| Application Type | Bond, Seal, Fixture |
|---|---|
| 1 Part or 2 Part | 1 Part |
| Material Form | Pellets, Stick |
| Substrate | Ceramic, Fabric, Glass, ABS, Polycarbonate, Polypropylene, Corrugated, Paper, FRP, Plastics, Douglas Fir, PolyEthylene, Uncoated Cardboard, Polyolefins, Uncoated Chipboard, Polystyrene Foam, Coated Cardboard, Rigid Vinyl, Coated Chipboard, Wood |
| Industry | Electronics: Printed circuit Boards |
| Manufacturer | 3M |
| Chemistry | EVA, Jet melt, Hot Melt |
| Cure Method | Hot melt |
| Viscosity (cPs) | 6,000 |
| Color | Clear |
| High Temperature Resistance (°C) | 60 |
| Low Temperature Resistance (°C) | Low |
| Key Specifications | FDA (U.S. Food & Drug Administration) and/or CFIA (Canadian Food Inspection Agency): Applicable 21 CFR 175.105, UL 94 - V2 |
3M™Hot Melt Adhesives are designed for application with a 3M™ Hot Melt Applicators. Read and follow the precautions and directions for use in the user’s manual before operating the applicator. 3M™ Hot Melt Adhesives are applied at 350-385°F.
Surfacesmust be clean, dry and dust free. Wipe with a solvent such as isopropyl alcohol for plastic substrates to aid in removing oil and dirt
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| Softening Point | Unit Test Method |
|---|---|
| 88°C | ASTM E-28-99 |
| 88°C | ASTM E28-67 (Ball & Ring Melt Point) |
| Viscosity | Test Method | Temperature |
|---|---|---|
| 6,000 cPs | Brookfield Thermocel Viscometer in Centipoise using a #27 Spindle @ 10 RPM | 191°C |
| Work / Pot Time | Test Method |
|---|---|
| 0.67 min | 1/8" semicircular bead on non-metallic substrates at 75°F |
| Shear Strength | Substrate | Test Temperature |
|---|---|---|
| 390 psi | Douglas Fir | 22°C |
| 2.7 (Mpa) | Douglas Fir | 22°C |
| Tensile Strength | Test Temperature |
|---|---|
| 650 psi | 22°C |
| 652 psi | 22°C |
| Peel Strength | Substrate | Test Temperature |
|---|---|---|
| 14 piw | Canvas | 22°C |
| 23 (N/10mm) | Canvas | 22°C |
| High Temperature Resistance | Test Method |
|---|---|
| 60°C | Temperature at which adhesive fails |
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