• Description for 3M 3797

    High ball and ring • Low viscosity • Good for electrical potting

    *See Terms of Use Below

    Application Type Bond, Pot, Fixture
    1 Part or 2 Part 1 Part
    Material Form Sticks
    Substrate Aluminum, Ceramic, Glass, Polypropylene, Douglas fir, Phenolics, Epoxy Board
    Industry Electrical, Printed circuit Boards, Cable strain relief, Electronics, Instruments, Easily secure Wires, Bundle Wires
    Manufacturer 3M
    Chemistry Hot melt
    Cure Method Hot melt
    Viscosity (cPs) Low, 2,650
    Color Off White
    High Temperature Resistance (°C) 77
    Key Specifications FDA (U.S. Food & Drug Administration) and/or CFIA (Canadian Food Inspection Agency): Applicable 21 CFR 175.105 , UL 94 - V2

Popular Articles

Hot Melt Adhesives in the Textile Industry

Read Article

Testing the effectiveness of surface treatments

Read Article

What to know about Hot Melt Adhesives

Read Article

Infographic: ENSURING A STRONG BOND - 6 Basic Methods of Surface Preparation

Read Article

Sponsored Articles

Unique Advantages of Contact Adhesives

Read Article

Using LOCTITE® 454™ is a Valid Option for Engineers Working with a Wide Variety of Materials

Read Article

Sylgard 184 by DOW is the Top Choice for a Transparent, Silicone Encapsulant. Read Why:

Read Article

Case Study: Creating reliable, corrosion-free bonds with LORD® 406 acrylic adhesive

Read Article

Featured Ads

Gluespec Poll

When you're researching or sourcing materials online, what device are you using?
Softening Point Test Methods
Softening Point Unit Test Method
151°C ASTM E-28-99
Viscosity Test Methods
Viscosity Test Method Temperature
Low
2,650 cPs Brookfield Thermosel Viscometer in Centipoise. 191°C
Work / Pot Time Test Methods
Work / Pot Time Test Method
0.50 min 1/8" semicircular bead, Douglas Fir to Douglas Fir.
Peel Strength Test Methods
Peel Strength Substrate Test Temperature
10 piw Canvas 22°C
Tensile Strength Test Methods
Tensile Strength Test Temperature
283 psi 22°C
Shear Strength Test Methods
Shear Strength Substrate Test Temperature
350 psi Douglas Fir 22°C
High Temperature Resistance Test Methods
High Temperature Resistance Test Method
77°C Temperature at which adhesive fails