• Description for 3M 3762

    Excellent “hot tack”, fast-setting • Economical, general purpose for corrugated packaging, beadboard, recouperage, repacking area • Can bond chipboard and wood

    *See Terms of Use Below

    Application Type Bond, Repair, Seal
    1 Part or 2 Part 1 Part
    Material Form Stick
    Substrate PolyEthylene, ChipBoard, Corrugated, Paper, Fabric, Polystyrene Foam, Wood, Beadboard, Uncoated Cardboard, Uncoated Chipboard, Coated Cardboard, Coated Chipboard, Douglas Fir
    Manufacturer 3M
    Chemistry Hot melt: EVA, Jet melt
    Cure Method Hot melt
    Viscosity (cPs) 1,870
    Color Tan
    High Temperature Resistance (°C) 54
    Key Specifications FDA (U.S. Food & Drug Administration) and/or CFIA (Canadian Food Inspection Agency): Applicable 21 CFR 175.105 , UL 94 - V2
  • Technical Data

    Overview
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    Specifications
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  • Best Practices

    *See Terms of Use Below

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Softening Point Test Methods
Softening Point Unit Test Method
94°C ASTM E-28-99
Viscosity Test Methods
Viscosity Test Method Temperature
1,870 cPs Brookfield Thermosel Viscometer in Centipoise. 191°C
Work / Pot Time Test Methods
Work / Pot Time Test Method
0.58 min 1/8" semicircular bead, Douglas Fir to Douglas Fir.
Shear Strength Test Methods
Shear Strength Substrate Test Temperature
545 psi Douglas Fir 22°C
3.7 (MPa) Douglas Fir 22°C
Tensile Strength Test Methods
Tensile Strength Test Temperature
450 psi 22°C
3.1 (MPa) 22°C
Peel Strength Test Methods
Peel Strength Substrate Test Temperature
7 piw Canvas 22°C
12 (N/10 mm) Canvas 22°C
High Temperature Resistance Test Methods
High Temperature Resistance Test Method
54°C Highest temperature that the adhesive will support a 2 psi dead load