• Description for 3M 3762LM

    Excellent “hot tack”, fast setting • Bonds variety of corrugated packaging, beadboard, recouperage, repacking area • Economical, general purpose • Can bond chipboard and wood

    *See Terms of Use Below

    Application Type Bond, Repair, Seal
    1 Part or 2 Part 1 Part
    Material Form Stick
    Substrate Fabric, Corrugated, PolyEthylene, Uncoated CardBoard, Paper, Polystyrene, Douglas Fir, Polystyrene Foam, Wood, Beadboard, Uncoated Chipboard
    Manufacturer 3M
    Chemistry EVA, Jet melt, Hotmelt, Low Melt
    Cure Method Hot melt
    Viscosity (cPs) 4,000
    Color Light Amber
    High Temperature Resistance (°C) 54
    Key Specifications FDA (U.S. Food & Drug Administration) and/or CFIA (Canadian Food Inspection Agency): FDA 21 CFR 175.105
  • Technical Data

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  • Best Practices

    *See Terms of Use Below

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Peel Strength Substrate Test Temperature
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Tensile Strength Test Temperature
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High Temperature Resistance Test Methods
High Temperature Resistance Test Method
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