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Description for 3M 3748 VO
A tough, flexible, thermoplastic hot melt, 100% solids adhesive which exhibits good peel adhesion and thermal shock properties along with higher heat resistance.Chemical Resistance 1, 1, 1 - trichloroethylene, Acetone, Freon® TF, Freon® TMC, Isopropyl Alcohol, RMA Flux Application Type Bond, Potting, Sealing 1 Part or 2 Part 1-Part Material Form Sticks Substrate Aluminum, Ceramic, FRP, Glass, Metal, Polycarbonate, Polypropylene, Douglas Fir , Phenolic, Polyethylene, Epoxy, ABS, FR-4, Fir Industry Other electronic bonding applications, Printed wiring board Manufacturer 3M Chemistry Hot melt: Polyolefin, Thermoplastic Cure Method Hot melt Application Temperature (°F) 351 to 385 Viscosity (cPs) 8,500, 5,000, 3,300 Color Light Yellow High Temperature Resistance (°C) Exhibits good thermal shock properties Volume Resistivity (O) 6.0e17 (ohm/cm) Durability Tough Key Specifications UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94: UL 94 (Flammability classification): V-O -
Technical Data for 3M 3748 VO
Overview
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Chemical Resistance
- Chemical Resistance - 1, 1, 1 - trichloroethylene, Acetone, Freon® TF, Freon® TMC, Isopropyl Alcohol, RMA Flux
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Application Type
- Adhesive - Bond
- Pottant / Encapsulant - Potting
- Sealant - Sealing
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1 Part or 2 Part
- 1-Part
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Material Form
- Stick - Sticks
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Substrate
- Ceramic
- Glass
- Metal
- Aluminum
- Polycarbonate
- Polypropylene
- Phenolic
- Polyethylene (LDPE, HDPE) - Polyethylene
- Epoxy
- ABS
- Wood - Douglas Fir , Fir
- Composites - FR-4, FRP
- Other - Laminate
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Industry
- Electronics - Other electronic bonding applications
- Printed Circuit Board (PCB) - Printed wiring board
- Industrial - Many general industrial bonding
- Other - Sealing applications where a self-extinguishing characteristic is required.
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Chemistry
- Thermoplastic
- Hot melt : APAO - Polyolefin
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Cure Method
- Hotmelt - Hot melt
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Color
- Yellow - Light Yellow
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Key Specifications
- UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association) : UL 94 : V0 - UL 94 (Flammability classification): V-O
Specifications
Cure Specs
Application Temperature (°F) 351 to 385 Viscosity (cPs) 8,500, 5,000, 3,300 Test Method Softening Point (°C) 152 Test Method Work / Pot Time (min) 0.50 Test Method Thixotropic High Bond Strength
General Bond Strength (psi) Excellent Peel Strength (piw) Exhibits good peel adhesion, 38, 35, 27, 26 Test Method Shear Strength (psi) 215, 275, 250, 220 Test Method Material Resistance
Non-Corrosive Non Corrosive High Temperature Resistance (°C) Exhibits good thermal shock properties Test Method Conductivity
Dissipation Factor 0.00200, 0.00100, 0.00100, 0.00100, 0.00100, 0.00100 Test Method Dielectric Strength (V/mil) Good, 1,400, Excellent electrical properties Test Method Dielectric Constant 2.30, 2.30, 2.30, 2.30, 2.30, 2.30 Test Method Thermal Conductivity (W/m°K) 1.92e-1 (Watt/m - °C) Test Method Surface Resistivity (O) 4.5e17 (ohms/sq.) Test Method Volume Resistivity (O) 6.0e17 (ohm/cm) Test Method Hardness
Durability Tough Shore D Hardness 26 Test Method Elongation (%) 1,850 Flexibility Flexible Other Properties
Specific Gravity 1.090 Test Method Coefficient of Thermal Expansion (CTE) -34.0e-6 (units/units/°C), 154.5e-6 (units/units/°C) Test Method Flash Point (°F) 536.0 % Solids (%) 100 Business Information
Shelf Life Details Store below 120°F (49°C).; When stored at the recommended conditions, this product has a shelf life of 2 years from the date of manufacture. Shelf Life Temperature (°F) <120 Shelf Life Type From the date of manufacture Shelf Life (mon) 24 -
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Best Practices for 3M 3748 VO
