Application Type Bond 1 Part or 2 Part 1 Part Material Form Tape Substrate Acrylic paint, Ceramic, Epoxy, Foam, PBT, Glass, Metal, Stainless steel, ABS, Plasticized Vinyl, Polycarbonate, Polyester paint, Polyurethane paint, PVC, Enameled Steel, Galvanized Steel, Aluminum, Galvanized Steel, Painted Metals, Nickel Coated ABS, Plastics Industry Rivets, Human Machine Interface Manufacturer 3M Chemistry Acrylic Cure Method Pressure sensitive Color Gray Chemical Resistance Plasticizer Relative Solvent Resistance Chemical Resistance: Excellent solvent resistance High Temperature Resistance (°C) 110, 75, 90, High Low Temperature Resistance (°C) -35 Density (g/cm³) 0.720 Key Specifications UL 746C
Technical Data for 3M 4941
- Adhesive - Bond
1 Part or 2 Part
- 1 Part or 2 Part - 1 Part
- Metal - Painted Metals
- Steel - Enameled Steel
- Galvanized - Galvanized Steel
- Plastic - ABS, Nickel Coated ABS, Plastics
- Acrylic (PMMA) - Acrylic paint
- Vinyl - Plasticized Vinyl
- Polyurethane - Polyurethane paint
- Polyvinyl chloride (PVC) - PVC
- Polyester - Polyester paint
- Polybutylene Terephthalate (PBT) - PBT
- Stainless Steel
- Galvanized Steel
- Other - Paint
- Pressure Sensitive (min) - Pressure sensitive
- UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association) - UL 746C
Application Temperature (°F) 59, 70 to 100
General Bond Strength (psi) Good Peel Strength (piw) High Shear Strength (psi) High Tensile Strength (psi) High
Chemical Resistance Plasticizer Relative Solvent Resistance Chemical Resistance: Excellent solvent resistance High Temperature Resistance (°C) 110, 75, 90, High Low Temperature Resistance (°C) -35 Moisture/Humidity Resistance Excellent
Dissipation Factor 0.02450, 0.03740 Test Method Dielectric Strength (V/mil) 360 Test Method Dielectric Constant 2.29, 1.99 Test Method Thermal Conductivity (W/m°K) 0.08, 0.92 Test Method Surface Resistivity (O) 2.7e14 (ohms/sq.) Volume Resistivity (O) 2.1e14 (ohms/cm) Test Method
Flexibility Conformal Modulus (psi) 3e5 (Pa) Test Method
Coefficient of Thermal Expansion (CTE) 180e-6 (m/m/°C) Density (g/cm³) 0.720
Shelf Life Details All 3M™ VHB™ Tapes have a shelf life of 24 months from date of shipment when stored at 40°F to 100°F (4°C to 38°C) and 0-95% relative humidity. The optimum storage conditions are 72°F (22°C) and 50% relative humidity. Performance of tapes is not projected to change even after shelf life expires, however, 3M does suggest that 3M™ VHB™ Tapes are used prior to the shelf life date whenever possible. Shelf Life Temperature (°F) 39 to 100 Shelf Life Type From date of shipment Shelf Life (mon) 24
Best Practices for 3M 4941
Most substrates are best prepared by cleaning with a 50:50 mixture of isopropyl alcohol (IPA*) and water prior to applying 3M™ VHB™ Tapes.
See Vendor Technical Data Sheet for more info.
To obtain good performance with all 3M™ VHB™ Tapes, it is important to ensure that the surfaces are dry and free of condensed moisture.
Bond strength is dependent upon the amount of adhesive-to-surface contact developed. Firm application pressure develops better adhesive contact and helps improve bond strength. Typically, good surface contact can be attained by applying enough pressure to insure that the tape experiences approximately 15 psi (100 kPa) pressure. Either roller or platen pressure can be used. Note that rigid surfaces may require 2 or 3 times that much pressure to make the tape experience 15 psi.
Ideal application temperature range is 70°F to 100°F (21°C to 38°C). Pressure sensitive adhesives use viscous flow to achieve substrate contact area. Minimum suggested application temperatures:60°F (15°C): 3M™ VHB™ Tapes 4941, 4945 families.
Note: Initial tape application to surfaces at temperatures below these suggested minimums is not recommended because the adhesive becomes too firm to adhere readily. However, once properly applied, low temperature holding is generally satisfactory.
After application, the bond strength will increase as the adhesive flows onto the surface (also referred to as “wet out”). At room temperature approximately 50% of ultimate bond strength will be achieved after 20 minutes, 90% after 24 hours and 100% after 72 hours. This flow is faster at higher temperatures and slower at lower temperatures. Ultimate bond strength can be achieved more quickly (and in some cases bond strength can be increased) by exposure of the bond to elevated temperatures (e.g. 150°F [66°C] for 1 hour). This can provide better adhesive wetout onto the substrates. Abrasion of the surfaces or the use of primers/ adhesion promoters can also have the effect of increasing bond strength and achieving ultimate bond strength more quickly.
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Dielectric Constant Test Methods
|Dielectric Constant||Test Method|
|2.29||ASTM D150, 1 KHz|
|1.99||ASTM D150, 1 MHz|
Dielectric Strength Test Methods
|Dielectric Strength||Test Method|
|360 V/mil||ASTM D149|
Dissipation Factor Test Methods
|Dissipation Factor||Test Method|
|0.02450||ASTM D150, 1 kHz|
|0.03740||ASTM D150, 1 MHz|
Thermal Conductivity Test Methods
|Thermal Conductivity||Test Method|
Volume Resistivity Test Methods
|Volume Resistivity||Test Method|
|2.1e14 (ohms/cm)||ASTM D257|
Modulus Test Methods
|3e5 (Pa)||25°C||Shear modulus, 1 Hz|