| Application Type | Bond, Pot, Fixture |
|---|---|
| 1 Part or 2 Part | 1 Part |
| Material Form | Bulk |
| Substrate | Ceramic, Glass, Polyamide, Flexible Vinyl, plastic , Polyester, Polypropylene, Rubber, Wood, Fabric, Acrylic, PVC, Paper, Vinyl, Cardboard, ABS, Uncoated Cardboard, Uncoated Chipboard, Coated Cardboard, Coated Chipboard |
| Industry | Electronics: Printed circuit Boards |
| Manufacturer | 3M |
| Chemistry | Hot melt |
| Cure Method | Hot melt |
| Viscosity (cPs) | 7,000 |
| Color | Amber |
| Chemical Resistance | Good Fuel Resistance , Good Oil Resistance |
| High Temperature Resistance (°C) | 149, High heat resistance |
| Key Specifications | FDA (U.S. Food & Drug Administration) and/or CFIA (Canadian Food Inspection Agency): Applicable 21 CFR 175.105, UL 94 - VO |
Surfacesmust be clean, dry and dust free. Wipe with a solvent such as isopropyl alcohol for plastic, metal and glass substrates to remove oil and dirt.
3M™Hot Melt Adhesives are designed for application with a 3M™ Hot Melt Applicators. Read and follow the precautions and directions for use in the user’s manual before operating the applicator. 3M™ Hot Melt Adhesives are applied at 350- 385°F. Adhesives yield approximately 430 linear feet per pound of adhesive when extruded as a 1/8” diameter semi-circular bead. Extruded bead sizes can be customized using 3M™ applicator tips.
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| Viscosity | Test Method | Temperature |
|---|---|---|
| 7,000 cPs | Brookfield Thermocel Viscometer in Centipoise using a #27 Spindle @ 10 RPM | 191°C |
| Work / Pot Time | Test Method |
|---|---|
| 0.42 min | 1/8" semicircular bead, Douglas Fir to Douglas Fir. |
| Softening Point | Unit Test Method |
|---|---|
| 163°C | ASTM E28-67 |
| Shear Strength | Substrate | Test Temperature |
|---|---|---|
| 700 psi | Douglas Fir | 22°C |
| Tensile Strength | Test Temperature |
|---|---|
| 2,100 psi | 22°C |
| Peel Strength | Substrate | Test Temperature |
|---|---|---|
| 18 piw | Canvas | 22°C |
| High Temperature Resistance | Test Method |
|---|---|
| 149°C | Temperature at which adhesive fails |
| High heat resistance |
| Impact Resistance | Test Method |
|---|---|
| 22 (IN.-LBS) | IMPACT RESISTANCE (IN.-LBS.) 72°F (22°C) |
| Elongation | Test Method |
|---|---|
| 300 % |
| Flash Point | Test Method |
|---|---|
| 550.4°F | ASTM D 92-72 |
| 550.0°F |
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