| Application Type | Bond, Hold |
|---|---|
| 1 Part or 2 Part | 1 Part |
| Material Form | Double-Coated Tape |
| Substrate | Fabrics, Glass, Metal, ABS, Polycarbonate, Polyester, Polypropylene, Rubber, Stainless Steel, Paper, Al foil, Plastics |
| Industry | Industrial: Splicing of films |
| Manufacturer | 3M |
| Chemistry | Natural Rubber, Polyester |
| Cure Method | Pressure Sensitive |
| Color | White |
| Chemical Resistance | Good solvent resistance |
| High Temperature Resistance (°C) | 66, 82 |
To obtain optimum adhesion, all substrate surfaces must be clean and dry. A typical cleaning solvent is an isopropyl alcohol/water solution with a mixture ratio of 50:50 (rubbing alcohol). Be sure to follow solvent manufacturer’s precautions and directions for use when using solvents.
Bond strength is dependent upon the amount of adhesive-to-surface contact developed. Firm application pressure helps develop better adhesive contact and improves bond strength.
Ideal tape application temperature range is 70°F to 100°F (21°C to 38°C). Initial tape application to surfaces at temperatures below 50°F (10°C) is not recommended because the adhesive becomes too firm to adhere readily. However, once properly applied, low temperature holding is generally satisfactory.
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| General Bond Strength | Substrate | Test Time | Test Temperature | Test Method |
|---|---|---|---|---|
| 70 (Oz./in.) | Al foil | 4,320 min | 25°C | ASTM D3330 - 180 degree |
| 53 (Oz/in) | Stainless Steel | 15 min | 25°C | ASTM D3330 - 90 degree |
| 56 (Oz/in) | Stainless Steel | 4,320 min | 25°C | ASTM D3330 - 90 degree |
| 70 (Oz/in) | Stainless Steel | 4,320 min | 70°C | ASTM D3330 - 90 degree |
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