3M 4941

3M 4941 Datasheet
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  • Description for 3M 4941

    • Gray, closed-cell acrylic foam carrier • Conformable • Good adhesion to many painted metals • Plasticizer resistant • UL 746C

    *See Terms of Use Below

    Application Type Bond
    1 Part or 2 Part 1 Part
    Material Form Tape
    Substrate Acrylic paint, Ceramic, Epoxy, Foam, PBT, Glass, Metal, Stainless steel, ABS, Plasticized Vinyl, Polycarbonate, Polyester paint, Polyurethane paint, PVC, Enameled Steel, Galvanized Steel, Aluminum, Galvanized Steel, Painted Metals, Nickel Coated ABS, Plastics
    Industry Human Machine Interface
    Manufacturer 3M
    Chemistry Acrylic
    Cure Method Pressure sensitive
    Color Gray
    Chemical Resistance Plasticizer
    Relative Solvent Resistance Chemical Resistance: Excellent solvent resistance
    High Temperature Resistance (°C) 110, 75, 90, High
    Low Temperature Resistance (°C) -35
    Density (g/cm³) 0.720
    Key Specifications UL 746C

  • Technical Data for 3M 4941

    *See Terms of Use Below

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 1 Part
    • Material Form
      • Tape
    • Substrate
    • Industry
    • Chemistry
    • Cure Method
      • Pressure Sensitive (min) - Pressure sensitive
    • Color
      • Gray
    • Key Specifications
      • UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association) - UL 746C
    Specifications
    Cure Specs
    Application Temperature (°F) 59, 70 to 100
    Bond Strength
    General Bond Strength (psi) Good
    Peel Strength (piw) High
    Shear Strength (psi) High
    Tensile Strength (psi) High
    Material Resistance
    Chemical Resistance Plasticizer
    Relative Solvent Resistance Chemical Resistance: Excellent solvent resistance
    High Temperature Resistance (°C) 110, 75, 90, High
    Low Temperature Resistance (°C) -35
    Moisture/Humidity Resistance Excellent
    Conductivity
    Dissipation Factor 0.02450, 0.03740 Test Method
    Dielectric Strength (V/mil) 360 Test Method
    Dielectric Constant 2.29, 1.99 Test Method
    Thermal Conductivity (W/m°K) 0.08, 0.92 Test Method
    Surface Resistivity (O) 2.7e14 (ohms/sq.)
    Volume Resistivity (O) 2.1e14 (ohms/cm) Test Method
    Hardness
    Flexibility Conformal
    Modulus (psi) 3e5 (Pa) Test Method
    Other Properties
    Coefficient of Thermal Expansion (CTE) 180e-6 (m/m/°C)
    Density (g/cm³) 0.720
    Business Information
    Shelf Life Details All 3M™ VHB™ Tapes have a shelf life of 24 months from date of shipment when stored at 40°F to 100°F (4°C to 38°C) and 0-95% relative humidity. The optimum storage conditions are 72°F (22°C) and 50% relative humidity. Performance of tapes is not projected to change even after shelf life expires, however, 3M does suggest that 3M™ VHB™ Tapes are used prior to the shelf life date whenever possible.
    Shelf Life Temperature (°F) 39 to 100
    Shelf Life Type From date of shipment
    Shelf Life (mon) 24

  • Best Practices for 3M 4941

    *See Terms of Use Below

    1. Surface Preparation

      Most substrates are best prepared by cleaning with a 50:50 mixture of isopropyl alcohol (IPA*) and water prior to applying 3M™ VHB™ Tapes.

      See Vendor Technical Data Sheet for more info.

      To obtain good performance with all 3M™ VHB™ Tapes, it is important to ensure that the surfaces are dry and free of condensed moisture.

    2. Application

      Bond strength is dependent upon the amount of adhesive-to-surface contact developed. Firm application pressure develops better adhesive contact and helps improve bond strength. Typically, good surface contact can be attained by applying enough pressure to insure that the tape experiences approximately 15 psi (100 kPa) pressure. Either roller or platen pressure can be used. Note that rigid surfaces may require 2 or 3 times that much pressure to make the tape experience 15 psi.

      Ideal application temperature range is 70°F to 100°F (21°C to 38°C). Pressure sensitive adhesives use viscous flow to achieve substrate contact area. Minimum suggested application temperatures:60°F (15°C): 3M™ VHB™ Tapes 4941, 4945 families.

      Note: Initial tape application to surfaces at temperatures below these suggested minimums is not recommended because the adhesive becomes too firm to adhere readily. However, once properly applied, low temperature holding is generally satisfactory.

    3. Curing

      After application, the bond strength will increase as the adhesive flows onto the surface (also referred to as “wet out”). At room temperature approximately 50% of ultimate bond strength will be achieved after 20 minutes, 90% after 24 hours and 100% after 72 hours. This flow is faster at higher temperatures and slower at lower temperatures. Ultimate bond strength can be achieved more quickly (and in some cases bond strength can be increased) by exposure of the bond to elevated temperatures (e.g. 150°F [66°C] for 1 hour). This can provide better adhesive wetout onto the substrates. Abrasion of the surfaces or the use of primers/ adhesion promoters can also have the effect of increasing bond strength and achieving ultimate bond strength more quickly.

  • Comparable Materials for 3M 4941

    *See Terms of Use Below

    Spec Engine® Results

    • 3M
      4956F(3M)

      • Gray, closed-cell acrylic foam carrier • Conformable • Good adhesion to many painted metals • Plasticizer resistant • UL 746C

    • 3M
      4941F(3M)

      • Gray, closed-cell acrylic foam carrier • Conformable • Good adhesion to many painted metals • Plasticizer resistant • UL 746C

    • 3M
      4936F(3M)

      • Gray, closed-cell acrylic foam carrier • Conformable • Good adhesion to many painted metals • Plasticizer resistant • UL 746C

    • Compare All
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Dielectric Constant Test Methods
Dielectric Constant Test Method
2.29 ASTM D150, 1 KHz
1.99 ASTM D150, 1 MHz
Dielectric Strength Test Methods
Dielectric Strength Test Method
360 V/mil ASTM D149
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.02450 ASTM D150, 1 kHz
0.03740 ASTM D150, 1 MHz
Thermal Conductivity Test Methods
Thermal Conductivity Test Method
0.08 W/m°K K-Value
0.92 W/m°K K-Value
Volume Resistivity Test Methods
Volume Resistivity Test Method
2.1e14 (ohms/cm) ASTM D257
Modulus Test Methods
Modulus Temperature Test Method
3e5 (Pa) 25°C Shear modulus, 1 Hz