| Manufacturer | 3M |
|---|---|
| Application Type | Bond |
| 1 Part or 2 Part | 1 Part |
| Material Form | Sticks |
| Substrate | PolyEthylene, Corrugated, Polystyrene Foam, ThermoPlastic |
| Chemistry | Thermoplastic, Hot melt, Solvent-Free |
| Cure Method | Hot melt |
| Cure Temperature (°C) | 49 to 0 |
| Viscosity (cPs) | 9,500 |
| Color | Off White |
| High Temperature Resistance (°C) | 130 |
| Key Specifications | FDA 21 CFR 175.105 |
3M™ Scotch-Weld™ Hot Melt Adhesive 3798 LM is designed for application using a 3M™ Scotch-Weld™ Hot Melt LT Applicator (5/8" x 2") at 265°F (129°C). This applicator is designed exclusively for low-melt adhesives. Apply to one surface. Make bond as soon as possible. Bond strength is maximized when open time is reduced. After the bond is made, there is immediate strength and no clamping is necessary. Optimum release on some substrates may require up to a 24 hour dwell time for clean removal. Adhesive may bleed onto porous surfaces or cause staining. It is advisable to evaluate the adhesive on a test substrate for undesirable effect.
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