3M 3779 Datasheet 3M 3779

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  • Description for 3M 3779

    High heat resistance • High strength • Good fuel and oil resistance

    *See Terms of Use Below

    Chemical Resistance Good Fuel Resistance , Good Oil Resistance
    Application Type Bond, Pot, Fixture
    1 Part or 2 Part 1-Part
    Material Form Bulk
    Substrate Acrylic, Ceramic, Fabric, Glass, Paper, Plastic, Polyester, Polypropylene, PVC, Rubber, Wood, Polyamide, Phenolic, Flexible Vinyl, Epoxy, Rigid foam, ABS, Leather, Cardboard, Uncoated Chipboard, Vinyl, Epoxy Board, Flexible foam, Uncoated Cardboard, Coated Chipboard, Coated Cardboard
    Industry Electrical, Printed circuit Boards, Electronics, Instruments, Wires, Printed Wiring Board, Bundle Wires
    Manufacturer 3M
    Chemistry Hot melt
    Cure Method Hot melt
    Application Temperature (°F) 351 to 385
    Viscosity (cPs) 7,000
    Color Amber
    High Temperature Resistance (°C) 149, High heat resistance
    Density (g/cm³) 0.990
    Key Specifications FDA (U.S. Food & Drug Administration) and/or CFIA (Canadian Food Inspection Agency): Applicable 21 CFR 175.105, UL 94 - VO

  • Technical Data for 3M 3779

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    Overview
    • Chemical Resistance
      • Chemical Resistance - Good Fuel Resistance , Good Oil Resistance
    • Application Type
    • 1 Part or 2 Part
      • 1-Part
    • Material Form
      • Bulk
    • Substrate
    • Industry
      • Electronics - Electrical, Instruments, Printed Wiring Board, Bundle Wires, Wires
      • Printed Circuit Board (PCB) - Printed circuit Boards
    • Chemistry
    • Cure Method
      • Hotmelt - Hot melt
    • Color
      • Red - Amber
    • Key Specifications
      • UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association) - UL 94 - VO
      • FDA (U.S. Food & Drug Administration) and/or CFIA (Canadian Food Inspection Agency) : 175.105 - Applicable 21 CFR 175.105
    Specifications
    Cure Specs
    Application Temperature (°F) 351 to 385
    Viscosity (cPs) 7,000 Test Method
    Set Time (min) Quick setting for potting even at great depth
    Softening Point (°C) 163 Test Method
    Work / Pot Time (min) 0.42 Test Method
    Bond Strength
    General Bond Strength (psi) High
    Peel Strength (piw) 18 Test Method
    Shear Strength (psi) 700 Test Method
    Tensile Strength (psi) 2,100 Test Method
    Material Resistance
    High Temperature Resistance (°C) 149, High heat resistance Test Method
    Impact Resistance 22 (IN.-LBS) Test Method
    Hardness
    Elongation (%) 300 Test Method
    Other Properties
    Flash Point (°F) 550.4, 550.0 Test Method
    % Solids (%) 100
    Density (g/cm³) 0.990
    Business Information
    Shelf Life Details When stored at the recommended conditions, this product has a shelf life of 2 years after 3M ships the product to a customer or distributor.
    Shelf Life Temperature (°F) 120
    Shelf Life (mon) 24

  • Best Practices for 3M 3779

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    1. Surface Preparation

      Surfacesmust be clean, dry and dust free. Wipe with a solvent such as isopropyl alcohol for plastic, metal and glass substrates to remove oil and dirt.

    2. Application

      3M™Hot Melt Adhesives are designed for application with a 3M™ Hot Melt Applicators. Read and follow the precautions and directions for use in the user’s manual before operating the applicator. 3M™ Hot Melt Adhesives are applied at 350- 385°F. Adhesives yield approximately 430 linear feet per pound of adhesive when extruded as a 1/8” diameter semi-circular bead. Extruded bead sizes can be customized using 3M™ applicator tips.

  • Comparable Materials for 3M 3779

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    Spec Engine® Results

    • 3M
      3748 VO(3M)

      A tough, flexible, thermoplastic hot melt, 100% solids adhesive which exhibits good peel adhesion and thermal shock properties along with higher heat resistance.

    • Henkel
      Technomelt PA 682 (e)(Henkel)

      Hot melt adhesive is designed for molding compound applications., Polyamide, Amber, Molding compound thermoplastic, Encapsulation, Operating Temperature -40 to 150 °C

    • Henkel
      Technomelt PA 652 N(Henkel)

      High performance thermoplastic polyamide is designed to meet low pressure molding process requirements. This product can be processed at low processing pressure due to its low viscosity, allowing encapsulation of fragile components without damage.

    • Compare All
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Softening Point Test Methods
Softening Point Unit Test Method
163°C ASTM E28-67
Viscosity Test Methods
Viscosity Test Method Temperature
7,000 cPs Brookfield Thermocel Viscometer in Centipoise using a #27 Spindle @ 10 RPM 191°C
Work / Pot Time Test Methods
Work / Pot Time Test Method
0.42 min 1/8" semicircular bead, Douglas Fir to Douglas Fir.
Peel Strength Test Methods
Peel Strength Substrate Test Temperature
18 piw Canvas 22°C
Tensile Strength Test Methods
Tensile Strength Test Temperature
2,100 psi 22°C
Shear Strength Test Methods
Shear Strength Substrate Test Temperature
700 psi Douglas Fir 22°C
High Temperature Resistance Test Methods
High Temperature Resistance Test Method
149°C Temperature at which adhesive fails
High heat resistance
Impact Resistance Test Methods
Impact Resistance Test Method
22 (IN.-LBS) IMPACT RESISTANCE (IN.-LBS.) 72°F (22°C)
Elongation Test Methods
Elongation Test Method
300 %
Flash Point Test Methods
Flash Point Test Method
288.0°C ASTM D 92-72
287.8°C