3M 3797

3M 3797 Datasheet
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  • Description for 3M 3797

    High ball and ring • Low viscosity • Good for electrical potting

    *See Terms of Use Below

    Application Type Bond, Pot, Fixture
    1 Part or 2 Part 1 Part
    Material Form Sticks
    Substrate Aluminum, Ceramic, Epoxy Board, Phenolics, Glass, Polypropylene, Douglas fir
    Industry Electrical, Printed circuit Boards, Cable strain relief, Electronics, Instruments, Easily secure Wires, Bundle Wires
    Manufacturer 3M
    Chemistry Hot melt
    Cure Method Hot melt
    Viscosity (cPs) Low, 2,650
    Color Off White
    High Temperature Resistance (°C) 77
    Key Specifications FDA (U.S. Food & Drug Administration) and/or CFIA (Canadian Food Inspection Agency): Applicable 21 CFR 175.105 , UL 94 - V2

  • Technical Data for 3M 3797

    *See Terms of Use Below

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 1 Part
    • Material Form
      • Stick - Sticks
    • Substrate
    • Industry
      • Electronics - Electrical, Instruments, Bundle Wires, Easily secure Wires
      • Printed Circuit Board (PCB) - Printed circuit Boards
      • Cable - Cable strain relief
    • Chemistry
    • Application Method
      • Dispenser - Application equipment
      • Flow - Flow equipment
    • Cure Method
      • Hotmelt - Hot melt
    • Color
      • Off-White - Off White
    • Key Specifications
      • UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association) - UL 94 - V2
      • FDA (U.S. Food & Drug Administration) and/or CFIA (Canadian Food Inspection Agency): 175.105 - Applicable 21 CFR 175.105
    Specifications
    Cure Specs
    Application Temperature (°F) 351 to 385
    Viscosity (cPs) Low, 2,650 Test Method
    Softening Point (°C) 151 Test Method
    Work / Pot Time (min) 0.50 Test Method
    Bond Strength
    Peel Strength (piw) 10 Test Method
    Shear Strength (psi) 350 Test Method
    Tensile Strength (psi) 283 Test Method
    Material Resistance
    High Temperature Resistance (°C) 77 Test Method
    Hardness
    Elongation (%) 98
    Other Properties
    Flash Point (°F) 570.2
    % Solids (%) 100

  • Best Practices for 3M 3797

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  • Comparable Materials for 3M 3797

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    Spec Engine® Results

    • 3M
      3748 VO(3M)

      A tough, flexible, thermoplastic hot melt, 100% solids adhesive which exhibits good peel adhesion and thermal shock properties along with higher heat resistance.

    • Henkel
      Technomelt PA 7901(Henkel)

      A low viscosity, high melting adhesive used extensively for potting and encapsulating in the electronics industry.

    • Compare All
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Viscosity Test Methods
Viscosity Test Method Temperature
Low
2,650 cPs Brookfield Thermosel Viscometer in Centipoise. 191°C
Work / Pot Time Test Methods
Work / Pot Time Test Method
0.50 min 1/8" semicircular bead, Douglas Fir to Douglas Fir.
Softening Point Test Methods
Softening Point Unit Test Method
151°C ASTM E-28-99
Shear Strength Test Methods
Shear Strength Substrate Test Temperature
350 psi Douglas Fir 22°C
Tensile Strength Test Methods
Tensile Strength Test Temperature
283 psi 22°C
Peel Strength Test Methods
Peel Strength Substrate Test Temperature
10 piw Canvas 22°C
High Temperature Resistance Test Methods
High Temperature Resistance Test Method
77°C Temperature at which adhesive fails