• Description for 3M 3748 VO

    A tough, flexible, thermoplastic hot melt. Self-extinguishing, meets UL 1410 requirements.

    *See Terms of Use Below

    Application Type Bond, Pottant / Encapsulant, Sealing, Fixture
    1 Part or 2 Part 1 Part
    Material Form Sticks
    Substrate Aluminum, Ceramic, Plastic: Epoxy, Plastic: Phenolic, Glass, Metal, ABS, Plastic: Polyethylene, Polycarbonate, Polypropylene, Douglas Fir , FRP, Polyolefin, ThermoPlastic
    Industry Electrical, Electronics: Printed circuit boards (PCBs), Instruments, Printed wiring Board
    Manufacturer 3M
    Chemistry Hot melt, Polyolefin
    Cure Method Hot melt
    Viscosity (cPs) 8,500, 5,000, 3,300, 5,500
    Color Light Yellow
    Chemical Resistance 1, 1, 1 - trichloroethylene, Acetone, Freon® TF, Freon® TMC, Isopropyl Alcohol, RMA Flux
    High Temperature Resistance (°C) 52, 25, High, Good thermal shock resistance, 79
    Low Temperature Resistance (°C) -40, -100, -20
    Key Specifications UL94 - VO; UL 1410, Mil-Spec (United States Military Standard): Mil S-46163
  • Technical Data

    Overview
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    Specifications
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  • Best Practices

