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Description for 3M 5419
A translucent, polyimide film-backed silicone adhesive tape with unique and extremely low electro discharge properties. For gold tab protection during wave solder of printed circuit boards.Application Type Adhesive, Mask 1 Part or 2 Part 1-Part Material Form Film Tape Substrate Steel Industry Printed circuit boards Manufacturer 3M Chemistry Polyimide, Silicone Cure Method Pressure Sensitive Color Gold, Translucent -
Technical Data for 3M 5419
Overview
Specifications
Bond Strength
General Bond Strength (psi) 20 (oz./in.) Test Method Tensile Strength (psi) 33 (lbs./in.) Test Method Conductivity
Insulation Resistance (O) >1e6 (ohms), Insulation Resistance Dielectric Strength (V/mil) 7000 (Volts) Test Method Hardness
Elongation (%) 60 Test Method Other Properties
Outgassing %TLM = 0.58, %CVCM = 0.24 Test Method Business Information
Shelf Life Details Store under normal conditions of 60° to 80°F (16° to 27°C) and 40 to 50% R.H. in the original carton.;To obtain best performance, use this product within 3 years from date of manufacture. Shelf Life Type From date of manufacture Shelf Life (mon) 37 -
Best Practices for 3M 5419
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Comparable Materials for 3M 5419
Spec Engine® Results
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General Bond Strength Test Methods
General Bond Strength | Substrate | Test Method |
---|---|---|
20 (oz./in.) | Steel | ASTM D-3330, width |
Tensile Strength Test Methods
Tensile Strength | Test Method |
---|---|
33 (lbs./in.) | ASTM D-3759, at Break, width |
Dielectric Strength Test Methods
Dielectric Strength | Test Method |
---|---|
7000 (Volts) | ASTM D-149 |
Elongation Test Methods
Elongation | Test Method |
---|---|
60 % | D-3759 (at Break) |
Outgassing Test Methods
Outgassing | Test Method |
---|---|
%TLM = 0.58 | ASTM E-595 |
%CVCM = 0.24 | ASTM E-595 |