• Description for 3M 3764

    Bonds variety of plastics including polycarbonate, polyethylene, and polypropylene • Flexible at low temperatures

    *See Terms of Use Below

    Application Type Bond, Seal, Fixture
    1 Part or 2 Part 1 Part
    Material Form Pellets, Stick
    Substrate Ceramic, Fabric, Glass, ABS, Polycarbonate, Polypropylene, Corrugated, Paper, FRP, Plastics, Douglas Fir, PolyEthylene, Uncoated Cardboard, Polyolefins, Uncoated Chipboard, Polystyrene Foam, Coated Cardboard, Rigid Vinyl, Coated Chipboard, Wood
    Industry Electronics: Printed circuit Boards
    Manufacturer 3M
    Chemistry EVA, Jet melt, Hot Melt
    Cure Method Hot melt
    Viscosity (cPs) 6,000
    Color Clear
    High Temperature Resistance (°C) 60
    Low Temperature Resistance (°C) Low
    Key Specifications FDA (U.S. Food & Drug Administration) and/or CFIA (Canadian Food Inspection Agency): Applicable 21 CFR 175.105, UL 94 - V2
  • Technical Data

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  • Best Practices

    *See Terms of Use Below

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Softening Point Test Methods
Softening Point Unit Test Method
88°C ASTM E-28-99
88°C ASTM E28-67 (Ball & Ring Melt Point)
Viscosity Test Methods
Viscosity Test Method Temperature
6,000 cPs Brookfield Thermocel Viscometer in Centipoise using a #27 Spindle @ 10 RPM 191°C
Work / Pot Time Test Methods
Work / Pot Time Test Method
0.67 min 1/8" semicircular bead on non-metallic substrates at 75°F
Shear Strength Test Methods
Shear Strength Substrate Test Temperature
390 psi Douglas Fir 22°C
2.7 (Mpa) Douglas Fir 22°C
Tensile Strength Test Methods
Tensile Strength Test Temperature
650 psi 22°C
652 psi 22°C
Peel Strength Test Methods
Peel Strength Substrate Test Temperature
14 piw Canvas 22°C
23 (N/10mm) Canvas 22°C
High Temperature Resistance Test Methods
High Temperature Resistance Test Method
60°C Temperature at which adhesive fails