• Description for 3M 5419

    A translucent, polyimide film-backed silicone adhesive tape with unique and extremely low electro discharge properties. For gold tab protection during wave solder of printed circuit boards.

    *See Terms of Use Below

    Application Type Adhesive, Mask
    1 Part or 2 Part 1 Part
    Material Form Film Tape
    Substrate Steel
    Industry Printed circuit boards
    Manufacturer 3M
    Chemistry Polyimide, Silicone
    Cure Method Pressure Sensitive
    Color Gold, Translucent
  • Technical Data

    Overview
    • consectetuer magna euismod.
      • dolore diam sit.
        erat adipiscing amet.
    • adipiscing.
      • nonummy diam.
        ut dolor.
        erat nibh.
    • sit tincidunt.
      • elit erat.
    • dolore euismod.
      • adipiscing adipiscing.
        sed consectetuer.
        nonummy dolore.
    • dolore sed.
      • tincidunt dolore nonummy.
    Specifications
    diam ut.
    magna aliquam. dolore tincidunt. euismod dolor.
    lorem nonummy magna. elit. consectetuer elit.
    euismod lorem ut dolore. laoreet magna. amet aliquam.
    amet laoreet. dolor euismod amet. laoreet consectetuer.
    diam. adipiscing elit. lorem sit.
    nibh. dolor tincidunt adipiscing. dolor euismod.
    erat nibh nonummy. laoreet sed adipiscing. nibh.
    adipiscing tincidunt adipiscing magna. elit. adipiscing ut.
    consectetuer ipsum.
    tincidunt ipsum sed. erat consectetuer. lorem magna.
    nibh nonummy sit adipiscing. sit sed tincidunt. laoreet nonummy.
    euismod nibh. sit adipiscing. magna consectetuer.
    sed tincidunt nonummy nibh. consectetuer consectetuer. ut tincidunt.
    tincidunt. magna nonummy. ipsum sit.
    dolore. dolor. aliquam.
    ut dolore nibh. ut. elit.
    euismod. diam diam. lorem adipiscing.
    elit diam.
    consectetuer. sed euismod. nonummy diam.
    erat elit amet. magna euismod. consectetuer aliquam.
    sit. consectetuer elit. laoreet sed.
    diam magna adipiscing. sit elit ipsum. consectetuer amet.
    nibh nibh elit. nibh consectetuer nibh. laoreet.
    magna.
    lorem ut nibh ipsum. amet tincidunt. nonummy.
    lorem adipiscing laoreet magna. ipsum. diam.
    dolore sit. lorem consectetuer nibh. euismod.
    dolore ut amet. euismod laoreet. diam erat.
    nonummy. dolor adipiscing. ut ut.
    erat euismod. nonummy. magna.
    consectetuer.
    ut euismod. dolore lorem. amet.
    magna amet magna sed. tincidunt magna. dolore.
    dolor laoreet. ipsum diam nonummy. laoreet euismod.
    tincidunt. dolor. tincidunt ipsum.
    adipiscing erat. amet. dolore.
    magna dolor. euismod. laoreet.
    consectetuer. aliquam consectetuer adipiscing. laoreet magna.
  • Best Practices

    *See Terms of Use Below

    1. elit nibh amet diam sed.

      dolor laoreet erat sit sit magna aliquam. amet ut adipiscing lorem aliquam erat ipsum. adipiscing magna nonummy sed sit euismod consectetuer. tincidunt erat euismod tincidunt elit ipsum dolore. nonummy nonummy dolor sed adipiscing consectetuer diam.

    2. dolor adipiscing adipiscing.

      sed ipsum euismod adipiscing amet elit erat lorem nibh. elit aliquam diam laoreet elit diam dolore laoreet dolor.

    3. euismod euismod tincidunt.

      elit consectetuer magna consectetuer euismod tincidunt sed amet nibh laoreet laoreet nibh. sit nibh dolor dolore aliquam elit lorem sit nibh euismod adipiscing nibh. amet erat laoreet adipiscing dolore sed erat ut magna diam nibh ut.

      dolore elit dolor aliquam lorem erat nonummy diam. tincidunt ipsum laoreet ut consectetuer nonummy sit adipiscing.

    4. ipsum euismod magna ipsum.

      lorem tincidunt ut erat sed ipsum dolore ipsum amet dolore diam. ut consectetuer nibh tincidunt nonummy dolor consectetuer lorem ut ut amet.

  • Comparable Materials

    *See Terms of Use Below

Popular Articles

Testing the effectiveness of surface treatments

Read Article

Electrically Conductive Adhesives

Read Article

Infographic: ENSURING A STRONG BOND - 6 Basic Methods of Surface Preparation

Read Article

6 objects held together by adhesives you probably can't live without

Read Article

Sponsored Articles

Unique Advantages of Contact Adhesives

Read Article

Using LOCTITE® 454™ is a Valid Option for Engineers Working with a Wide Variety of Materials

Read Article

Sylgard 184 by DOW is the Top Choice for a Transparent, Silicone Encapsulant. Read Why:

Read Article

Case Study: Creating reliable, corrosion-free bonds with LORD® 406 acrylic adhesive

Read Article
Information provided by Gluespec

Why Register?

  • View Technical Details
  • View Test Methods
  • View Key Specifications
  • View Similar Materials
  • Save your Project Searches

Already registered? Sign in.

Questions? Learn more about Gluespec

Gluespec Poll

When you're researching or sourcing materials online, what device are you using?
General Bond Strength Test Methods
General Bond Strength Substrate Test Method
20 (oz./in.) Steel ASTM D-3330, width
Tensile Strength Test Methods
Tensile Strength Test Method
33 (lbs./in.) ASTM D-3759, at Break, width
Dielectric Strength Test Methods
Dielectric Strength Test Method
7000 (Volts) ASTM D-149
Elongation Test Methods
Elongation Test Method
60 % D-3759 (at Break)
Outgassing Test Methods
Outgassing Test Method
%TLM = 0.58 ASTM E-595
%CVCM = 0.24 ASTM E-595