9 piw |
90° Peel Strength |
0.03 min |
24°C |
FR-4/Aluminum |
|
ASTM D1876, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to either FR-4 printed circuit board substrate (alcohol wiped) or cold rolled steel (MEK wiped). Bonds made on Sencorp device using 20 lbs. pressure. |
9 piw |
90° Peel Strength |
0.03 min |
35°C |
FR-4/Aluminum |
|
ASTM D1876, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to either FR-4 printed circuit board substrate (alcohol wiped) or cold rolled steel (MEK wiped). Bonds made on Sencorp device using 20 lbs. pressure. |
9 piw |
90° Peel Strength |
0.03 min |
46°C |
FR-4/Aluminum |
|
ASTM D1876, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to either FR-4 printed circuit board substrate (alcohol wiped) or cold rolled steel (MEK wiped). Bonds made on Sencorp device using 20 lbs. pressure. |
10 piw |
90° Peel Strength |
0.03 min |
57°C |
FR-4/Aluminum |
|
ASTM D1876, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to either FR-4 printed circuit board substrate (alcohol wiped) or cold rolled steel (MEK wiped). Bonds made on Sencorp device using 20 lbs. pressure. |
11 piw |
90° Peel Strength |
0.03 min |
68°C |
FR-4/Aluminum |
|
ASTM D1876, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to either FR-4 printed circuit board substrate (alcohol wiped) or cold rolled steel (MEK wiped). Bonds made on Sencorp device using 20 lbs. pressure. |
12 piw |
90° Peel Strength |
0.03 min |
79°C |
FR-4/Aluminum |
|
ASTM D1876, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to either FR-4 printed circuit board substrate (alcohol wiped) or cold rolled steel (MEK wiped). Bonds made on Sencorp device using 20 lbs. pressure. |
13 piw |
90° Peel Strength |
0.03 min |
90°C |
FR-4/Aluminum |
|
ASTM D1876, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to either FR-4 printed circuit board substrate (alcohol wiped) or cold rolled steel (MEK wiped). Bonds made on Sencorp device using 20 lbs. pressure. |
14 piw |
90° Peel Strength |
0.03 min |
101°C |
FR-4/Aluminum |
|
ASTM D1876, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to either FR-4 printed circuit board substrate (alcohol wiped) or cold rolled steel (MEK wiped). Bonds made on Sencorp device using 20 lbs. pressure. |
14 piw |
90° Peel Strength |
0.03 min |
113°C |
FR-4/Aluminum |
|
ASTM D1876, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to either FR-4 printed circuit board substrate (alcohol wiped) or cold rolled steel (MEK wiped). Bonds made on Sencorp device using 20 lbs. pressure. |
12 piw |
90° Peel Strength |
0.03 min |
124°C |
FR-4/Aluminum |
|
ASTM D1876, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to either FR-4 printed circuit board substrate (alcohol wiped) or cold rolled steel (MEK wiped). Bonds made on Sencorp device using 20 lbs. pressure. |
12 piw |
90° Peel Strength |
0.03 min |
135°C |
FR-4/Aluminum |
|
ASTM D1876, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to either FR-4 printed circuit board substrate (alcohol wiped) or cold rolled steel (MEK wiped). Bonds made on Sencorp device using 20 lbs. pressure. |
12 piw |
90° Peel Strength |
0.03 min |
146°C |
FR-4/Aluminum |
|
ASTM D1876, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to either FR-4 printed circuit board substrate (alcohol wiped) or cold rolled steel (MEK wiped). Bonds made on Sencorp device using 20 lbs. pressure. |
11 piw |
90° Peel Strength |
0.03 min |
157°C |
FR-4/Aluminum |
|
ASTM D1876, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to either FR-4 printed circuit board substrate (alcohol wiped) or cold rolled steel (MEK wiped). Bonds made on Sencorp device using 20 lbs. pressure. |
11 piw |
90° Peel Strength |
0.03 min |
168°C |
FR-4/Aluminum |
|
ASTM D1876, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to either FR-4 printed circuit board substrate (alcohol wiped) or cold rolled steel (MEK wiped). Bonds made on Sencorp device using 20 lbs. pressure. |
11 piw |
90° Peel Strength |
0.03 min |
179°C |
FR-4/Aluminum |
|
