3M 3755LM

3M 3755LM Datasheet
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  • Description for 3M 3755LM

    “Delayed-tack” applied in thin-glue-line ribbon for bonding paper, corrugated, chipboard, P.O.P. displays and exhibits

    *See Terms of Use Below

    Application Type Bond
    1 Part or 2 Part 1 Part
    Material Form Sticks
    Substrate Polystyrene Foam, ChipBoard, Paper, Fabric, Rigid foam, Polystyrene Foam, Corrugated, Flexible Foam, Uncoated Cardboard, Uncoated Chipboard
    Manufacturer 3M
    Chemistry Hot melt, Jet-melt, Low Melt
    Cure Method Hot melt
    Viscosity (cPs) 13,000
    Color Clear
    High Temperature Resistance (°C) 49
    Key Specifications FDA (U.S. Food & Drug Administration) and/or CFIA (Canadian Food Inspection Agency): FDA 21 CFR 175.105

  • Technical Data for 3M 3755LM

    *See Terms of Use Below

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 1 Part
    • Material Form
      • Stick - Sticks
    • Substrate
      • Foam - Rigid foam, Flexible Foam, Polystyrene Foam
      • Polystyrene (PS) - Polystyrene Foam
      • Wood - ChipBoard, Corrugated, Uncoated Cardboard, Uncoated Chipboard
      • Fabric
      • Paper
      • Other - Beadboard, Styrene, Canvas
    • Chemistry
    • Application Method
      • Dispenser - Lamination equipment
    • Cure Method
      • Hotmelt - Hot melt
    • Color
      • Clear / Transparent - Clear
    • Key Specifications
      • FDA (U.S. Food & Drug Administration) and/or CFIA (Canadian Food Inspection Agency): 175.105 - FDA 21 CFR 175.105
    Specifications
    Cure Specs
    Application Temperature (°F) 261 to 270
    Viscosity (cPs) 13,000 Test Method
    Softening Point (°C) 70 Test Method
    Tack Free Time (min) Delayed-tack
    Work / Pot Time (min) 2.00 Test Method
    Bond Strength
    Peel Strength (piw) 13 Test Method
    Shear Strength (psi) 500 Test Method
    Tensile Strength (psi) 380 Test Method
    Material Resistance
    High Temperature Resistance (°C) 49 Test Method
    Hardness
    Elongation (%) 400
    Other Properties
    Flash Point (°F) 509.0
    % Solids (%) 100

  • Best Practices for 3M 3755LM

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  • Comparable Materials for 3M 3755LM

    *See Terms of Use Below

    Spec Engine® Results

    • 3M
      3748(3M)

      Good thermal shock resistance • Non-corrosive to copper for many electronic applications • Bonds polyolefins

    • 3M
      3792LM(3M)

      Clear, multi-purpose for wood, coated paper, polyolefins and other heat-sensitive materials • P.O.P. displays

    • Henkel
      Technomelt 232(Henkel)

      A medium setting adhesive with an open time of 15 seconds.

    • Compare All
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Viscosity Test Method Temperature
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Work / Pot Time Test Methods
Work / Pot Time Test Method
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Softening Point Test Methods
Softening Point Unit Test Method
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Shear Strength Test Methods
Shear Strength Substrate Test Temperature
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Tensile Strength Test Methods
Tensile Strength Test Temperature
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Peel Strength Test Methods
Peel Strength Substrate Test Temperature
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High Temperature Resistance Test Methods
High Temperature Resistance Test Method
49°C Temperature at which adhesive fails