| Application Type | Bond, Pot, Fixture |
|---|---|
| 1 Part or 2 Part | 1 Part |
| Material Form | Sticks |
| Substrate | Aluminum, Ceramic, Plastic: Epoxy Board, Plastic: Phenolics, Glass, Polypropylene, Douglas fir |
| Industry | Electrical, Electronics: Printed circuit Boards, Electronics, Instruments, Easily secure Wires, Bundle Wires, Cable strain relief |
| Manufacturer | 3M |
| Chemistry | Hot melt |
| Cure Method | Hot melt |
| Viscosity (cPs) | Low, 2,650 |
| Color | Off White |
| High Temperature Resistance (°C) | 77 |
| Key Specifications | FDA (U.S. Food & Drug Administration) and/or CFIA (Canadian Food Inspection Agency): Applicable 21 CFR 175.105 , UL 94 - V2 |
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| Viscosity | Test Method | Temperature |
|---|---|---|
| Low | ||
| 2,650 cPs | Brookfield Thermosel Viscometer in Centipoise. | 191°C |
| Work / Pot Time | Test Method |
|---|---|
| 0.50 min | 1/8" semicircular bead, Douglas Fir to Douglas Fir. |
| Softening Point | Unit Test Method |
|---|---|
| 151°C | ASTM E-28-99 |
| Shear Strength | Substrate | Test Temperature |
|---|---|---|
| 350 psi | Douglas Fir | 22°C |
| Tensile Strength | Test Temperature |
|---|---|
| 283 psi | 22°C |
| Peel Strength | Substrate | Test Temperature |
|---|---|---|
| 10 piw | Canvas | 22°C |
| High Temperature Resistance | Test Method |
|---|---|
| 77°C | Temperature at which adhesive fails |
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