| Application Type | Bond, Hold |
|---|---|
| 1 Part or 2 Part | 1 Part |
| Material Form | Double-Coated Tape |
| Substrate | Polyester, Steel, Corrugated, Paper |
| Industry | Industrial: Splicing Tapes |
| Manufacturer | 3M |
| Chemistry | Acrylic |
| Cure Method | Pressure sensitive |
| Color | Clear |
| Chemical Resistance | Good solvent resistance |
| High Temperature Resistance (°C) | 65, 82 |
| Key Specifications | Mil-Spec (United States Military Standard): P-19834B: U.S. Government specification MIL-P-19834B, Type I |
To obtain optimum adhesion, the bonding surfaces must be clean, dry, and well unified.
Bond strength is dependent upon the amount of adhesive-to-surface contact developed. Firm application pressure helps develop better adhesive contact and improve bond strength.
Ideal tape application temperature range is 70°F to 100°F (21°C to 38°C). Initial tape application to surfaces at temperatures below 50°F (10°C) is not recommended because the adhesive becomes too firm to adhere readily. However, once properly applied, low temperature holding is generally satisfactory.
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| General Bond Strength | Substrate | Test Method |
|---|---|---|
| 25 (Oz./in.) | Steel | ASTM D3330 |
| High | Steel | ASTM D3330 |
| High Temperature Resistance | Test Method |
|---|---|
| 65°C | Relative High Temperature Operating Ranges: Long Term (days, weeks) |
| 82°C | Relative High Temperature Operating Ranges: Short Term (minutes, hours) |
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