• Description for 3M 3748 VO

    A tough, flexible, thermoplastic hot melt, 100% solids adhesive which exhibits good peel adhesion and thermal shock properties along with higher heat resistance.

    *See Terms of Use Below

    Chemical Resistance 1, 1, 1 - trichloroethylene, Acetone, Freon® TF, Freon® TMC, Isopropyl Alcohol, RMA Flux
    Application Type Bond, Potting, Sealing
    1 Part or 2 Part 1-Part
    Material Form Sticks
    Substrate Aluminum, Ceramic, FRP, Glass, Metal, Polycarbonate, Polypropylene, Douglas Fir , Epoxy, Phenolic, ABS, Polyethylene, FR-4, Fir
    Industry Other electronic bonding applications, Printed wiring board
    Manufacturer 3M
    Chemistry Hot melt: Polyolefin, Thermoplastic
    Cure Method Hot melt
    Application Temperature (°F) 351 to 385
    Viscosity (cPs) 8,500, 5,000, 3,300
    Color Light Yellow
    High Temperature Resistance (°C) Exhibits good thermal shock properties
    Volume Resistivity (O) 6.0e17 (ohm/cm)
    Durability Tough
    Key Specifications UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94: UL 94 (Flammability classification): V-O
  • Technical Data for 3M 3748 VO

    Overview
    • Chemical Resistance
      • Chemical Resistance - 1, 1, 1 - trichloroethylene, Acetone, Freon® TF, Freon® TMC, Isopropyl Alcohol, RMA Flux
    • Application Type
    • 1 Part or 2 Part
      • 1-Part
    • Material Form
      • Stick - Sticks
    • Substrate
    • Industry
      • Electronics - Other electronic bonding applications
      • Printed Circuit Board (PCB) - Printed wiring board
      • Industrial - Many general industrial bonding
      • Other - Sealing applications where a self-extinguishing characteristic is required.
    • Chemistry
      • Thermoplastic
      • Hot melt : APAO - Polyolefin
    • Cure Method
      • Hotmelt - Hot melt
    • Color
      • Yellow - Light Yellow
    • Key Specifications
      • UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association) : UL 94 : V0 - UL 94 (Flammability classification): V-O
    Specifications
    Cure Specs
    Application Temperature (°F) 351 to 385
    Viscosity (cPs) 8,500, 5,000, 3,300 Test Method
    Softening Point (°C) 152 Test Method
    Work / Pot Time (min) 0.50 Test Method
    Thixotropic High
    Bond Strength
    General Bond Strength (psi) Excellent
    Peel Strength (piw) Exhibits good peel adhesion, 38, 35, 27, 26 Test Method
    Shear Strength (psi) 215, 275, 250, 220 Test Method
    Material Resistance
    Non-Corrosive Non Corrosive
    High Temperature Resistance (°C) Exhibits good thermal shock properties Test Method
    Conductivity
    Dissipation Factor 0.00200, 0.00100, 0.00100, 0.00100, 0.00100, 0.00100 Test Method
    Dielectric Strength (V/mil) Good, 1,400, Excellent electrical properties Test Method
    Dielectric Constant 2.30, 2.30, 2.30, 2.30, 2.30, 2.30 Test Method
    Thermal Conductivity (W/m°K) 1.92e-1 (Watt/m - °C) Test Method
    Surface Resistivity (O) 4.5e17 (ohms/sq.) Test Method
    Volume Resistivity (O) 6.0e17 (ohm/cm) Test Method
    Hardness
    Durability Tough
    Shore D Hardness 26 Test Method
    Elongation (%) 1,850
    Flexibility Flexible
    Other Properties
    Specific Gravity 1.090 Test Method
    Coefficient of Thermal Expansion (CTE) -34.0e-6 (units/units/°C), 154.5e-6 (units/units/°C) Test Method
    Flash Point (°F) 536.0
    % Solids (%) 100
    Business Information
    Shelf Life Details Store below 120°F (49°C).; When stored at the recommended conditions, this product has a shelf life of 2 years from the date of manufacture.
    Shelf Life Temperature (°F) <120
    Shelf Life Type From the date of manufacture
    Shelf Life (mon) 24
  • Best Practices for 3M 3748 VO

