• Description for 3M 469

    Splicing Tape, has high initial adhesion, ideal for bonding a variety of similar or dissimilar materials.

    *See Terms of Use Below

    Application Type Bond, Hold
    1 Part or 2 Part 1 Part
    Material Form Tape
    Substrate Polyester, Steel, Corrugated, Paper
    Industry Splicing Tapes
    Manufacturer 3M
    Chemistry Acrylic
    Cure Method Pressure sensitive
    Color Light Red
    Relative Solvent Resistance Chemical Resistance: High solvent resistance, Chemical Resistance: Medium solvent resistance
    High Temperature Resistance (°C) 180, 94, High contact
    Key Specifications Mil-Spec (United States Military Standard): P-19834B: U.S. Government specification MIL-P-19834B, Type I
  • Technical Data for 3M 469

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 1 Part
    • Material Form
      • Tape
    • Substrate
    • Industry
    • Chemistry
    • Application Method
      • Contact
      • Flow - Line Pressure, Pot Pressure
    • Cure Method
      • Pressure Sensitive (min) - Pressure sensitive
    • Color
      • Red - Light Red
    • Key Specifications
      • Mil-Spec (United States Military Standard): P-19834B: Type 1 - U.S. Government specification MIL-P-19834B, Type I
    Specifications
    Cure Specs
    Application Temperature (°F) 70 to 100
    Set Time (min) Quick
    Bond Strength
    General Bond Strength (psi) 60 (Oz./in.), High Test Method
    Material Resistance
    UV Resistance Excellent
    High Temperature Resistance (°C) 180, 94, High contact
    Business Information
    Shelf Life Details Store in original cartons at 70°F (21°C) and 50% relative humidity., 24 months from date of manufacture.
    Shelf Life Temperature (°F) 70
    Shelf Life Type from date of manufacture
    Shelf Life (mon) 12
  • Best Practices for 3M 469

    *See Terms of Use Below

    1. Surface Preparation

      To obtain optimum adhesion, the bonding surfaces must be clean, dry, and well unified.

    2. Application

      Bond strength is dependent upon the amount of adhesive-to-surface contact developed. Firm application pressure helps develop better adhesive contact and improve bond strength.

      Ideal tape application temperature range is 70°F to 100°F (21°C to 38°C). Initial tape application to surfaces at temperatures below 50°F (10°C) is not recommended because the adhesive becomes too firm to adhere readily. However, once properly applied, low temperature holding is generally satisfactory.

  • Comparable Materials for 3M 469

    *See Terms of Use Below

    Spec Engine® Results

Questions about this material?

Get personal assistance with your specific application needs.

Your Profile Edit
  1. 9fe2b873-447a-41d6-97c0-22e6ee495cef
  2. 9fe2b873-447a-41d6-97c0-22e6ee495cef

Popular Articles

Testing the effectiveness of surface treatments

Read Article

What Projects Require Custom Adhesive Formulations and Why?

Read Article

An Overview of Fluid Dispensing Systems & How They’re Used

Read Article

Infographic: ENSURING A STRONG BOND - 6 Basic Methods of Surface Preparation

Read Article

Sponsored Articles

Unique Advantages of Contact Adhesives

Read Article

Using LOCTITE® 454™ is a Valid Option for Engineers Working with a Wide Variety of Materials

Read Article

Sylgard 184 by DOW is the Top Choice for a Transparent, Silicone Encapsulant. Read Why:

Read Article

Case Study: Creating reliable, corrosion-free bonds with LORD® 406 acrylic adhesive

Read Article
Information provided by Gluespec

Why Register?

  • View Technical Details
  • View Test Methods
  • View Key Specifications
  • View Similar Materials
  • Save your Project Searches

Already registered? Sign in.

Questions? Learn more about Gluespec

Gluespec Poll

Who do you read or follow for engineering news and entertainment?
General Bond Strength Test Methods
General Bond Strength Substrate Test Method
60 (Oz./in.) Steel ASTM D3330
High