• Description for 3M 3762LM

    Excellent “hot tack”, fast setting • Bonds variety of corrugated packaging, beadboard, recouperage, repacking area • Economical, general purpose • Can bond chipboard and wood

    *See Terms of Use Below

    Manufacturer 3M
    Application Type Bond, Repair, Seal
    1 Part or 2 Part 1 Part
    Material Form Stick
    Substrate PolyEthylene, Uncoated CardBoard, Fabric, Polystyrene, Douglas Fir, Polystyrene Foam, Wood, Beadboard, Uncoated Chipboard
    Chemistry EVA, Jet melt, Hotmelt, Low Melt
    Cure Method Hot melt
    Viscosity (cPs) 4,000
    Color Light Amber
    High Temperature Resistance (°C) 54
    Key Specifications FDA 21 CFR 175.105
  • Technical Data

    Overview
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    Specifications
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  • Best Practices

    *See Terms of Use Below

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  • Comparable Materials

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Viscosity Test Methods
Viscosity Test Method Temperature
4,000 cPs Brookfield Thermosel Viscometer in Centipoise. 121°C
Work / Pot Time Test Methods
Work / Pot Time Test Method
0.42 min 1/8" semicircular bead, Douglas Fir to Douglas Fir.
Softening Point Test Methods
Softening Point Unit Test Method
96.0°C ASTM E-28-99
Shear Strength Test Methods
Shear Strength Substrate Test Temperature
480 psi Douglas Fir 22°C
3.3 (MPa) Douglas Fir 22°C
Tensile Strength Test Methods
Tensile Strength Test Temperature
600 psi 22°C
4.1 (Mpa) 22°C
Peel Strength Test Methods
Peel Strength Substrate Test Temperature
6 piw Canvas 22°C
10 (N/10 mm) Canvas 22°C
High Temperature Resistance Test Methods
High Temperature Resistance Test Method
54°C Temperature at which adhesive fails