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Description for 3M 3797
High ball and ring • Low viscosity • Good for electrical pottingApplication Type Bond, Pot, Fixture 1 Part or 2 Part 1 Part Material Form Sticks Substrate Aluminum, Ceramic, Glass, Polypropylene, Douglas fir, Phenolics, Epoxy Board Industry Electrical, Printed circuit Boards, Cable strain relief, Electronics, Instruments, Easily secure Wires, Bundle Wires Manufacturer 3M Chemistry Hot melt Cure Method Hot melt Viscosity (cPs) Low, 2,650 Color Off White High Temperature Resistance (°C) 77 Key Specifications FDA (U.S. Food & Drug Administration) and/or CFIA (Canadian Food Inspection Agency): Applicable 21 CFR 175.105 , UL 94 - V2
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Softening Point Test Methods
| Softening Point | Unit Test Method |
|---|---|
| 151°C | ASTM E-28-99 |
Viscosity Test Methods
| Viscosity | Test Method | Temperature |
|---|---|---|
| Low | ||
| 2,650 cPs | Brookfield Thermosel Viscometer in Centipoise. | 191°C |
Work / Pot Time Test Methods
| Work / Pot Time | Test Method |
|---|---|
| 0.50 min | 1/8" semicircular bead, Douglas Fir to Douglas Fir. |
Peel Strength Test Methods
| Peel Strength | Substrate | Test Temperature |
|---|---|---|
| 10 piw | Canvas | 22°C |
Tensile Strength Test Methods
| Tensile Strength | Test Temperature |
|---|---|
| 283 psi | 22°C |
Shear Strength Test Methods
| Shear Strength | Substrate | Test Temperature |
|---|---|---|
| 350 psi | Douglas Fir | 22°C |
High Temperature Resistance Test Methods
| High Temperature Resistance | Test Method |
|---|---|
| 77°C | Temperature at which adhesive fails |
