| Application Type | Bond |
|---|---|
| 1 Part or 2 Part | 1 Part |
| Material Form | Sticks |
| Substrate | Polystyrene Foam, ChipBoard, Fabric, Corrugated, Uncoated Cardboard, Uncoated Chipboard |
| Manufacturer | 3M |
| Chemistry | Hot melt, Jet-melt, Low Melt |
| Cure Method | Hot melt |
| Viscosity (cPs) | 13,000 |
| Color | Clear |
| High Temperature Resistance (°C) | 49 |
| Key Specifications | FDA (U.S. Food & Drug Administration) and/or CFIA (Canadian Food Inspection Agency): FDA 21 CFR 175.105 |
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| Viscosity | Test Method | Temperature |
|---|---|---|
| 13,000 cPs | Brookfield Thermosel Viscometer in Centipoise. | 121°C |
| Work / Pot Time | Test Method |
|---|---|
| 2.00 min | 1/8" semicircular bead, Douglas Fir to Douglas Fir. |
| Softening Point | Unit Test Method |
|---|---|
| 70°C | ASTM E-28-99 |
| Shear Strength | Substrate | Test Temperature |
|---|---|---|
| 500 psi | Douglas Fir | 22°C |
| Tensile Strength | Test Temperature |
|---|---|
| 380 psi | 22°C |
| Peel Strength | Substrate | Test Temperature |
|---|---|---|
| 13 piw | Canvas | 22°C |
| High Temperature Resistance | Test Method |
|---|---|
| 49°C | Temperature at which adhesive fails |
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