• Description for 3M 3762

    Excellent “hot tack”, fast-setting • Economical, general purpose for corrugated packaging, beadboard, recouperage, repacking area • Can bond chipboard and wood

    *See Terms of Use Below

    Manufacturer 3M
    Application Type Bond, Repair, Seal
    1 Part or 2 Part 1 Part
    Material Form Stick
    Substrate Fabric, PolyEthylene, ChipBoard, Polystyrene Foam, Wood, Beadboard, Uncoated Cardboard, Uncoated Chipboard, Coated Cardboard, Coated Chipboard, Douglas Fir
    Chemistry EVA, Jet melt, Hot melt
    Cure Method Hot melt
    Viscosity (cPs) 1,870
    Color Tan
    High Temperature Resistance (°C) 54
    Key Specifications Applicable 21 CFR 175.105 , UL 94 - V2
  • Technical Data

    Overview
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    Specifications
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  • Best Practices

    *See Terms of Use Below

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  • Comparable Materials

    *See Terms of Use Below

Softening Point Test Methods
Softening Point Unit Test Method
94°C ASTM E-28-99
Viscosity Test Methods
Viscosity Test Method Temperature
1,870 cPs Brookfield Thermosel Viscometer in Centipoise. 191°C
Work / Pot Time Test Methods
Work / Pot Time Test Method
0.58 min 1/8" semicircular bead, Douglas Fir to Douglas Fir.
Peel Strength Test Methods
Peel Strength Substrate Test Temperature
7 piw Canvas 22°C
12 (N/10 mm) Canvas 22°C
Tensile Strength Test Methods
Tensile Strength Test Temperature
450 psi 22°C
3.1 (MPa) 22°C
Shear Strength Test Methods
Shear Strength Substrate Test Temperature
545 psi Douglas Fir 22°C
3.7 (MPa) Douglas Fir 22°C
High Temperature Resistance Test Methods
High Temperature Resistance Test Method
54°C Highest temperature that the adhesive will support a 2 psi dead load