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  • Comparable Materials for 3M 3748 VO

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    Spec Engine® Results

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Softening Point Test Methods
Softening Point Unit Test Method
152°C Ball and Ring Softening Point, The technical information and data should be considered representative or typical only and should not be used for specification purposes.
Viscosity Test Methods
Viscosity Test Method Temperature
8,500 cPs The technical information and data should be considered representative or typical only and should not be used for specification purposes. 180°C
5,000 cPs 200°C
3,300 cPs 220°C
Work / Pot Time Test Methods
Work / Pot Time Test Method
0.50 min 1/8" semicircular bead, Douglas Fir to Douglas Fir.
Peel Strength Test Methods
Peel Strength Type Cure Time Cure Temperature Substrate Test Method
Exhibits good peel adhesion 180° Peel Adhesion
38 piw 180° Peel Adhesion 1,440 min 21°C Wire Mesh to FR-4 1" x 4" Douglas Fir specimens are bonded with hot melt adhesive using a 1" overlap shear configuration. Bonds are then conditioned for 24 hours at 70°F (22°C), 50% relative humidity before testing. Bonds are subjected to 2 lbs. per square inch load at 100°F (49°C) for 30 minutes. Temperature of the bond line is raised every 30 minutes until failure. Heat resistance recorded is the last temperature prior to bond failure.
35 piw 180° Peel Adhesion 1,440 min 21°C Wire Mesh to PP 1" x 4" Douglas Fir specimens are bonded with hot melt adhesive using a 1" overlap shear configuration. Bonds are then conditioned for 24 hours at 70°F (22°C), 50% relative humidity before testing. Bonds are subjected to 2 lbs. per square inch load at 100°F (49°C) for 30 minutes. Temperature of the bond line is raised every 30 minutes until failure. Heat resistance recorded is the last temperature prior to bond failure.
27 piw 180° Peel Adhesion 1,440 min 21°C Wire Mesh to PE 1" x 4" Douglas Fir specimens are bonded with hot melt adhesive using a 1" overlap shear configuration. Bonds are then conditioned for 24 hours at 70°F (22°C), 50% relative humidity before testing. Bonds are subjected to 2 lbs. per square inch load at 100°F (49°C) for 30 minutes. Temperature of the bond line is raised every 30 minutes until failure. Heat resistance recorded is the last temperature prior to bond failure.
26 piw 180° Peel Adhesion 1,440 min 21°C Wire Mesh to Fir 1" x 4" Douglas Fir specimens are bonded with hot melt adhesive using a 1" overlap shear configuration. Bonds are then conditioned for 24 hours at 70°F (22°C), 50% relative humidity before testing. Bonds are subjected to 2 lbs. per square inch load at 100°F (49°C) for 30 minutes. Temperature of the bond line is raised every 30 minutes until failure. Heat resistance recorded is the last temperature prior to bond failure.
Shear Strength Test Methods
Shear Strength Type Cure Time Cure Temperature Substrate Test Method
215 psi Overlap shear strength 1,440 min 70°C FR-4 to FR-4 1" x 4" Douglas Fir specimens are bonded with hot melt adhesive using a 1" overlap and 13 mil wire spacer to set bond line thickness. Bonds are then conditioned for 24 hours at 70°F (22°C), 50% relative humidity before testing. Bonds are pulled in shear at a separation bond speed of 2 inch a minute recording strength at failure.
275 psi Overlap shear strength 1,440 min 70°C Fir to Fir 1" x 4" Douglas Fir specimens are bonded with hot melt adhesive using a 1" overlap and 13 mil wire spacer to set bond line thickness. Bonds are then conditioned for 24 hours at 70°F (22°C), 50% relative humidity before testing. Bonds are pulled in shear at a separation bond speed of 2 inch a minute recording strength at failure.
250 psi Overlap shear strength 1,440 min 70°C Polypropylene to Polypropylene 1" x 4" Douglas Fir specimens are bonded with hot melt adhesive using a 1" overlap and 13 mil wire spacer to set bond line thickness. Bonds are then conditioned for 24 hours at 70°F (22°C), 50% relative humidity before testing. Bonds are pulled in shear at a separation bond speed of 2 inch a minute recording strength at failure.
