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Description for 3M 3748
Good thermal shock resistance • Non-corrosive to copper for many electronic applications • Bonds polyolefinsApplication Type Bond 1 Part or 2 Part 1-Part Material Form Sticks Substrate Acrylic, Ceramic, FRP, Copper, Fabric, Glass, Carbon, Paper, Plastics, Polycarbonate, Polypropylene, Corrugated, Phenolic, Polystyrene Foam, PolyEthylene, Epoxy, Epoxy Glass FR-4, Flexible foam, Polyolefins, ABS, Metal, Coated Cardboard, Polypropylene (High Density) , Douglas Fir, Polyethylene (High Density) , Polystyrene Foam, Uncoated Card Board, Uncoated Chipboard, Coated Chipboard Industry Conductors, Printed circuit Boards, Connectors, Coil, Electrical, Electronics, Instruments, Solder, Bundle Wires Manufacturer 3M Chemistry Hot melt Cure Method Hot melt Application Temperature (°F) 349 to 385 Viscosity (cPs) 12,500, 6,500, 4,000, 5,000 Color Off White High Temperature Resistance (°C) Good, 79, Good thermal shock resistance Volume Resistivity (O) 7.0e17 (ohms/cm) Durability Tough Key Specifications FDA (U.S. Food & Drug Administration) and/or CFIA (Canadian Food Inspection Agency): Applicable 21 CFR 175.105, UL 94 - V2 -
Technical Data for 3M 3748
Overview
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Application Type
- Adhesive - Bond
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1 Part or 2 Part
- 1-Part
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Material Form
- Stick - Sticks
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Substrate
- Ceramic
- Foam - Flexible foam, Polystyrene Foam
- Polyolefin - Polyolefins
- Glass
- Metal - Carbon
- Copper
- Plastic - Plastics
- Acrylic (PMMA) - Acrylic
- Polycarbonate
- Polypropylene - Polypropylene (High Density)
- Phenolic
- Polystyrene (PS) - Polystyrene Foam
- Polyethylene (LDPE, HDPE) - PolyEthylene, Polyethylene (High Density)
- Epoxy - Epoxy Glass FR-4
- ABS
- Wood - Corrugated, Douglas Fir, Uncoated Card Board, Uncoated Chipboard, Coated Chipboard
- Composites - FRP
- Fabric
- Paper - Coated Cardboard
- Other - Laminate, Canvas
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Industry
- Electronics - Conductors, Electrical, Instruments, Solder, Bundle Wires
- Printed Circuit Board (PCB) - Printed circuit Boards
- Connectors
- Coils - Coil
- Industrial - Box, Fasteners
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Chemistry
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Cure Method
- Hotmelt - Hot melt
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Color
- Off-White - Off White
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Key Specifications
- UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association) - UL 94 - V2
- FDA (U.S. Food & Drug Administration) and/or CFIA (Canadian Food Inspection Agency) : 175.105 - Applicable 21 CFR 175.105
Specifications
Cure Specs
Application Temperature (°F) 349 to 385 Viscosity (cPs) 12,500, 6,500, 4,000, 5,000 Test Method Softening Point (°C) 144, 145, 144 Test Method Work / Pot Time (min) 0.75 Test Method Bond Strength
Peel Strength (piw) High, 45, 43, 35, 35, 45, 18 Test Method Shear Strength (psi) 235 to 240, 200 to 210, 233, 221 to 260, 220 to 270, 250 Test Method Tensile Strength (psi) 2.6 (Mpa) Test Method Material Resistance
High Temperature Resistance (°C) Good, 79, Good thermal shock resistance Test Method Conductivity
Dissipation Factor 0.00100 Test Method Dielectric Strength (V/mil) 1,300 Test Method Dielectric Constant 2.30 Test Method Volume Resistivity (O) 7.0e17 (ohms/cm) Test Method Hardness
Durability Tough Elongation (%) 1,100 Flexibility Flexible Other Properties
Coefficient of Thermal Expansion (CTE) 180e-6 (cm/cm /°C) Flash Point (°F) 536.0 % Solids (%) 100 Business Information
Shelf Life Details Shelf life is 12 months from date of despatch by 3M when stored in the original carton at 21°C (70°F) & 50 % Relative Humidity, When stored at the recommended conditions, this product has a shelf life of 2 years after 3M ships the product to a customer or distributor. Shelf Life Temperature (°F) 70, 120 Shelf Life Type from date of despatch, After 3M ships the product Shelf Life (mon) 12, 24 -
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Best Practices for 3M 3748
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Surface Preparation
Surfaces must be clean, dry and dust free. Wipe with a solvent such as isopropyl alcohol for plastic substrates to aid in removing oil and dirt.
