• Description for 3M 406

    A flexible, light colored, thermoplastic adhesive bonding film which exhibits good adhesion to a variety of substrates, especially metals.

    *See Terms of Use Below

    Application Type Bond
    1 Part or 2 Part 1 Part
    Material Form Film
    Substrate Acrylic, Aluminum, Etched, FR-4 PCB, Glass, Metal, Nylon 6,6, ABS, Thermoplastic, Polycarbonate, Polyester, Polypropylene, PVC, Cold Rolled Steel, HDPE, Polyimide, SBR Rubber, Nitrile Rubber, Stainless Steel, Aluminum foil , Aluminum
    Manufacturer 3M
    Chemistry Ethylene Acrylic Acid Copolymer
    Cure Method Pressure Sensitive
    Color Light color, Translucent
    Relative Solvent Resistance Chemical Resistance: Good solvent resistance
    Key Specifications Meets RoHS 2002/95/EC
  • Technical Data for 3M 406

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 1 Part
    • Material Form
      • Film
    • Substrate
    • Chemistry
      • Acrylic - Ethylene Acrylic Acid Copolymer
    • Cure Method
      • Pressure Sensitive (min) - Pressure Sensitive
    • Color
      • Translucent
      • Other - Light color
    • Key Specifications
      • RoHS (Restriction of Hazardous Substances) - Meets RoHS 2002/95/EC
    Specifications
    Cure Specs
    Fixture or Handling Strength Time (min) Quick
    Softening Point (°C) 149 to 160
    Bond Strength
    General Bond Strength (psi) Good
    Peel Strength (piw) 17, 4, 17, 2, 10, 1, 4, 2, 12, 12, 9, 15, 17, 18, 17, 16, 17, 18, 19, 18, 15, 0, 0, 0, 1, 1, 2, 5, 6, 6, 7, 8, 8, 8, 8, 8, 9, 9, 10, 11, 11, 10, 10, 10, 6, 9, 11, 14, 13, 17, 13, 13, 1, 2, 2, 2, 2, 3, 5, 5 Test Method
    Shear Strength (psi) 1,160, 740, 1,090, 70, 260, 1,120, 80, 140, 1,160, 1,090, 990, 910, 590 Test Method
    Tensile Strength (psi) 2,600 Test Method
    Material Resistance
    Conductivity
    Dissipation Factor 0.00500, 0.00100, 0.00100, 0.00600 Test Method
    Dielectric Strength (V/mil) 2,300 Test Method
    Dielectric Constant 2.40, 2.40, 2.40, 2.40 Test Method
    Volume Resistivity (O) 5.9 x 10(17) (ohm-cm) Test Method
    Hardness
    Elongation (%) 750 Test Method
    Flexibility Flexible
    Other Properties
    % Solids (%) 100
    Business Information
    Shelf Life Details Storage: Store in a dry (preferably <50% RH) location at 35°F (2°C) to 80°F (27°C)., Shelf life is 2 years from the date of shipment under storage conditions mentioned above., 5-year shelf life from date of manufacture when stored in a humidity controlled storage (10°C/50°F to 27°C/80°F and <75% relative humidity).
    Shelf Life Temperature (°F) 36 to 81, 50 to 81
    Shelf Life Type From date of shipment., From date of manufacture
    Shelf Life (mon) 24, 61
  • Best Practices for 3M 406

    *See Terms of Use Below

    1. Surface Preparation

      Solvents, such as acetone, methyl ethyl ketone (MEK), toluene and 3M™ Citrus Based Cleaner will soften this bonding film adhesive and can be used to remove excess adhesive in unwanted areas. Soaking bonds in these solvents can also aid in debonding operations where appropriate.

      Note: When using solvents, extinguish all ignition sources and follow the manufacturer’s precautions and directions for use.

    2. Application

      To make a bond using 3M™ Bonding Film 406, the adhesive can be first tacked (lightly bonded) to one of the substrates using low heat, and placing the second substrate to the exposed adhesive surface, making the bond using heat and pressure.

      Alternatively, place the adhesive film between the two substrates and make the bond through heat and pressure using a heated press, a hot roll laminator, a hot shoe thermode method or similar equipment.

