• Description for 3M 5413

    A tape consisting of a Kapton® polyimide film and silicone adhesive designed for high temperature applications.

    *See Terms of Use Below

    Application Type Bond, Mask
    1 Part or 2 Part 1 Part
    Material Form Film Tape
    Substrate Steel
    Industry Electronics: Mask for protection of gold fingers of printed circuit boards
    Manufacturer 3M
    Chemistry Polyimide film, Silicone
    Cure Method Pressure Sensitive
    Color Amber
    Chemical Resistance Chemical resistance
    High Temperature Resistance (°C) Designed for high temperature, 260
    Low Temperature Resistance (°C) -73
    Other Resistance Radiation resistant
  • Technical Data

    Overview
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    Specifications
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  • Best Practices

    *See Terms of Use Below

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Tensile Strength Test Methods
Tensile Strength Test Method
33 (lbs./in.) ASTM D-3759, at Break, width
General Bond Strength Test Methods
General Bond Strength Substrate Test Method
22 (oz./in.) Steel ASTM D-3330, width
Dielectric Strength Test Methods
Dielectric Strength Test Method
7000 (volts) ASTM D-149
Elongation Test Methods
Elongation Test Method
62 % ASTM D-3759 (at Break)
Outgassing Test Methods
Outgassing Test Method
%TLM = 1.50 ASTM E-595
%CVCM = 0.50 ASTM E-595