• Description for 3M 5414

    It has a poly-vinyl alcohol backing which is water soluble and a synthetic water soluble adhesive to mask gold fingers on printed circuit boards during wave soldering.

    *See Terms of Use Below

    Application Type Adhesive
    1 Part or 2 Part 1 Part
    Material Form Tape
    Substrate Gold, Steel
    Industry Masking of gold finger areas on printed circuit boards for wave soldering
    Manufacturer 3M
    Cure Method Pressure Sensitive
    Color Hazy, Transparent
    Water Soluble Synthetic water-soluble
  • Technical Data for 3M 5414

    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 1 Part
    • Material Form
      • Tape
    • Substrate
    • Industry
      • Printed Circuit Board (PCB) - Masking of gold finger areas on printed circuit boards for wave soldering
    • Chemistry
      • Tape Backing - Poly-vinyl alcohol (PVA) film
    • Cure Method
      • Pressure Sensitive (min) - Pressure Sensitive
    • Color
      • Clear / Transparent - Transparent
      • Off-White - Hazy
    Bond Strength
    General Bond Strength (psi) 4 (oz./in.) Test Method
    Tensile Strength (psi) 6 (lbs./in.) Test Method
    Material Resistance
    Water Soluble Synthetic water-soluble
    Moisture/Humidity Resistance Humidity extremes do not affect tape properties
    Elongation (%) 334 Test Method
    Business Information
    Shelf Life Details Storage: Store under normal conditions of 60° to 80°F (16° to 27°C) and 40 to 50% R.H. in the original carton., The shelf life of 3M™ Water-Soluble Wave Solder Tape 5414 is 12 months from the date of manufacture when stored in the original packaging materials and stored at 21°C (70°F) and 50% relative humidity.
    Shelf Life Temperature (°F) 140 to 176, 70
    Shelf Life Type From date of manufacture, From the date of manufacture
    Shelf Life (mon) 12, 12
  • Best Practices for 3M 5414

    *See Terms of Use Below

    1. Application

      Best results are attained when applied to a clean, dry and non-dusty surface above 0°C. To improve adhesion, ensure that firm and even pressure is applied.

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Tensile Strength Test Methods
Tensile Strength Test Method
6 (lbs./in.) ASTM D-3759, width
General Bond Strength Test Methods
General Bond Strength Substrate Test Method
4 (oz./in.) Steel ASTM D-3330, width
Elongation Test Methods
Elongation Test Method
334 % D-3759 (at Break)