      One approach to establishing the optimum bonding conditions for a user’s application is to evaluate a series of bonding temperatures, for example 250, 270, 290 and 310°F (121, 132, 143 and 154°C). Time and pressure will be dictated by the thickness of the substrate and the type of substrate being bonded. Thicker substrates and more difficult to bond surfaces will require longer times, higher pressures and/or higher temperatures.

      Once the bond is made, the bondline should be allowed to cool somewhat before stress is applied to the bond. Generally, cooling the bondline below 200°F (93°C) is adequate to allow the bonded parts to be unfixtured/unclamped and handled. For reference, the following table shows typical bond strengths for bonds made at various temperatures. Such a table can be used to evaluate optimum bondline temperatures. It is very important to note that this table is valid only for the specific substrates shown. Varying temperature, pressure, or substrates can affect bond strengths. User should develop a similar table using the specific substrates involved.

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    *See Terms of Use Below

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Peel Strength Test Methods
Peel Strength Type Cure Temperature Cure Humidity Substrate Test Time Test Temperature Test Method
17 piw 90° Peel Strength 160°C Cold Rolled Steel Peel bonds made bonding 4.5 mil aluminum foil to test substrates using 320°F (160°C) bondline temperature, 2 seconds dwell, 14 lbs gauge pressure., Adhesion tests done @ 2 in/minute for peel.
4 piw 90° Peel Strength 160°C Stainless Steel Peel bonds made bonding 4.5 mil aluminum foil to test substrates using 320°F (160°C) bondline temperature, 2 seconds dwell, 14 lbs gauge pressure., Adhesion tests done @ 2 in/minute for peel.
17 piw 90° Peel Strength 160°C Aluminum, Etched Peel bonds made bonding 4.5 mil aluminum foil to test substrates using 320°F (160°C) bondline temperature, 2 seconds dwell, 14 lbs gauge pressure., Adhesion tests done @ 2 in/minute for peel.
2 piw 90° Peel Strength 160°C Polycarbonate Peel bonds made bonding 4.5 mil aluminum foil to test substrates using 320°F (160°C) bondline temperature, 2 seconds dwell, 14 lbs gauge pressure., Adhesion tests done @ 2 in/minute for peel.
10 piw 90° Peel Strength 160°C FR-4 PCB Peel bonds made bonding 4.5 mil aluminum foil to test substrates using 320°F (160°C) bondline temperature, 2 seconds dwell, 14 lbs gauge pressure., Adhesion tests done @ 2 in/minute for peel.
1 piw 90° Peel Strength 160°C Polypropylene Peel bonds made bonding 4.5 mil aluminum foil to test substrates using 320°F (160°C) bondline temperature, 2 seconds dwell, 14 lbs gauge pressure., Adhesion tests done @ 2 in/minute for peel.
4 piw 90° Peel Strength 160°C Nylon 6,6 Peel bonds made bonding 4.5 mil aluminum foil to test substrates using 320°F (160°C) bondline temperature, 2 seconds dwell, 14 lbs gauge pressure., Adhesion tests done @ 2 in/minute for peel.
2 piw 90° Peel Strength 160°C Glass Peel bonds made bonding 4.5 mil aluminum foil to test substrates using 320°F (160°C) bondline temperature, 2 seconds dwell, 14 lbs gauge pressure., Adhesion tests done @ 2 in/minute for peel.
12 piw 90° Peel Strength 160°C SBR Rubber Peel bonds made bonding 4.5 mil aluminum foil to test substrates using 320°F (160°C) bondline temperature, 2 seconds dwell, 14 lbs gauge pressure., Adhesion tests done @ 2 in/minute for peel.
