| Application Type | Bond |
|---|---|
| 1 Part or 2 Part | 1 Part |
| Material Form | Sticks |
| Substrate | Fabric, Wood, ABS, Metal, Glass, Ceramic, Uncoated Cardboard, Plastic, Thin Metal , Uncoated Chipboard, Polyolefins, Light-gauge Metal, Coated Cardboard, Coated Chipboard |
| Manufacturer | 3M |
| Chemistry | Hot melt, Low Melt |
| Cure Method | Hot melt |
| Viscosity (cPs) | 8,250 |
| Color | Tan |
| High Temperature Resistance (°C) | 60 |
: Surfaces must be clean, dry and dust free. Wipe with a solvent such as isopropyl alcohol for plastic substrates to aid in removing oil and dirt.
3M™ Hot Melt Adhesives are designed for application with a 3M™ Hot Melt Applicators. Read and follow the precautions and directions for use in the user’s manual before operating the applicator. 3M™ Hot Melt Adhesives are applied at 350-385°F, except the Low Melt (LM) series which are designed to be applied at 250-275°F. LM series are adhesives designed for lower temperature application but still yield long-lasting bonds.
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| Viscosity | Test Method | Temperature |
|---|---|---|
| 8,250 cPs | Brookfield Thermocel Viscometer in Centipoise using a #27 Spindle @ 10 RPM | 121°C |
| Softening Point | Unit Test Method |
|---|---|
| 84°C | ASTM E-28-99 |
| 84°C | ASTM E28-67 |
| Work / Pot Time | Test Method |
|---|---|
| 0.67 min | 1/8" semicircular bead on non-metallic substrates at 75°F |
| Shear Strength | Substrate | Test Temperature |
|---|---|---|
| 600 psi | Douglas Fir | 22°C |
| Tensile Strength | Test Temperature |
|---|---|
| 270 psi | 22°C |
| Peel Strength | Substrate | Test Temperature |
|---|---|---|
| 9 piw | Canvas | 22°C |
| High Temperature Resistance | Test Method |
|---|---|
| 60°C | adhesive will support a 2 psi dead load |
| Flash Point | Test Method |
|---|---|
| 460.4°F | ASTM D 92-72 |
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