• Description for 3M 415

    Splicing Tape, utilizes an acrylic pressure sensitive adhesive system that offers a balance of initial adhesion and good holding power.

    *See Terms of Use Below

    Chemical Resistance Chemical Resistance: Good solvent resistance
    Application Type Bond, Hold
    1 Part or 2 Part 1-Part
    Material Form Double-Coated Tape
    Substrate Paper, Polyester, Steel, Corrugated
    Industry Medical, Splicing Tapes
    Manufacturer 3M
    Chemistry Acrylic
    Cure Method Pressure sensitive
    Application Temperature (°F) 70 to 100
    Color Clear
    High Temperature Resistance (°C) 65, 82
    Key Specifications Mil-Spec (United States Military Standard): P-19834B: U.S. Government specification MIL-P-19834B, Type I
  • Technical Data for 3M 415

    Overview
    • Chemical Resistance
      • Chemical Resistance : Relative Solvent Resistance - Good solvent resistance
    • Application Type
    • 1 Part or 2 Part
      • 1-Part
    • Material Form
      • Tape - Double-Coated Tape
    • Substrate
    • Industry
    • Chemistry
    • Application Method
      • Contact
    • Cure Method
      • Pressure Sensitive (min) - Pressure sensitive
    • Color
      • Clear / Transparent - Clear
    • Key Specifications
      • Mil-Spec (United States Military Standard) : P-19834B : Type 1 - U.S. Government specification MIL-P-19834B, Type I
    Specifications
    Cure Specs
    Application Temperature (°F) 70 to 100
    Bond Strength
    General Bond Strength (psi) 25 (Oz./in.), High Test Method
    Material Resistance
    UV Resistance Excellent
    High Temperature Resistance (°C) 65, 82 Test Method
    Business Information
    Shelf Life Details Store in original cartons at 70°F (21°C) and 50% relative humidity.;24 months from date of manufacture.
    Shelf Life Temperature (°F) 70
    Shelf Life Type from date of manufacture
    Shelf Life (mon) 24
  • Best Practices for 3M 415

    *See Terms of Use Below

    1. Surface Preparation

      To obtain optimum adhesion, the bonding surfaces must be clean, dry, and well unified.

    2. Application

      Bond strength is dependent upon the amount of adhesive-to-surface contact developed. Firm application pressure helps develop better adhesive contact and improve bond strength.

      Ideal tape application temperature range is 70°F to 100°F (21°C to 38°C). Initial tape application to surfaces at temperatures below 50°F (10°C) is not recommended because the adhesive becomes too firm to adhere readily. However, once properly applied, low temperature holding is generally satisfactory.

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General Bond Strength Test Methods
General Bond Strength Substrate Test Method
25 (Oz./in.) Steel ASTM D3330
High Steel ASTM D3330
High Temperature Resistance Test Methods
High Temperature Resistance Test Method
65°C Relative High Temperature Operating Ranges: Long Term (days, weeks)
82°C Relative High Temperature Operating Ranges: Short Term (minutes, hours)