7.0e17 (ohms/cm) Test Method
    Hardness
    Durability Tough
    Elongation (%) 1,100
    Flexibility Flexible
    Other Properties
    Coefficient of Thermal Expansion (CTE) 180e-6 (cm/cm /°C)
    Flash Point (°F) 536.0
    % Solids (%) 100
    Business Information
    Shelf Life Details Shelf life is 12 months from date of despatch by 3M when stored in the original carton at 21°C (70°F) & 50 % Relative Humidity, When stored at the recommended conditions, this product has a shelf life of 2 years after 3M ships the product to a customer or distributor.
    Shelf Life Temperature (°F) 70, 120
    Shelf Life Type from date of despatch, After 3M ships the product
    Shelf Life (mon) 12, 24
  • Best Practices for 3M 3748

    *See Terms of Use Below

    1. Application

      3M™Hot Melt Adhesives are designed for application with a 3M™ Hot Melt Applicators. Read and follow the precautions and directions for use in the user’s manual before operating the applicator. 3M™ Hot Melt Adhesives are applied at 350-385°F.

    2. Surface Preparation

      Surfaces must be clean, dry and dust free. Wipe with a solvent such as isopropyl alcohol for plastic substrates to aid in removing oil and dirt.

  • Comparable Materials for 3M 3748

    *See Terms of Use Below

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Softening Point Test Methods
Softening Point Unit Test Method
144°C ASTM E-28-99
145°C ASTM E-28-6-7; Ball & Ring Melt Point
144°C ASTM E28-67; Ball & Ring Melt Point
Viscosity Test Methods
Viscosity Test Method Temperature
12,500 cPs Brookfield Thermosel Viscometer. 160°C
6,500 cPs Brookfield Thermosel Viscometer. 180°C
4,000 cPs Brookfield Thermosel Viscometer. 200°C
5,000 cPs Brookfield Thermosel Viscometer in Centipoise. 191°C
Work / Pot Time Test Methods
Work / Pot Time Test Method
0.75 min 1/8" semicircular bead, Douglas Fir to Douglas Fir.
Shear Strength Test Methods
Shear Strength Type Substrate Test Method
235 to 240 psi Overlap shear strength Douglas Fir C-3096
200 to 210 psi Overlap shear strength Epoxy Glass FR-4 C-3096
233 psi Overlap shear strength Polyethylene (High Density) C-3096
221 to 260 psi Overlap shear strength Polypropylene (High Density) C-3096
220 to 270 psi Overlap shear strength ABS C-3096
250 psi Douglas Fir to Douglas Fir
Tensile Strength Test Methods
Tensile Strength Test Temperature
2.6 (Mpa) 22°C
Peel Strength Test Methods
Peel Strength Type Substrate Test Method
High
45 piw 180° Peel strength Douglas Fir C-3168
43 piw 180° Peel strength Epoxy Glass FR-4 C-3168
35 piw 180° Peel strength Polyethylene (High Density) C-3168
35 piw 180° Peel strength Polypropylene (High Density) C-3168
45 piw 180° Peel strength ABS C-3168
18 piw Canvas to Douglas Fir
High Temperature Resistance Test Methods
High Temperature Resistance Test Method
Good
79°C Temperature at which adhesive fails
Good thermal shock resistance
Dielectric Constant Test Methods
Dielectric Constant Temperature Test Method
2.30 23°C ASTM D 150, 1 KHz
Dielectric Strength Test Methods
Dielectric Strength Test Method
1,300 V/mil 1 KHz (ASTM D 149)
Dissipation Factor Test Methods
Dissipation Factor Temperature Test Method
0.00100 23°C ASTM D 150, 1 KHz
Volume Resistivity Test Methods
Volume Resistivity Test Method
7.0e17 (ohms/cm) (ASTM D 257) at 500 Volts