• Description for 3M 4658F

    Clear closed foam acrylic removable foam tape • Clean removability from many substrates

    *See Terms of Use Below

    Application Type Bond, Hold
    1 Part or 2 Part 1 Part
    Material Form Tape
    Substrate Foam, Stainless Steel
    Industry Electronic, Display Case
    Manufacturer 3M
    Chemistry Acrylic
    Cure Method Pressure Sensitive
    Color Clear
    Relative Solvent Resistance Chemical Resistance: Good solvent resistance, Chemical Resistance: Hydrocarbon solvents
    High Temperature Resistance (°C) 100, 80
    Density (g/cm³) 0.960
  • Technical Data for 3M 4658F

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 1 Part
    • Material Form
      • Tape
    • Substrate
    • Industry
    • Chemistry
    • Cure Method
      • Pressure Sensitive (min) - Pressure Sensitive
    • Color
      • Clear / Transparent - Clear
    Specifications
    Cure Specs
    Application Temperature (°F) 70 to 100
    Bond Strength
    General Bond Strength (psi) High, Ultimate
    Peel Strength (piw) 15 Test Method
    Shear Strength (psi) Good, 1000 (g), 750 (g), 500 (g) Test Method
    Material Resistance
    UV Resistance Excellent
    High Temperature Resistance (°C) 100, 80
    Other Properties
    Density (g/cm³) 0.960
    Business Information
    Shelf Life Details 24 months from date of manufacture by 3M when stored in the original carton at 21°C (70°F) & 50 % Relative Humidity
    Shelf Life Temperature (°F) 70
    Shelf Life Type From date of manufacture
    Shelf Life (mon) 24
  • Best Practices for 3M 4658F

    *See Terms of Use Below

    1. Surface Preparation

      To obtain optimum adhesion, the bonding surfaces must be clean, dry and well unified.

      Typical surface cleaning solvents are isopropyl alcohol (rubbing alcohol) and water or heptane.

      Note: Carefully read and follow manufacturer’s precautions and directions for use when using solvents.

    2. Application

      Bond strength is dependent upon the amount of adhesive-to-surface contact developed. Firm application pressure helps develop better adhesive contact and improve bond strength.

      Ideal tape application temperature is 70°F to 100°F (21°C to 38°C). Initial tape application to surfaces at temperatures below 50°F (10°C) is not recommended because the adhesive may become too firm to adhere readily. However, once properly applied, low temperature holding is generally satisfactory.

    3. Removal

      For rigid surfaces, lever or pry apart the substrates to break the bond.

      For flexible surfaces, peel back slowly to ensure clean removal.

      To remove tape from substrate, pull back corner and peel off quickly.

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Shear Strength Test Methods
Shear Strength Type Test Time Test Temperature Test Method
Good
1000 (g) Static shear strength 600,000 sec 22°C 1/2 in.2 (3.23 cm2) overlap Will hold listed gram weight for 10,000 minutes. ASTM D-3654
750 (g) Static shear strength 600,000 sec 49°C 1/2 in.2 (3.23 cm2) overlap Will hold listed gram weight for 10,000 minutes. ASTM D-3654
500 (g) Static shear strength 600,000 sec 66°C 1/2 in.2 (3.23 cm2) overlap Will hold listed gram weight for 10,000 minutes. ASTM D-3654
Peel Strength Test Methods
Peel Strength Type Substrate Test Time Test Temperature Test Method
15 piw 90° Peel strength Stainless steel 4,320 min 25°C To Stainless Steel 15 lb./in. width Room Temperature (263 N/100 mm) 90° Angle Peel 12 in./minute Jaw Speed (308 mm/min.) 72 hour Dwell ASTM D-3330