• Description for 3M 3762LM

    Excellent “hot tack”, fast setting • Bonds variety of corrugated packaging, beadboard, recouperage, repacking area • Economical, general purpose • Can bond chipboard and wood

    *See Terms of Use Below

    Application Type Bond, Repair, Seal
    1 Part or 2 Part 1 Part
    Material Form Stick
    Substrate Plastic: PolyEthylene, Plastic: Polystyrene, Uncoated CardBoard, Corrugated, Fabric, Plastic: Polystyrene Foam, Douglas Fir, Paper, Wood, Beadboard, Uncoated Chipboard
    Manufacturer 3M
    Chemistry Hot melt: EVA, Jet melt, Low Melt, Hotmelt
    Cure Method Hot melt
    Viscosity (cPs) 4,000
    Color Light Amber
    High Temperature Resistance (°C) 54
    Key Specifications FDA (U.S. Food & Drug Administration) and/or CFIA (Canadian Food Inspection Agency): FDA 21 CFR 175.105
  • Technical Data

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  • Best Practices

    *See Terms of Use Below

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Viscosity Test Methods
Viscosity Test Method Temperature
4,000 cPs Brookfield Thermosel Viscometer in Centipoise. 121°C
Work / Pot Time Test Methods
Work / Pot Time Test Method
0.42 min 1/8" semicircular bead, Douglas Fir to Douglas Fir.
Softening Point Test Methods
Softening Point Unit Test Method
96°C ASTM E-28-99
Shear Strength Test Methods
Shear Strength Substrate Test Temperature
480 psi Douglas Fir 22°C
3.3 (MPa) Douglas Fir 22°C
Tensile Strength Test Methods
Tensile Strength Test Temperature
600 psi 22°C
4.1 (Mpa) 22°C
Peel Strength Test Methods
Peel Strength Substrate Test Temperature
6 piw Canvas 22°C
10 (N/10 mm) Canvas 22°C
High Temperature Resistance Test Methods
High Temperature Resistance Test Method
54°C Temperature at which adhesive fails