| Application Type | Bond, Mask |
|---|---|
| 1 Part or 2 Part | 1 Part |
| Material Form | Film Tape |
| Substrate | Steel |
| Industry | Electronics: Mask for protection of gold fingers of printed circuit boards |
| Manufacturer | 3M |
| Chemistry | Polyimide film, Silicone |
| Cure Method | Pressure Sensitive |
| Color | Amber |
| Chemical Resistance | Chemical resistance |
| High Temperature Resistance (°C) | Designed for high temperature, 260 |
| Low Temperature Resistance (°C) | -73 |
| Other Resistance | Radiation resistant |
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| Tensile Strength | Test Method |
|---|---|
| 33 (lbs./in.) | ASTM D-3759, at Break, width |
| General Bond Strength | Substrate | Test Method |
|---|---|---|
| 22 (oz./in.) | Steel | ASTM D-3330, width |
| Dielectric Strength | Test Method |
|---|---|
| 7000 (volts) | ASTM D-149 |
| Elongation | Test Method |
|---|---|
| 62 % | ASTM D-3759 (at Break) |
| Outgassing | Test Method |
|---|---|
| %TLM = 1.50 | ASTM E-595 |
| %CVCM = 0.50 | ASTM E-595 |
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