| Application Type | Bond |
|---|---|
| 1 Part or 2 Part | 1 Part |
| Material Form | Sticks |
| Substrate | Acrylic, Fabric, ABS, Polycarbonate, CardBoard, Paper, PVC, FRP, Polyolefins, Wood, Corrugated, Rigid Vinyl, Uncoated Cardboard, Plastics, Uncoated Chipboard, Coated Cardboard, Coated Chipboard |
| Industry | Core |
| Manufacturer | 3M |
| Chemistry | Hot melt |
| Cure Method | Hot melt |
| Viscosity (cPs) | 5,000 |
| Color | Clear |
| High Temperature Resistance (°C) | 60 |
| Key Specifications | FDA (U.S. Food & Drug Administration) and/or CFIA (Canadian Food Inspection Agency): Applicable 21 CFR 175.105 , UL 94 - V2 |
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| Viscosity | Test Method | Temperature |
|---|---|---|
| 5,000 cPs | Brookfield Thermosel Viscometer in Centipoise. | 191°C |
| Work / Pot Time | Test Method |
|---|---|
| 0.83 min | 1/8" semicircular bead, Douglas Fir to Douglas Fir. |
| Softening Point | Unit Test Method |
|---|---|
| 81°C | ASTM E-28-99 |
| Shear Strength | Substrate | Test Temperature |
|---|---|---|
| 250 psi | Douglas Fir | 22°C |
| Tensile Strength | Test Temperature |
|---|---|
| 400 psi | 22°C |
| Peel Strength | Substrate | Test Temperature |
|---|---|---|
| 13 piw | Canvas | 22°C |
| High Temperature Resistance | Test Method |
|---|---|
| 60°C | Temperature at which adhesive fails |
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