Application Type | Bond, Pottant / Encapsulant, Sealing, Fixture |
---|---|
1 Part or 2 Part | 1 Part |
Material Form | Sticks |
Substrate | Aluminum, Ceramic, Plastic: Epoxy, Plastic: Phenolic, Glass, Metal, ABS, Plastic: Polyethylene, Polycarbonate, Polypropylene, Douglas Fir , FRP, Polyolefin, ThermoPlastic |
Industry | Electrical, Electronics: Printed circuit boards (PCBs), Instruments, Printed wiring Board |
Manufacturer | 3M |
Chemistry | Hot melt, Polyolefin |
Cure Method | Hot melt |
Viscosity (cPs) | 8,500, 5,000, 3,300, 5,500 |
Color | Light Yellow |
Chemical Resistance | 1, 1, 1 - trichloroethylene, Acetone, Freon® TF, Freon® TMC, Isopropyl Alcohol, RMA Flux |
High Temperature Resistance (°C) | 52, 25, High, Good thermal shock resistance, 79 |
Low Temperature Resistance (°C) | -40, -100, -20 |
Key Specifications | UL94 - VO; UL 1410, Mil-Spec (United States Military Standard): Mil S-46163 |
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Softening Point | Unit Test Method |
---|---|
152°C | ASTM E-28-99 |
Viscosity | Test Method | Temperature |
---|---|---|
8,500 cPs | 180°C | |
5,000 cPs | 200°C | |
3,300 cPs | 220°C | |
5,500 cPs | Brookfield Thermosel Viscometer in Centipoise. | 191°C |
Work / Pot Time | Test Method |
---|---|
0.50 min | 1/8" semicircular bead, Douglas Fir to Douglas Fir. |
Shear Strength | Type | Cure Time | Cure Temperature | Cure Humidity | Substrate | Test Temperature | Test Method |
---|---|---|---|---|---|---|---|
275 psi | 22°C | On Douglas Fir | 22°C | ||||
215 psi | Overlap shear strength | 1,440 min | 22°C | 50 % | FR-4 to FR-4 | 21°C | 3M TM C 3096, 1" x 4" Douglas Fir specimens are bonded with hot melt adhesive using a 1" overlap and 13 mil wire spacer to set bond line thickness. Bonds are then conditioned for 24 hours at 70°F (22°C), 50% relative humidity before testing. Bonds are pulled in shear at a separation bond speed of 2 inch a minute recording strength at failure. |
275 psi | Overlap shear strength | 1,440 min | 22°C | 50 % | Fir to Fir | 21°C | 3M TM C 3096, 1" x 4" Douglas Fir specimens are bonded with hot melt adhesive using a 1" overlap and 13 mil wire spacer to set bond line thickness. Bonds are then conditioned for 24 hours at 70°F (22°C), 50% relative humidity before testing. Bonds are pulled in shear at a separation bond speed of 2 inch a minute recording strength at failure. |
250 psi | Overlap shear strength | 1,440 min | 22°C | 50 % | Polypropylene to Polypropylene | 21°C | 3M TM C 3096, 1" x 4" Douglas Fir specimens are bonded with hot melt adhesive using a 1" overlap and 13 mil wire spacer to set bond line thickness. Bonds are then conditioned for 24 hours at 70°F (22°C), 50% relative humidity before testing. Bonds are pulled in shear at a separation bond speed of 2 inch a minute recording strength at failure. |
220 psi | Overlap shear strength | 1,440 min | 22°C | 50 % | Polyethylene to Polyethylene | 21°C | 3M TM C 3096, 1" x 4" Douglas Fir specimens are bonded with hot melt adhesive using a 1" overlap and 13 mil wire spacer to set bond line thickness. Bonds are then conditioned for 24 hours at 70°F (22°C), 50% relative humidity before testing. Bonds are pulled in shear at a separation bond speed of 2 inch a minute recording strength at failure. |
Tensile Strength | Test Temperature |
---|---|
200 psi | 22°C |
Peel Strength | Type | Substrate | Test Temperature | Test Method |
