• Description for 3M 5414

    It has a poly-vinyl alcohol backing which is water soluble and a synthetic water soluble adhesive to mask gold fingers on printed circuit boards during wave soldering.

    *See Terms of Use Below

    Application Type Adhesive
    1 Part or 2 Part 1 Part
    Material Form Tape
    Substrate Steel, Gold
    Industry Masking of gold finger areas on printed circuit boards for wave soldering
    Manufacturer 3M
    Cure Method Pressure Sensitive
    Color Hazy, Transparent
    Water Soluble Synthetic water-soluble
  • Technical Data

    Overview
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    Specifications
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  • Best Practices

    *See Terms of Use Below

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General Bond Strength Test Methods
General Bond Strength Substrate Test Method
4 (oz./in.) Steel ASTM D-3330, width
Tensile Strength Test Methods
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6 (lbs./in.) ASTM D-3759, width
Elongation Test Methods
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334 % D-3759 (at Break)