• Description for 3M 3797

    High ball and ring • Low viscosity • Good for electrical potting

    *See Terms of Use Below

    Application Type Bond, Pot, Fixture
    1 Part or 2 Part 1 Part
    Material Form Sticks
    Substrate Aluminum, Ceramic, Plastic: Epoxy Board, Plastic: Phenolics, Glass, Polypropylene, Douglas fir
    Industry Electrical, Electronics: Printed circuit Boards, Electronics, Instruments, Easily secure Wires, Bundle Wires, Cable strain relief
    Manufacturer 3M
    Chemistry Hot melt
    Cure Method Hot melt
    Viscosity (cPs) Low, 2,650
    Color Off White
    High Temperature Resistance (°C) 77
    Key Specifications FDA (U.S. Food & Drug Administration) and/or CFIA (Canadian Food Inspection Agency): Applicable 21 CFR 175.105 , UL 94 - V2
  • Technical Data

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  • Best Practices

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Work / Pot Time Test Methods
Work / Pot Time Test Method
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Softening Point Test Methods
Softening Point Unit Test Method
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Shear Strength Test Methods
Shear Strength Substrate Test Temperature
350 psi Douglas Fir 22°C
Tensile Strength Test Methods
Tensile Strength Test Temperature
283 psi 22°C
Peel Strength Test Methods
Peel Strength Substrate Test Temperature
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High Temperature Resistance Test Methods
High Temperature Resistance Test Method
77°C Temperature at which adhesive fails