---|---|---|---|---|
15 piw | On canvas | 22°C | ||
Good | ||||
38 piw | 180° Peel strength | Wire Mesh to FR-4 | C 3168, 1" x 4" Douglas Fir specimens are bonded with hot melt adhesive using a 1" overlap shear configuration. Bonds are then conditioned for 24 hours at 70°F (22°C), 50% relative humidity before testing. Bonds are subjected to 2 lbs. per square inch load at 100°F (49°C) for 30 minutes. Temperature of the bond line is raised every 30 minutes until failure. Heat resistance recorded is the last temperature prior to bond failure. | |
35 piw | 180° Peel strength | Wire Mesh to PP | C 3168, 1" x 4" Douglas Fir specimens are bonded with hot melt adhesive using a 1" overlap shear configuration. Bonds are then conditioned for 24 hours at 70°F (22°C), 50% relative humidity before testing. Bonds are subjected to 2 lbs. per square inch load at 100°F (49°C) for 30 minutes. Temperature of the bond line is raised every 30 minutes until failure. Heat resistance recorded is the last temperature prior to bond failure. | |
27 piw | 180° Peel strength | Wire Mesh to PE | C 3168, 1" x 4" Douglas Fir specimens are bonded with hot melt adhesive using a 1" overlap shear configuration. Bonds are then conditioned for 24 hours at 70°F (22°C), 50% relative humidity before testing. Bonds are subjected to 2 lbs. per square inch load at 100°F (49°C) for 30 minutes. Temperature of the bond line is raised every 30 minutes until failure. Heat resistance recorded is the last temperature prior to bond failure. | |
26 piw | 180° Peel strength | Wire Mesh to Fir | C 3168, 1" x 4" Douglas Fir specimens are bonded with hot melt adhesive using a 1" overlap shear configuration. Bonds are then conditioned for 24 hours at 70°F (22°C), 50% relative humidity before testing. Bonds are subjected to 2 lbs. per square inch load at 100°F (49°C) for 30 minutes. Temperature of the bond line is raised every 30 minutes until failure. Heat resistance recorded is the last temperature prior to bond failure. |
High Temperature Resistance | Test Method |
---|---|
52°C | |
25°C | |
High | |
79°C | Temperature at which adhesive fails |
Good thermal shock resistance |
Dielectric Constant | Test Method |
---|---|
2.30 | ASTM D 150, 100 Hz |
2.30 | ASTM D 150, 1 kHz |
2.30 | ASTM D 150, 10 kHz |
2.30 | ASTM D 150, 100 kHz |
2.30 | ASTM D 150, 1 MHz |
2.30 | ASTM D 150, 100 MHz |
Dielectric Strength | Test Method |
---|---|
Excellent | |
Good | |
1,400 V/mil | ASTM D 149, 11 mil sample |
Dissipation Factor | Test Method |
---|---|
0.00200 | ASTM D 150, 100 Hz |
0.00100 | ASTM D 150, 1 kHz |
0.00100 | ASTM D 150, 10 kHz |
0.00100 | ASTM D 150, 100 kHz |
0.00100 | ASTM D 150, 1 MHz |
0.00100 | ASTM D 150, 100 MHz |
Surface Resistivity | Test Method |
---|---|
4.5e17 (ohms/sq.) | ASTM D 257 |
Thermal Conductivity | Temperature | Test Method |
---|---|---|
1.92e-1 (Watt/m - °C) | 41°C | @ 41°C [107°F] on .020" samples. |
Volume Resistivity | Test Method |
---|---|
6.0e17 (ohms/cm) | ASTM D 257 |
Shore D Hardness | Shore Hardness Test Method | Hardness Temperature |
---|---|---|
26 | ASTM D 2240 | 25°C Room Temperature |
Coefficient of Thermal Expansion (CTE) | CTE Temperature (°C) | CTE Test Method |
---|---|---|
-34.0e-6 (unit/unit /°C) | -100 to -40°C | by TMA |
154.5e-6 (unit/unit /°C) | -20 to 25°C | by TMA |
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