220 psi Overlap shear strength 1,440 min 70°C Polyethylene to Polyethylene 1" x 4" Douglas Fir specimens are bonded with hot melt adhesive using a 1" overlap and 13 mil wire spacer to set bond line thickness. Bonds are then conditioned for 24 hours at 70°F (22°C), 50% relative humidity before testing. Bonds are pulled in shear at a separation bond speed of 2 inch a minute recording strength at failure.
High Temperature Resistance Test Methods
High Temperature Resistance Test Method
Exhibits good thermal shock properties
Dielectric Constant Test Methods
Dielectric Constant Test Method
2.30 ASTM D 150, 100 Hz
2.30 ASTM D 150, 1 kHz
2.30 ASTM D 150, 10 kHz
2.30 ASTM D 150, 100 kHz
2.30 ASTM D 150, 1 MHz
2.30 ASTM D 150, 100 MHz
Dielectric Strength Test Methods
Dielectric Strength Test Method
Good
1,400 V/mil ASTM D 149, 11 mil sample, The technical information and data should be considered representative or typical only and should not be used for specification purposes.
Excellent electrical properties ASTM D 149, 11 mil sample, The technical information and data should be considered representative or typical only and should not be used for specification purposes.
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.00200 ASTM D 150, 100 Hz, The following technical information and data should be considered representative or typical only and should not be used for specification purposes.
0.00100 ASTM D 150, 1 kHz, The following technical information and data should be considered representative or typical only and should not be used for specification purposes.
0.00100 ASTM D 150, 10 kHz, The following technical information and data should be considered representative or typical only and should not be used for specification purposes.
0.00100 ASTM D 150, 100 kHz, The following technical information and data should be considered representative or typical only and should not be used for specification purposes.
0.00100 ASTM D 150, 1 MHz, The following technical information and data should be considered representative or typical only and should not be used for specification purposes.
0.00100 ASTM D 150, 100 MHz, The following technical information and data should be considered representative or typical only and should not be used for specification purposes.
Surface Resistivity Test Methods
Surface Resistivity Test Method
4.5e17 (ohms/sq.) ASTM D 257, The following technical information and data should be considered representative or typical only and should not be used for specification purposes.
Thermal Conductivity Test Methods
Thermal Conductivity Temperature Test Method
1.92e-1 (Watt/m - °C) 41°C @ 41°C [107°F] on .020" samples.
Volume Resistivity Test Methods
Volume Resistivity Test Method
6.0e17 (ohm/cm) ASTM D 257, The technical information and data should be considered representative or typical only and should not be used for specification purposes.
Shore D Hardness Test Methods
Shore D Hardness Shore Hardness Test Method
26 ASTM D 2240, The technical information and data should be considered representative or typical only and should not be used for specification purposes.
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Temperature (°C) CTE Test Method
-34.0e-6 (units/units/°C) -100 to -40°C By TMA, The technical information and data should be considered representative or typical only and should not be used for specification purposes.
154.5e-6 (units/units/°C) -20 to 25°C By TMA, The technical information and data should be considered representative or typical only and should not be used for specification purposes.
Specific Gravity Test Methods
Specific Gravity Test Method
1.090 The technical information and data should be considered representative or typical only and should not be used for specification purposes.