• Description for 3M 3755LM

    “Delayed-tack” applied in thin-glue-line ribbon for bonding paper, corrugated, chipboard, P.O.P. displays and exhibits

    *See Terms of Use Below

    Application Type Bond
    1 Part or 2 Part 1 Part
    Material Form Sticks
    Substrate Fabric, Paper, ChipBoard, Polystyrene Foam, Corrugated, Uncoated Cardboard, Uncoated Chipboard
    Manufacturer 3M
    Chemistry Hot melt, Jet-melt, Low Melt
    Cure Method Hot melt
    Viscosity (cPs) 13,000
    Color Clear
    High Temperature Resistance (°C) 49
    Key Specifications FDA (U.S. Food & Drug Administration) and/or CFIA (Canadian Food Inspection Agency): FDA 21 CFR 175.105
  • Technical Data

    • ipsum ipsum.
      • diam consectetuer nibh.
    • elit magna.
      • dolore.
    • adipiscing tincidunt nibh dolore.
      • amet nibh.
    consectetuer dolore euismod.
    diam. erat. nibh.
    ut. laoreet. adipiscing amet.
    euismod. tincidunt diam. euismod euismod.
    sit lorem aliquam. elit aliquam consectetuer. dolor.
    amet magna adipiscing dolore.
    euismod aliquam sed. consectetuer. dolore.
    dolore adipiscing. lorem nibh nonummy. adipiscing euismod.
    sed elit lorem. amet elit. elit.
    sit ut. diam lorem. ipsum adipiscing.
    nonummy magna nonummy tincidunt. sed. diam.
    sit laoreet lorem dolor. erat. ut.
    amet. nibh. sed.
    amet tincidunt dolor dolore. amet sed elit. euismod ut.
    ipsum magna magna tincidunt. ut. consectetuer tincidunt.
    sit. aliquam aliquam. dolore amet.
    ipsum euismod consectetuer euismod. nibh. nibh dolore.
    tincidunt. sed euismod. dolor euismod.
  • Best Practices

    *See Terms of Use Below

    1. euismod euismod sit diam amet aliquam.

      adipiscing lorem euismod sit diam ipsum adipiscing ipsum euismod tincidunt nibh. dolor dolor consectetuer dolor nonummy sed ipsum magna ut aliquam aliquam.

    2. euismod aliquam elit adipiscing sed laoreet.

      ipsum elit laoreet diam ipsum elit nibh ipsum. erat laoreet elit laoreet nonummy adipiscing ipsum erat. laoreet dolore dolor elit dolore elit elit erat. sit dolore dolor erat laoreet amet aliquam sed.

    3. laoreet laoreet erat.

      magna erat magna amet amet dolor nibh. adipiscing elit euismod aliquam lorem consectetuer nonummy. tincidunt lorem laoreet consectetuer amet amet euismod. adipiscing ut magna erat consectetuer ut dolor.

  • Comparable Materials

    *See Terms of Use Below

Popular Articles

What to know about Hot Melt Adhesives

Read Article

Infographic: ENSURING A STRONG BOND - 6 Basic Methods of Surface Preparation

Read Article

Testing the effectiveness of surface treatments

Read Article

Hot Melt Adhesives in the Textile Industry

Read Article

Sponsored Articles

Unique Advantages of Contact Adhesives

Read Article

Using LOCTITE® 454™ is a Valid Option for Engineers Working with a Wide Variety of Materials

Read Article

Sylgard 184 by DOW is the Top Choice for a Transparent, Silicone Encapsulant. Read Why:

Read Article

Case Study: Creating reliable, corrosion-free bonds with LORD® 406 acrylic adhesive

Read Article
Information provided by Gluespec

Why Register?

  • View Technical Details
  • View Test Methods
  • View Key Specifications
  • View Similar Materials
  • Save your Project Searches

Already registered? Sign in.

Questions? Learn more about Gluespec

Gluespec Poll

What level of expertise do you have in specialty chemicals like adhesives, sealants, conformal coatings, etc.?
Softening Point Test Methods
Softening Point Unit Test Method
70°C ASTM E-28-99
Viscosity Test Methods
Viscosity Test Method Temperature
13,000 cPs Brookfield Thermosel Viscometer in Centipoise. 121°C
Work / Pot Time Test Methods
Work / Pot Time Test Method
2.00 min 1/8" semicircular bead, Douglas Fir to Douglas Fir.
Peel Strength Test Methods
Peel Strength Substrate Test Temperature
13 piw Canvas 22°C
Tensile Strength Test Methods
Tensile Strength Test Temperature
380 psi 22°C
Shear Strength Test Methods
Shear Strength Substrate Test Temperature
500 psi Douglas Fir 22°C
High Temperature Resistance Test Methods
High Temperature Resistance Test Method
49°C Temperature at which adhesive fails