• Description for 3M 3764

    Bonds variety of plastics including polycarbonate, polyethylene, and polypropylene • Flexible at low temperatures

    *See Terms of Use Below

    Application Type Bond, Seal, Fixture
    1 Part or 2 Part 1 Part
    Material Form Pellets, Stick
    Substrate Ceramic, FRP, Fabric, Glass, Paper, ABS, Polycarbonate, Polypropylene, Corrugated, Phenolic, Polystyrene Foam, PolyEthylene, Rigid Vinyl, Epoxy Board, Foam, Polyolefins, Plastics, Douglas Fir, Polystyrene Foam, Uncoated Cardboard, Flexible Foam, Uncoated Chipboard, Coated Cardboard, Coated Chipboard, Wood
    Industry Electrical, Printed circuit Boards, Food, Cable, Electronics, Bundle Wires, Easily Secure Wires
    Manufacturer 3M
    Chemistry Jet melt, Hot melt: EVA
    Cure Method Hot melt
    Viscosity (cPs) 6,000
    Color Clear
    High Temperature Resistance (°C) 60
    Low Temperature Resistance (°C) Low
    Key Specifications FDA (U.S. Food & Drug Administration) and/or CFIA (Canadian Food Inspection Agency): Applicable 21 CFR 175.105, UL 94 - V2
  • Technical Data for 3M 3764

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 1 Part
    • Material Form
      • Stick
      • Pellets
    • Substrate
      • Ceramic
      • Foam - Flexible Foam, Polystyrene Foam
      • Polyolefin - Polyolefins
      • Glass
      • Plastic - ABS, Plastics
      • Polycarbonate
      • Polypropylene
      • Phenolic
      • Polystyrene (PS) - Polystyrene Foam
      • Polyethylene (LDPE, HDPE) - PolyEthylene
      • Vinyl - Rigid Vinyl
      • Epoxy - Epoxy Board
      • Wood - Corrugated, Douglas Fir, Uncoated Cardboard, Uncoated Chipboard, Coated Cardboard, Coated Chipboard
      • Composites - FRP
      • Fabric
      • Paper
      • Other - Canvas, Cyanoacrylates, Laminate, Leather, Other lightweight materials
    • Industry
      • Food & Beverage - Food
      • Textiles - Shoes, Textile
      • Electronics - Electrical, Easily Secure Wires, Bundle Wires
      • Printed Circuit Board (PCB) - Printed circuit Boards
      • Industrial - Carton, Case, Fasteners, Foam cushioning, Foundries, Games, Leather goods, Luggage liners, Samples, Sand Core, Sings, Toys
      • Cable
      • Construction - Carpets
      • Drug/Pharmaceutical - Chemical, Drug
    • Chemistry
      • Hot melt: EVA (Ethyl Vinyl Acetate) - EVA
      • Other - Jet melt
    • Cure Method
      • Hotmelt - Hot melt
    • Color
      • Clear / Transparent - Clear
    • Key Specifications
      • UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association) - UL 94 - V2
      • FDA (U.S. Food & Drug Administration) and/or CFIA (Canadian Food Inspection Agency): 175.105 - Applicable 21 CFR 175.105
    Specifications
    Cure Specs
    Application Temperature (°F) 351 to 385
    Viscosity (cPs) 6,000 Test Method
    Softening Point (°C) 88, 88 Test Method
    Work / Pot Time (min) 0.67 Test Method
    Bond Strength
    Peel Strength (piw) 14, 23 (N/10mm) Test Method
    Shear Strength (psi) 390, 2.7 (Mpa) Test Method
    Tensile Strength (psi) 650, 652 Test Method
    Material Resistance
    High Temperature Resistance (°C) 60 Test Method
    Impact Resistance Good impact resistance
    Low Temperature Resistance (°C) Low
    Hardness
    Elongation (%) 625
    Flexibility Flexible
    Other Properties
    Flash Point (°F) 514.4
    % Solids (%) 100
    Business Information
    Shelf Life Details Shelf life is 12 months from date of despatch by 3M when stored in the original carton at 21°C (70°F) & 50 % Relative Humidity, When stored at the recommended conditions, this product has a shelf life of 2 years after 3M ships the product to a customer or distributor
    Shelf Life Temperature (°F)
    Shelf Life Type From date of despatch, After 3M ships the product
    Shelf Life (mon) 12, 24
  • Best Practices for 3M 3764

    *See Terms of Use Below

    1. Surface Preparation

      Surfacesmust be clean, dry and dust free. Wipe with a solvent such as isopropyl alcohol for plastic substrates to aid in removing oil and dirt

    2. Application

      3M™Hot Melt Adhesives are designed for application with a 3M™ Hot Melt Applicators. Read and follow the precautions and directions for use in the user’s manual before operating the applicator. 3M™ Hot Melt Adhesives are applied at 350-385°F.

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    *See Terms of Use Below

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Softening Point Test Methods
Softening Point Unit Test Method
88°C ASTM E-28-99
88°C ASTM E28-67 (Ball & Ring Melt Point)
Viscosity Test Methods
Viscosity Test Method Temperature
6,000 cPs Brookfield Thermocel Viscometer in Centipoise using a #27 Spindle @ 10 RPM 191°C
Work / Pot Time Test Methods
Work / Pot Time Test Method
0.67 min 1/8" semicircular bead on non-metallic substrates at 75°F
Peel Strength Test Methods
Peel Strength Substrate Test Temperature
14 piw Canvas 22°C
23 (N/10mm) Canvas 22°C
Tensile Strength Test Methods
Tensile Strength Test Temperature
650 psi 22°C
652 psi 22°C
Shear Strength Test Methods
Shear Strength Substrate Test Temperature
390 psi Douglas Fir 22°C
2.7 (Mpa) Douglas Fir 22°C
High Temperature Resistance Test Methods
High Temperature Resistance Test Method
60°C Temperature at which adhesive fails