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Description for 3M 3764
Bonds variety of plastics including polycarbonate, polyethylene, and polypropylene • Flexible at low temperaturesApplication Type Bond, Seal, Fixture 1 Part or 2 Part 1-Part Material Form Pellets, Stick Substrate Ceramic, FRP, Fabric, Glass, Paper, Plastics, Polycarbonate, Polypropylene, Corrugated, Phenolic, Polystyrene Foam, PolyEthylene, Rigid Vinyl, Epoxy Board, Foam, Polyolefins, ABS, Uncoated Cardboard, Douglas Fir, Polystyrene Foam, Coated Cardboard, Uncoated Chipboard, Flexible Foam, Coated Chipboard, Wood Industry Electrical, Printed circuit Boards, Shoes, Food, Cable, Carpets, Electronics, Bundle Wires, Easily Secure Wires Manufacturer 3M Chemistry Jet melt, Hot melt: EVA Cure Method Hot melt Application Temperature (°F) 351 to 385 Viscosity (cPs) 6,000 Color Clear High Temperature Resistance (°C) 60 Low Temperature Resistance (°C) Low Key Specifications FDA (U.S. Food & Drug Administration) and/or CFIA (Canadian Food Inspection Agency): Applicable 21 CFR 175.105, UL 94 - V2 -
Technical Data for 3M 3764
Overview
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1 Part or 2 Part
- 1-Part
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Material Form
- Stick
- Pellets
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Substrate
- Ceramic
- Foam - Flexible Foam, Polystyrene Foam
- Polyolefin - Polyolefins
- Glass
- Plastic - Plastics
- Polycarbonate
- Polypropylene
- Phenolic
- Polystyrene (PS) - Polystyrene Foam
- Polyethylene (LDPE, HDPE) - PolyEthylene
- Vinyl - Rigid Vinyl
- Epoxy - Epoxy Board
- ABS
- Wood - Corrugated, Douglas Fir, Uncoated Chipboard, Coated Chipboard
- Composites - FRP
- Fabric
- Paper - Uncoated Cardboard, Coated Cardboard
- Other - Canvas, Cyanoacrylates, Laminate, Leather, Other lightweight materials
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Industry
- Consumer Goods - Shoes
- Food & Beverage - Food
- Textiles - Textile
- Electronics - Electrical, Easily Secure Wires, Bundle Wires
- Printed Circuit Board (PCB) - Printed circuit Boards
- Industrial - Carton, Case, Fasteners, Foam cushioning, Foundries, Games, Leather goods, Luggage liners, Samples, Sand Core, Sings, Toys
- Cable
- Carpet - Carpets
- Drug/Pharmaceutical - Chemical, Drug
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Chemistry
- Hot melt : EVA (Ethyl Vinyl Acetate) - EVA
- Other - Jet melt
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Cure Method
- Hotmelt - Hot melt
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Color
- Clear / Transparent - Clear
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Key Specifications
- UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association) - UL 94 - V2
- FDA (U.S. Food & Drug Administration) and/or CFIA (Canadian Food Inspection Agency) : 175.105 - Applicable 21 CFR 175.105
Specifications
Cure Specs
Application Temperature (°F) 351 to 385 Viscosity (cPs) 6,000 Test Method Softening Point (°C) 88, 88 Test Method Work / Pot Time (min) 0.67 Test Method Bond Strength
Peel Strength (piw) 14, 23 (N/10mm) Test Method Shear Strength (psi) 390, 2.7 (Mpa) Test Method Tensile Strength (psi) 650, 652 Test Method Material Resistance
High Temperature Resistance (°C) 60 Test Method Impact Resistance Good impact resistance Low Temperature Resistance (°C) Low Hardness
Elongation (%) 625 Flexibility Flexible Other Properties
Flash Point (°F) 514.4 % Solids (%) 100 Business Information
Shelf Life Details Shelf life is 12 months from date of despatch by 3M when stored in the original carton at 21°C (70°F) & 50 % Relative Humidity, When stored at the recommended conditions, this product has a shelf life of 2 years after 3M ships the product to a customer or distributor Shelf Life Temperature (°F) Shelf Life Type From date of despatch, After 3M ships the product Shelf Life (mon) 12, 24 -
Best Practices for 3M 3764
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Surface Preparation
Surfacesmust be clean, dry and dust free. Wipe with a solvent such as isopropyl alcohol for plastic substrates to aid in removing oil and dirt
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Application
3M™Hot Melt Adhesives are designed for application with a 3M™ Hot Melt Applicators. Read and follow the precautions and directions for use in the user’s manual before operating the applicator. 3M™ Hot Melt Adhesives are applied at 350-385°F.
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Softening Point Test Methods
Softening Point | Unit Test Method |
---|---|
88°C | ASTM E-28-99 |
88°C | ASTM E28-67 (Ball & Ring Melt Point) |
Viscosity Test Methods
Viscosity | Test Method | Temperature |
---|---|---|
6,000 cPs | Brookfield Thermocel Viscometer in Centipoise using a #27 Spindle @ 10 RPM | 191°C |
Work / Pot Time Test Methods
Work / Pot Time | Test Method |
---|---|
0.67 min | 1/8" semicircular bead on non-metallic substrates at 75°F |
Peel Strength Test Methods
Peel Strength | Substrate | Test Temperature |
---|---|---|
14 piw | Canvas | 22°C |
23 (N/10mm) | Canvas | 22°C |
Tensile Strength Test Methods
Tensile Strength | Test Temperature |
---|---|
650 psi | 22°C |
652 psi | 22°C |
Shear Strength Test Methods
Shear Strength | Substrate | Test Temperature |
---|---|---|
390 psi | Douglas Fir | 22°C |
2.7 (Mpa) | Douglas Fir | 22°C |
High Temperature Resistance Test Methods
High Temperature Resistance | Test Method |
---|---|
60°C | Temperature at which adhesive fails |