• Description for 3M 3755LM

    “Delayed-tack” applied in thin-glue-line ribbon for bonding paper, corrugated, chipboard, P.O.P. displays and exhibits

    *See Terms of Use Below

    Application Type Bond
    1 Part or 2 Part 1 Part
    Material Form Sticks
    Substrate Plastic: Polystyrene Foam, ChipBoard, Paper, Fabric, Corrugated, Uncoated Cardboard, Uncoated Chipboard
    Manufacturer 3M
    Chemistry Hot melt, Jet-melt, Low Melt
    Cure Method Hot melt
    Viscosity (cPs) 13,000
    Color Clear
    High Temperature Resistance (°C) 49
    Key Specifications FDA (U.S. Food & Drug Administration) and/or CFIA (Canadian Food Inspection Agency): FDA 21 CFR 175.105
  • Technical Data

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  • Best Practices

    *See Terms of Use Below

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Work / Pot Time Test Method
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Softening Point Test Methods
Softening Point Unit Test Method
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Shear Strength Substrate Test Temperature
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Tensile Strength Test Temperature
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Peel Strength Test Methods
Peel Strength Substrate Test Temperature
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High Temperature Resistance Test Methods
High Temperature Resistance Test Method
49°C Temperature at which adhesive fails