12 piw 90° Peel Strength 160°C Nitrile Rubber Peel bonds made bonding 4.5 mil aluminum foil to test substrates using 320°F (160°C) bondline temperature, 2 seconds dwell, 14 lbs gauge pressure., Adhesion tests done @ 2 in/minute for peel.
9 piw 90° Peel Strength 160°C Polyimide Peel bonds made bonding 4.5 mil aluminum foil to test substrates using 320°F (160°C) bondline temperature, 2 seconds dwell, 14 lbs gauge pressure., Adhesion tests done @ 2 in/minute for peel.
15 piw 90° Peel Strength 160°C 95 % etched eluminum Peel bonds made bonding 4 mil etched aluminum to 63 mil etched aluminum using 320°F (160°C) bondline temperature, 2 seconds dwell, 10 lbs gauge pressure., Peel tests @ 2 in/minute.
17 piw 90° Peel Strength 160°C 95 % eitched aluminum 66°C Peel bonds made bonding 4 mil etched aluminum to 63 mil etched aluminum using 320°F (160°C) bondline temperature, 2 seconds dwell, 10 lbs gauge pressure., Peel tests @ 2 in/minute.
18 piw 90° Peel Strength 160°C 95 % eitched aluminum 8,640 min 66°C Peel bonds made bonding 4 mil etched aluminum to 63 mil etched aluminum using 320°F (160°C) bondline temperature, 2 seconds dwell, 10 lbs gauge pressure., Peel tests @ 2 in/minute.
17 piw 90° Peel Strength 160°C 95 % eitched aluminum 30,240 min 85°C Peel bonds made bonding 4 mil etched aluminum to 63 mil etched aluminum using 320°F (160°C) bondline temperature, 2 seconds dwell, 10 lbs gauge pressure., Peel tests @ 2 in/minute.
16 piw 90° Peel Strength 160°C eitched aluminum 8,640 min 85°C Peel bonds made bonding 4 mil etched aluminum to 63 mil etched aluminum using 320°F (160°C) bondline temperature, 2 seconds dwell, 10 lbs gauge pressure., Peel tests @ 2 in/minute.
17 piw 90° Peel Strength 160°C aluminum foil 30,240 min 24°C Peel bonds made bonding 4.5 mil aluminum foil to test substrates using 320°F (160°C) bondline temperature, 2 seconds dwell, 14 lbs gauge pressure., Adhesion tests done @ 2 in/minute for peel.
18 piw 90° Peel Strength 160°C aluminum foil 38°C Peel bonds made bonding 4.5 mil aluminum foil to test substrates using 320°F (160°C) bondline temperature, 2 seconds dwell, 14 lbs gauge pressure., Adhesion tests done @ 2 in/minute for peel.
19 piw 90° Peel Strength 160°C aluminum foil 52°C Peel bonds made bonding 4.5 mil aluminum foil to test substrates using 320°F (160°C) bondline temperature, 2 seconds dwell, 14 lbs gauge pressure., Adhesion tests done @ 2 in/minute for peel.
18 piw 90° Peel Strength 160°C aluminum foil 66°C Peel bonds made bonding 4.5 mil aluminum foil to test substrates using 320°F (160°C) bondline temperature, 2 seconds dwell, 14 lbs gauge pressure., Adhesion tests done @ 2 in/minute for peel.
15 piw 90° Peel Strength 160°C aluminum foil 79°C Peel bonds made bonding 4.5 mil aluminum foil to test substrates using 320°F (160°C) bondline temperature, 2 seconds dwell, 14 lbs gauge pressure., Adhesion tests done @ 2 in/minute for peel.
0 piw T-Peel Strength AL/AL 49°C Bonds made using 3 second dwell, 5 lbs gauge pressure., Peels done at 90° angle, 2 in/minute, Instron tester., AL is 4.5 mil etched aluminum foil.
0 piw T-Peel Strength AL/AL 54°C Bonds made using 3 second dwell, 5 lbs gauge pressure., Peels done at 90° angle, 2 in/minute, Instron tester., AL is 4.5 mil etched aluminum foil.
0 piw T-Peel Strength AL/AL 60°C Bonds made using 3 second dwell, 5 lbs gauge pressure., Peels done at 90° angle, 2 in/minute, Instron tester., AL is 4.5 mil etched aluminum foil.