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Softening Point Test Methods
Softening Point Unit Test Method
152°C ASTM E-28-99
Viscosity Test Methods
Viscosity Test Method Temperature
8,500 cPs 180°C
5,000 cPs 200°C
3,300 cPs 220°C
5,500 cPs Brookfield Thermosel Viscometer in Centipoise. 191°C
Work / Pot Time Test Methods
Work / Pot Time Test Method
0.50 min 1/8" semicircular bead, Douglas Fir to Douglas Fir.
Shear Strength Test Methods
Shear Strength Type Cure Time Cure Temperature Cure Humidity Substrate Test Temperature Test Method
275 psi 22°C On Douglas Fir 22°C
215 psi Overlap shear strength 1,440 min 22°C 50 % FR-4 to FR-4 21°C 3M TM C 3096, 1" x 4" Douglas Fir specimens are bonded with hot melt adhesive using a 1" overlap and 13 mil wire spacer to set bond line thickness. Bonds are then conditioned for 24 hours at 70°F (22°C), 50% relative humidity before testing. Bonds are pulled in shear at a separation bond speed of 2 inch a minute recording strength at failure.
275 psi Overlap shear strength 1,440 min 22°C 50 % Fir to Fir 21°C 3M TM C 3096, 1" x 4" Douglas Fir specimens are bonded with hot melt adhesive using a 1" overlap and 13 mil wire spacer to set bond line thickness. Bonds are then conditioned for 24 hours at 70°F (22°C), 50% relative humidity before testing. Bonds are pulled in shear at a separation bond speed of 2 inch a minute recording strength at failure.
250 psi Overlap shear strength 1,440 min 22°C 50 % Polypropylene to Polypropylene 21°C 3M TM C 3096, 1" x 4" Douglas Fir specimens are bonded with hot melt adhesive using a 1" overlap and 13 mil wire spacer to set bond line thickness. Bonds are then conditioned for 24 hours at 70°F (22°C), 50% relative humidity before testing. Bonds are pulled in shear at a separation bond speed of 2 inch a minute recording strength at failure.
220 psi Overlap shear strength 1,440 min 22°C 50 % Polyethylene to Polyethylene 21°C 3M TM C 3096, 1" x 4" Douglas Fir specimens are bonded with hot melt adhesive using a 1" overlap and 13 mil wire spacer to set bond line thickness. Bonds are then conditioned for 24 hours at 70°F (22°C), 50% relative humidity before testing. Bonds are pulled in shear at a separation bond speed of 2 inch a minute recording strength at failure.
Tensile Strength Test Methods
Tensile Strength Test Temperature
200 psi 22°C
Peel Strength Test Methods
Peel Strength Type Substrate Test Temperature Test Method
15 piw On canvas 22°C
Good
38 piw 180° Peel strength Wire Mesh to FR-4 C 3168, 1" x 4" Douglas Fir specimens are bonded with hot melt adhesive using a 1" overlap shear configuration. Bonds are then conditioned for 24 hours at 70°F (22°C), 50% relative humidity before testing. Bonds are subjected to 2 lbs. per square inch load at 100°F (49°C) for 30 minutes. Temperature of the bond line is raised every 30 minutes until failure. Heat resistance recorded is the last temperature prior to bond failure.
35 piw 180° Peel strength Wire Mesh to PP C 3168, 1" x 4" Douglas Fir specimens are bonded with hot melt adhesive using a 1" overlap shear configuration. Bonds are then conditioned for 24 hours at 70°F (22°C), 50% relative humidity before testing. Bonds are subjected to 2 lbs. per square inch load at 100°F (49°C) for 30 minutes. Temperature of the bond line is raised every 30 minutes until failure. Heat resistance recorded is the last temperature prior to bond failure.
27 piw 180° Peel strength Wire Mesh to PE C 3168, 1" x 4" Douglas Fir specimens are bonded with hot melt adhesive using a 1" overlap shear configuration. Bonds are then conditioned for 24 hours at 70°F (22°C), 50% relative humidity before testing. Bonds are subjected to 2 lbs. per square inch load at 100°F (49°C) for 30 minutes. Temperature of the bond line is raised every 30 minutes until failure. Heat resistance recorded is the last temperature prior to bond failure.
26 piw 180° Peel strength Wire Mesh to Fir C 3168, 1" x 4" Douglas Fir specimens are bonded with hot melt adhesive using a 1" overlap shear configuration. Bonds are then conditioned for 24 hours at 70°F (22°C), 50% relative humidity before testing. Bonds are subjected to 2 lbs. per square inch load at 100°F (49°C) for 30 minutes. Temperature of the bond line is raised every 30 minutes until failure. Heat resistance recorded is the last temperature prior to bond failure.
High Temperature Resistance Test Methods
High Temperature Resistance Test Method
52°C
25°C
High
79°C Temperature at which adhesive fails
Good thermal shock resistance
Dielectric Constant Test Methods
Dielectric Constant Test Method
2.30 ASTM D 150, 100 Hz
2.30 ASTM D 150, 1 kHz
2.30 ASTM D 150, 10 kHz
2.30 ASTM D 150, 100 kHz
2.30 ASTM D 150, 1 MHz
2.30 ASTM D 150, 100 MHz
Dielectric Strength Test Methods
Dielectric Strength Test Method
Excellent
Good
1,400 V/mil ASTM D 149, 11 mil sample
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.00200 ASTM D 150, 100 Hz
0.00100 ASTM D 150, 1 kHz
0.00100 ASTM D 150, 10 kHz
0.00100 ASTM D 150, 100 kHz
0.00100 ASTM D 150, 1 MHz
0.00100 ASTM D 150, 100 MHz
Surface Resistivity Test Methods
Surface Resistivity Test Method
4.5e17 (ohms/sq.) ASTM D 257
Thermal Conductivity Test Methods
Thermal Conductivity Temperature Test Method
1.92e-1 (Watt/m - °C) 41°C @ 41°C [107°F] on .020" samples.
Volume Resistivity Test Methods
Volume Resistivity Test Method
6.0e17 (ohms/cm) ASTM D 257
Shore D Hardness Test Methods
Shore D Hardness Shore Hardness Test Method Hardness Temperature
26 ASTM D 2240 25°C Room Temperature
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Temperature (°C) CTE Test Method
-34.0e-6 (unit/unit /°C) -100 to -40°C by TMA
154.5e-6 (unit/unit /°C) -20 to 25°C by TMA