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Application
3M™Hot Melt Adhesives are designed for application with a 3M™ Hot Melt Applicators. Read and follow the precautions and directions for use in the user’s manual before operating the applicator. 3M™ Hot Melt Adhesives are applied at 350-385°F.
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Comparable Materials for 3M 3748
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Softening Point Test Methods
Softening Point | Unit Test Method |
---|---|
144°C | ASTM E-28-99 |
145°C | ASTM E-28-6-7; Ball & Ring Melt Point |
144°C | ASTM E28-67; Ball & Ring Melt Point |
Viscosity Test Methods
Viscosity | Test Method | Temperature |
---|---|---|
12,500 cPs | Brookfield Thermosel Viscometer. | 160°C |
6,500 cPs | Brookfield Thermosel Viscometer. | 180°C |
4,000 cPs | Brookfield Thermosel Viscometer. | 200°C |
5,000 cPs | Brookfield Thermosel Viscometer in Centipoise. | 191°C |
Work / Pot Time Test Methods
Work / Pot Time | Test Method |
---|---|
0.75 min | 1/8" semicircular bead, Douglas Fir to Douglas Fir. |
Peel Strength Test Methods
Peel Strength | Type | Substrate | Test Method |
---|---|---|---|
High | |||
45 piw | 180° Peel strength | Douglas Fir | C-3168 |
43 piw | 180° Peel strength | Epoxy Glass FR-4 | C-3168 |
35 piw | 180° Peel strength | Polyethylene (High Density) | C-3168 |
35 piw | 180° Peel strength | Polypropylene (High Density) | C-3168 |
45 piw | 180° Peel strength | ABS | C-3168 |
18 piw | Canvas to Douglas Fir |
Tensile Strength Test Methods
Tensile Strength | Test Temperature |
---|---|
2.6 (Mpa) | 22°C |
Shear Strength Test Methods
Shear Strength | Type | Substrate | Test Method |
---|---|---|---|
235 to 240 psi | Overlap shear strength | Douglas Fir | C-3096 |
200 to 210 psi | Overlap shear strength | Epoxy Glass FR-4 | C-3096 |
233 psi | Overlap shear strength | Polyethylene (High Density) | C-3096 |
221 to 260 psi | Overlap shear strength | Polypropylene (High Density) | C-3096 |
220 to 270 psi | Overlap shear strength | ABS | C-3096 |
250 psi | Douglas Fir to Douglas Fir |
High Temperature Resistance Test Methods
High Temperature Resistance | Test Method |
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Good | |
79°C | Temperature at which adhesive fails |
Good thermal shock resistance |
Dielectric Constant Test Methods
Dielectric Constant | Temperature | Test Method |
---|---|---|
2.30 | 23°C | ASTM D 150, 1 KHz |
Dielectric Strength Test Methods
Dielectric Strength | Test Method |
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1,300 V/mil | 1 KHz (ASTM D 149) |
Dissipation Factor Test Methods
Dissipation Factor | Temperature | Test Method |
---|---|---|
0.00100 | 23°C | ASTM D 150, 1 KHz |
Volume Resistivity Test Methods
Volume Resistivity | Test Method |
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7.0e17 (ohms/cm) | (ASTM D 257) at 500 Volts |