1 piw T-Peel Strength AL/AL 66°C Bonds made using 3 second dwell, 5 lbs gauge pressure., Peels done at 90° angle, 2 in/minute, Instron tester., AL is 4.5 mil etched aluminum foil.
1 piw T-Peel Strength AL/AL 71°C Bonds made using 3 second dwell, 5 lbs gauge pressure., Peels done at 90° angle, 2 in/minute, Instron tester., AL is 4.5 mil etched aluminum foil.
2 piw T-Peel Strength AL/AL 77°C Bonds made using 3 second dwell, 5 lbs gauge pressure., Peels done at 90° angle, 2 in/minute, Instron tester., AL is 4.5 mil etched aluminum foil.
5 piw T-Peel Strength AL/AL 82°C Bonds made using 3 second dwell, 5 lbs gauge pressure., Peels done at 90° angle, 2 in/minute, Instron tester., AL is 4.5 mil etched aluminum foil.
6 piw T-Peel Strength AL/AL 88°C Bonds made using 3 second dwell, 5 lbs gauge pressure., Peels done at 90° angle, 2 in/minute, Instron tester., AL is 4.5 mil etched aluminum foil.
6 piw T-Peel Strength AL/AL 93°C Bonds made using 3 second dwell, 5 lbs gauge pressure., Peels done at 90° angle, 2 in/minute, Instron tester., AL is 4.5 mil etched aluminum foil.
7 piw T-Peel Strength AL/AL 99°C Bonds made using 3 second dwell, 5 lbs gauge pressure., Peels done at 90° angle, 2 in/minute, Instron tester., AL is 4.5 mil etched aluminum foil.
8 piw T-Peel Strength AL/AL 104°C Bonds made using 3 second dwell, 5 lbs gauge pressure., Peels done at 90° angle, 2 in/minute, Instron tester., AL is 4.5 mil etched aluminum foil.
8 piw T-Peel Strength AL/AL 110°C Bonds made using 3 second dwell, 5 lbs gauge pressure., Peels done at 90° angle, 2 in/minute, Instron tester., AL is 4.5 mil etched aluminum foil.
8 piw T-Peel Strength AL/AL 116°C Bonds made using 3 second dwell, 5 lbs gauge pressure., Peels done at 90° angle, 2 in/minute, Instron tester., AL is 4.5 mil etched aluminum foil.
8 piw T-Peel Strength AL/AL 121°C Bonds made using 3 second dwell, 5 lbs gauge pressure., Peels done at 90° angle, 2 in/minute, Instron tester., AL is 4.5 mil etched aluminum foil.
8 piw T-Peel Strength AL/AL 127°C Bonds made using 3 second dwell, 5 lbs gauge pressure., Peels done at 90° angle, 2 in/minute, Instron tester., AL is 4.5 mil etched aluminum foil.
9 piw T-Peel Strength AL/AL 132°C Bonds made using 3 second dwell, 5 lbs gauge pressure., Peels done at 90° angle, 2 in/minute, Instron tester., AL is 4.5 mil etched aluminum foil.
9 piw T-Peel Strength AL/AL 138°C Bonds made using 3 second dwell, 5 lbs gauge pressure., Peels done at 90° angle, 2 in/minute, Instron tester., AL is 4.5 mil etched aluminum foil.
10 piw T-Peel Strength AL/AL 141°C Bonds made using 3 second dwell, 5 lbs gauge pressure., Peels done at 90° angle, 2 in/minute, Instron tester., AL is 4.5 mil etched aluminum foil.
11 piw T-Peel Strength AL/AL 149°C Bonds made using 3 second dwell, 5 lbs gauge pressure., Peels done at 90° angle, 2 in/minute, Instron tester., AL is 4.5 mil etched aluminum foil.
11 piw T-Peel Strength AL/AL 154°C Bonds made using 3 second dwell, 5 lbs gauge pressure., Peels done at 90° angle, 2 in/minute, Instron tester., AL is 4.5 mil etched aluminum foil.
10 piw T-Peel Strength AL/AL 160°C Bonds made using 3 second dwell, 5 lbs gauge pressure., Peels done at 90° angle, 2 in/minute, Instron tester., AL is 4.5 mil etched aluminum foil.
10 piw T-Peel Strength AL/AL 166°C Bonds made using 3 second dwell, 5 lbs gauge pressure., Peels done at 90° angle, 2 in/minute, Instron tester., AL is 4.5 mil etched aluminum foil.
10 piw T-Peel Strength AL/AL 171°C Bonds made using 3 second dwell, 5 lbs gauge pressure., Peels done at 90° angle, 2 in/minute, Instron tester., AL is 4.5 mil etched aluminum foil.