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Comparable Materials for 3M 3748 VO
Spec Engine® Results
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Softening Point Test Methods
Softening Point | Unit Test Method |
---|---|
152°C | Ball and Ring Softening Point, The technical information and data should be considered representative or typical only and should not be used for specification purposes. |
Viscosity Test Methods
Viscosity | Test Method | Temperature |
---|---|---|
8,500 cPs | The technical information and data should be considered representative or typical only and should not be used for specification purposes. | 180°C |
5,000 cPs | 200°C | |
3,300 cPs | 220°C |
Work / Pot Time Test Methods
Work / Pot Time | Test Method |
---|---|
0.50 min | 1/8" semicircular bead, Douglas Fir to Douglas Fir. |
Peel Strength Test Methods
Peel Strength | Type | Cure Time | Cure Temperature | Substrate | Test Method |
---|---|---|---|---|---|
Exhibits good peel adhesion | 180° Peel Adhesion | ||||
38 piw | 180° Peel Adhesion | 1,440 min | 21°C | Wire Mesh to FR-4 | 1" x 4" Douglas Fir specimens are bonded with hot melt adhesive using a 1" overlap shear configuration. Bonds are then conditioned for 24 hours at 70°F (22°C), 50% relative humidity before testing. Bonds are subjected to 2 lbs. per square inch load at 100°F (49°C) for 30 minutes. Temperature of the bond line is raised every 30 minutes until failure. Heat resistance recorded is the last temperature prior to bond failure. |
35 piw | 180° Peel Adhesion | 1,440 min | 21°C | Wire Mesh to PP | 1" x 4" Douglas Fir specimens are bonded with hot melt adhesive using a 1" overlap shear configuration. Bonds are then conditioned for 24 hours at 70°F (22°C), 50% relative humidity before testing. Bonds are subjected to 2 lbs. per square inch load at 100°F (49°C) for 30 minutes. Temperature of the bond line is raised every 30 minutes until failure. Heat resistance recorded is the last temperature prior to bond failure. |
27 piw | 180° Peel Adhesion | 1,440 min | 21°C | Wire Mesh to PE | 1" x 4" Douglas Fir specimens are bonded with hot melt adhesive using a 1" overlap shear configuration. Bonds are then conditioned for 24 hours at 70°F (22°C), 50% relative humidity before testing. Bonds are subjected to 2 lbs. per square inch load at 100°F (49°C) for 30 minutes. Temperature of the bond line is raised every 30 minutes until failure. Heat resistance recorded is the last temperature prior to bond failure. |
26 piw | 180° Peel Adhesion | 1,440 min | 21°C | Wire Mesh to Fir | 1" x 4" Douglas Fir specimens are bonded with hot melt adhesive using a 1" overlap shear configuration. Bonds are then conditioned for 24 hours at 70°F (22°C), 50% relative humidity before testing. Bonds are subjected to 2 lbs. per square inch load at 100°F (49°C) for 30 minutes. Temperature of the bond line is raised every 30 minutes until failure. Heat resistance recorded is the last temperature prior to bond failure. |
Shear Strength Test Methods
Shear Strength | Type | Cure Time | Cure Temperature | Substrate | Test Method |
---|---|---|---|---|---|
215 psi | Overlap shear strength | 1,440 min | 70°C | FR-4 to FR-4 | 1" x 4" Douglas Fir specimens are bonded with hot melt adhesive using a 1" overlap and 13 mil wire spacer to set bond line thickness. Bonds are then conditioned for 24 hours at 70°F (22°C), 50% relative humidity before testing. Bonds are pulled in shear at a separation bond speed of 2 inch a minute recording strength at failure. |
275 psi | Overlap shear strength | 1,440 min | 70°C | Fir to Fir | 1" x 4" Douglas Fir specimens are bonded with hot melt adhesive using a 1" overlap and 13 mil wire spacer to set bond line thickness. Bonds are then conditioned for 24 hours at 70°F (22°C), 50% relative humidity before testing. Bonds are pulled in shear at a separation bond speed of 2 inch a minute recording strength at failure. |
250 psi | Overlap shear strength | 1,440 min | 70°C | Polypropylene to Polypropylene | 1" x 4" Douglas Fir specimens are bonded with hot melt adhesive using a 1" overlap and 13 mil wire spacer to set bond line thickness. Bonds are then conditioned for 24 hours at 70°F (22°C), 50% relative humidity before testing. Bonds are pulled in shear at a separation bond speed of 2 inch a minute recording strength at failure. |
