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Description for 3M 3755LM
“Delayed-tack” applied in thin-glue-line ribbon for bonding paper, corrugated, chipboard, P.O.P. displays and exhibitsApplication Type Bond 1 Part or 2 Part 1 Part Material Form Sticks Substrate Fabric, Paper, ChipBoard, Polystyrene Foam, Rigid foam, Polystyrene Foam, Corrugated, Flexible Foam, Uncoated Cardboard, Uncoated Chipboard Manufacturer 3M Chemistry Hot melt, Jet-melt, Low Melt Cure Method Hot melt Viscosity (cPs) 13,000 Color Clear High Temperature Resistance (°C) 49 Key Specifications FDA (U.S. Food & Drug Administration) and/or CFIA (Canadian Food Inspection Agency): FDA 21 CFR 175.105
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Softening Point Test Methods
| Softening Point | Unit Test Method |
|---|---|
| 70°C | ASTM E-28-99 |
Viscosity Test Methods
| Viscosity | Test Method | Temperature |
|---|---|---|
| 13,000 cPs | Brookfield Thermosel Viscometer in Centipoise. | 121°C |
Work / Pot Time Test Methods
| Work / Pot Time | Test Method |
|---|---|
| 2.00 min | 1/8" semicircular bead, Douglas Fir to Douglas Fir. |
Peel Strength Test Methods
| Peel Strength | Substrate | Test Temperature |
|---|---|---|
| 13 piw | Canvas | 22°C |
Tensile Strength Test Methods
| Tensile Strength | Test Temperature |
|---|---|
| 380 psi | 22°C |
Shear Strength Test Methods
| Shear Strength | Substrate | Test Temperature |
|---|---|---|
| 500 psi | Douglas Fir | 22°C |
High Temperature Resistance Test Methods
| High Temperature Resistance | Test Method |
|---|---|
| 49°C | Temperature at which adhesive fails |