6 piw T-Peel Strength AL/CRS 116°C Bonds made using 3 second dwell, 5 lbs gauge pressure., Peels done at 90° angle, 2 in/minute, Instron tester., AL is 4.5 mil etched aluminum foil.
9 piw T-Peel Strength AL/CRS 124°C Bonds made using 3 second dwell, 5 lbs gauge pressure., Peels done at 90° angle, 2 in/minute, Instron tester., AL is 4.5 mil etched aluminum foil.
11 piw T-Peel Strength AL/CRS 132°C Bonds made using 3 second dwell, 5 lbs gauge pressure., Peels done at 90° angle, 2 in/minute, Instron tester., AL is 4.5 mil etched aluminum foil.
14 piw T-Peel Strength AL/CRS 141°C Bonds made using 3 second dwell, 5 lbs gauge pressure., Peels done at 90° angle, 2 in/minute, Instron tester., AL is 4.5 mil etched aluminum foil.
13 piw T-Peel Strength AL/CRS 149°C Bonds made using 3 second dwell, 5 lbs gauge pressure., Peels done at 90° angle, 2 in/minute, Instron tester., AL is 4.5 mil etched aluminum foil.
17 piw T-Peel Strength AL/CRS 157°C Bonds made using 3 second dwell, 5 lbs gauge pressure., Peels done at 90° angle, 2 in/minute, Instron tester., AL is 4.5 mil etched aluminum foil.
13 piw T-Peel Strength AL/CRS 166°C Bonds made using 3 second dwell, 5 lbs gauge pressure., Peels done at 90° angle, 2 in/minute, Instron tester., AL is 4.5 mil etched aluminum foil.
13 piw T-Peel Strength AL/CRS 174°C Bonds made using 3 second dwell, 5 lbs gauge pressure., Peels done at 90° angle, 2 in/minute, Instron tester., AL is 4.5 mil etched aluminum foil.
1 piw T-Peel Strength AL/FR-4 116°C Bonds made using 3 second dwell, 5 lbs gauge pressure., Peels done at 90° angle, 2 in/minute, Instron tester., AL is 4.5 mil etched aluminum foil.
2 piw T-Peel Strength AL/FR-4 124°C Bonds made using 3 second dwell, 5 lbs gauge pressure., Peels done at 90° angle, 2 in/minute, Instron tester., AL is 4.5 mil etched aluminum foil.
2 piw T-Peel Strength AL/FR-4 132°C Bonds made using 3 second dwell, 5 lbs gauge pressure., Peels done at 90° angle, 2 in/minute, Instron tester., AL is 4.5 mil etched aluminum foil.
2 piw T-Peel Strength AL/FR-4 141°C Bonds made using 3 second dwell, 5 lbs gauge pressure., Peels done at 90° angle, 2 in/minute, Instron tester., AL is 4.5 mil etched aluminum foil.
2 piw T-Peel Strength AL/FR-4 149°C Bonds made using 3 second dwell, 5 lbs gauge pressure., Peels done at 90° angle, 2 in/minute, Instron tester., AL is 4.5 mil etched aluminum foil.
3 piw T-Peel Strength AL/FR-4 157°C Bonds made using 3 second dwell, 5 lbs gauge pressure., Peels done at 90° angle, 2 in/minute, Instron tester., AL is 4.5 mil etched aluminum foil.
5 piw T-Peel Strength AL/FR-4 166°C Bonds made using 3 second dwell, 5 lbs gauge pressure., Peels done at 90° angle, 2 in/minute, Instron tester., AL is 4.5 mil etched aluminum foil.
5 piw T-Peel Strength AL/FR-4 174°C Bonds made using 3 second dwell, 5 lbs gauge pressure., Peels done at 90° angle, 2 in/minute, Instron tester., AL is 4.5 mil etched aluminum foil.
Shear Strength Test Methods
Shear Strength Type Cure Temperature Substrate Test Temperature Test Method
1,160 psi Overlap shear strength 160°C Cold Rolled Steel Overlap shear made bonding 20 mil aluminum to test substrates using 320°F (160°C) bondline temperature, 2 seconds dwell, 14 lbs gauge pressure., Adhesion tests done @ .2 in/minute for OLS.
740 psi Overlap shear strength 160°C Stainless Steel Overlap shear made bonding 20 mil aluminum to test substrates using 320°F (160°C) bondline temperature, 2 seconds dwell, 14 lbs gauge pressure., Adhesion tests done @ .2 in/minute for OLS.