220 psi | Overlap shear strength | 1,440 min | 70°C | Polyethylene to Polyethylene | 1" x 4" Douglas Fir specimens are bonded with hot melt adhesive using a 1" overlap and 13 mil wire spacer to set bond line thickness. Bonds are then conditioned for 24 hours at 70°F (22°C), 50% relative humidity before testing. Bonds are pulled in shear at a separation bond speed of 2 inch a minute recording strength at failure. |
High Temperature Resistance Test Methods
High Temperature Resistance | Test Method |
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Exhibits good thermal shock properties |
Dielectric Constant Test Methods
Dielectric Constant | Test Method |
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2.30 | ASTM D 150, 100 Hz |
2.30 | ASTM D 150, 1 kHz |
2.30 | ASTM D 150, 10 kHz |
2.30 | ASTM D 150, 100 kHz |
2.30 | ASTM D 150, 1 MHz |
2.30 | ASTM D 150, 100 MHz |
Dielectric Strength Test Methods
Dielectric Strength | Test Method |
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Good | |
1,400 V/mil | ASTM D 149, 11 mil sample, The technical information and data should be considered representative or typical only and should not be used for specification purposes. |
Excellent electrical properties | ASTM D 149, 11 mil sample, The technical information and data should be considered representative or typical only and should not be used for specification purposes. |
Dissipation Factor Test Methods
Dissipation Factor | Test Method |
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0.00200 | ASTM D 150, 100 Hz, The following technical information and data should be considered representative or typical only and should not be used for specification purposes. |
0.00100 | ASTM D 150, 1 kHz, The following technical information and data should be considered representative or typical only and should not be used for specification purposes. |
0.00100 | ASTM D 150, 10 kHz, The following technical information and data should be considered representative or typical only and should not be used for specification purposes. |
0.00100 | ASTM D 150, 100 kHz, The following technical information and data should be considered representative or typical only and should not be used for specification purposes. |
0.00100 | ASTM D 150, 1 MHz, The following technical information and data should be considered representative or typical only and should not be used for specification purposes. |
0.00100 | ASTM D 150, 100 MHz, The following technical information and data should be considered representative or typical only and should not be used for specification purposes. |
Surface Resistivity Test Methods
Surface Resistivity | Test Method |
---|---|
4.5e17 (ohms/sq.) | ASTM D 257, The following technical information and data should be considered representative or typical only and should not be used for specification purposes. |
Thermal Conductivity Test Methods
Thermal Conductivity | Temperature | Test Method |
---|---|---|
1.92e-1 (Watt/m - °C) | 41°C | @ 41°C [107°F] on .020" samples. |
Volume Resistivity Test Methods
Volume Resistivity | Test Method |
---|---|
6.0e17 (ohm/cm) | ASTM D 257, The technical information and data should be considered representative or typical only and should not be used for specification purposes. |
Shore D Hardness Test Methods
Shore D Hardness | Shore Hardness Test Method |
---|---|
26 | ASTM D 2240, The technical information and data should be considered representative or typical only and should not be used for specification purposes. |
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) | CTE Temperature (°C) | CTE Test Method |
---|---|---|
-34.0e-6 (units/units/°C) | -100 to -40°C | By TMA, The technical information and data should be considered representative or typical only and should not be used for specification purposes. |
154.5e-6 (units/units/°C) | -20 to 25°C | By TMA, The technical information and data should be considered representative or typical only and should not be used for specification purposes. |
Specific Gravity Test Methods
Specific Gravity | Test Method |
---|---|
1.090 | The technical information and data should be considered representative or typical only and should not be used for specification purposes. |