1,090 psi Overlap shear strength 160°C Aluminum, Etched Overlap shear made bonding 20 mil aluminum to test substrates using 320°F (160°C) bondline temperature, 2 seconds dwell, 14 lbs gauge pressure., Adhesion tests done @ .2 in/minute for OLS.
70 psi Overlap shear strength 160°C Polycarbonate Overlap shear made bonding 20 mil aluminum to test substrates using 320°F (160°C) bondline temperature, 2 seconds dwell, 14 lbs gauge pressure., Adhesion tests done @ .2 in/minute for OLS.
260 psi Overlap shear strength 160°C Acrylic Overlap shear made bonding 20 mil aluminum to test substrates using 320°F (160°C) bondline temperature, 2 seconds dwell, 14 lbs gauge pressure., Adhesion tests done @ .2 in/minute for OLS.
1,120 psi Overlap shear strength 160°C FR-4 PCB Overlap shear made bonding 20 mil aluminum to test substrates using 320°F (160°C) bondline temperature, 2 seconds dwell, 14 lbs gauge pressure., Adhesion tests done @ .2 in/minute for OLS.
80 psi Overlap shear strength 160°C Polypropylene Overlap shear made bonding 20 mil aluminum to test substrates using 320°F (160°C) bondline temperature, 2 seconds dwell, 14 lbs gauge pressure., Adhesion tests done @ .2 in/minute for OLS.
140 psi Overlap shear strength 160°C Nylon 6,6 Overlap shear made bonding 20 mil aluminum to test substrates using 320°F (160°C) bondline temperature, 2 seconds dwell, 14 lbs gauge pressure., Adhesion tests done @ .2 in/minute for OLS.
1,160 psi Overlap shear strength 160°C eitched aluminum 24°C Overlap shear made bonding 20 mil etched aluminum to 63 mil etched aluminum using 320°F (160°C) bondline temperature, 2 seconds dwell, 14 lbs gauge pressure., Adhesion tests done @ .2 in/minute for OLS
1,090 psi Overlap shear strength 160°C eitched aluminum 38°C Overlap shear made bonding 20 mil etched aluminum to 63 mil etched aluminum using 320°F (160°C) bondline temperature, 2 seconds dwell, 14 lbs gauge pressure., Adhesion tests done @ .2 in/minute for OLS
990 psi Overlap shear strength 160°C eitched aluminum 52°C Overlap shear made bonding 20 mil etched aluminum to 63 mil etched aluminum using 320°F (160°C) bondline temperature, 2 seconds dwell, 14 lbs gauge pressure., Adhesion tests done @ .2 in/minute for OLS
910 psi Overlap shear strength 160°C eitched aluminum 66°C Overlap shear made bonding 20 mil etched aluminum to 63 mil etched aluminum using 320°F (160°C) bondline temperature, 2 seconds dwell, 14 lbs gauge pressure., Adhesion tests done @ .2 in/minute for OLS
590 psi Overlap shear strength 160°C eitched aluminum 79°C Overlap shear made bonding 20 mil etched aluminum to 63 mil etched aluminum using 320°F (160°C) bondline temperature, 2 seconds dwell, 14 lbs gauge pressure., Adhesion tests done @ .2 in/minute for OLS
Tensile Strength Test Methods
Tensile Strength Test Method
2,600 psi (3.0 mil film), @ Break
Dielectric Constant Test Methods
Dielectric Constant Test Method
2.40 ASTM D-257, @ 1 kilohertz
2.40 ASTM D-257, @ 100 kilohertz
2.40 ASTM D-257
2.40 ASTM D-257, @ 1 megahertz
Dielectric Strength Test Methods
Dielectric Strength Test Method
2,300 V/mil ASTM D-149
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.00500 ASTM D-257, @ 1 kilohertz
0.00100 ASTM D-257, @ 10 kilohertz
0.00100 ASTM D-257, @ 100 kilohertz
0.00600 ASTM D-257, @ 1 megahertz
Volume Resistivity Test Methods
Volume Resistivity Test Method
5.9 x 10(17) (ohm-cm) ASTM D-257
Elongation Test Methods
Elongation Test Method
750 % 3.0 mil film