ASTM D1876, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to either FR-4 printed circuit board substrate (alcohol wiped) or cold rolled steel (MEK wiped). Bonds made on Sencorp device using 20 lbs. pressure. |
9 piw |
90° Peel Strength |
0.33 min |
24°C |
FR-4/Aluminum |
|
ASTM D1876, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to either FR-4 printed circuit board substrate (alcohol wiped) or cold rolled steel (MEK wiped). Bonds made on Sencorp device using 20 lbs. pressure. |
9 piw |
90° Peel Strength |
0.33 min |
35°C |
FR-4/Aluminum |
|
ASTM D1876, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to either FR-4 printed circuit board substrate (alcohol wiped) or cold rolled steel (MEK wiped). Bonds made on Sencorp device using 20 lbs. pressure. |
9 piw |
90° Peel Strength |
0.33 min |
46°C |
FR-4/Aluminum |
|
ASTM D1876, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to either FR-4 printed circuit board substrate (alcohol wiped) or cold rolled steel (MEK wiped). Bonds made on Sencorp device using 20 lbs. pressure. |
10 piw |
90° Peel Strength |
0.33 min |
57°C |
FR-4/Aluminum |
|
ASTM D1876, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to either FR-4 printed circuit board substrate (alcohol wiped) or cold rolled steel (MEK wiped). Bonds made on Sencorp device using 20 lbs. pressure. |
11 piw |
90° Peel Strength |
0.33 min |
68°C |
FR-4/Aluminum |
|
ASTM D1876, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to either FR-4 printed circuit board substrate (alcohol wiped) or cold rolled steel (MEK wiped). Bonds made on Sencorp device using 20 lbs. pressure. |
13 piw |
90° Peel Strength |
0.33 min |
79°C |
FR-4/Aluminum |
|
ASTM D1876, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to either FR-4 printed circuit board substrate (alcohol wiped) or cold rolled steel (MEK wiped). Bonds made on Sencorp device using 20 lbs. pressure. |
14 piw |
90° Peel Strength |
0.33 min |
90°C |
FR-4/Aluminum |
|
ASTM D1876, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to either FR-4 printed circuit board substrate (alcohol wiped) or cold rolled steel (MEK wiped). Bonds made on Sencorp device using 20 lbs. pressure. |
14 piw |
90° Peel Strength |
0.33 min |
101°C |
FR-4/Aluminum |
|
ASTM D1876, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to either FR-4 printed circuit board substrate (alcohol wiped) or cold rolled steel (MEK wiped). Bonds made on Sencorp device using 20 lbs. pressure. |
13 piw |
90° Peel Strength |
0.33 min |
113°C |
FR-4/Aluminum |
|
ASTM D1876, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to either FR-4 printed circuit board substrate (alcohol wiped) or cold rolled steel (MEK wiped). Bonds made on Sencorp device using 20 lbs. pressure. |
12 piw |
90° Peel Strength |
0.33 min |
124°C |
FR-4/Aluminum |
|
ASTM D1876, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to either FR-4 printed circuit board substrate (alcohol wiped) or cold rolled steel (MEK wiped). Bonds made on Sencorp device using 20 lbs. pressure. |
12 piw |
90° Peel Strength |
0.33 min |
135°C |
FR-4/Aluminum |
|
ASTM D1876, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to either FR-4 printed circuit board substrate (alcohol wiped) or cold rolled steel (MEK wiped). Bonds made on Sencorp device using 20 lbs. pressure. |
11 piw |
90° Peel Strength |
0.33 min |
146°C |
FR-4/Aluminum |
|
ASTM D1876, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to either FR-4 printed circuit board substrate (alcohol wiped) or cold rolled steel (MEK wiped). Bonds made on Sencorp device using 20 lbs. pressure. |
11 piw |
90° Peel Strength |
0.33 min |
157°C |
FR-4/Aluminum |
|
ASTM D1876, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to either FR-4 printed circuit board substrate (alcohol wiped) or cold rolled steel (MEK wiped). Bonds made on Sencorp device using 20 lbs. pressure. |
11 piw |
90° Peel Strength |
0.33 min |
168°C |
FR-4/Aluminum |
|
ASTM D1876, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to either FR-4 printed circuit board substrate (alcohol wiped) or cold rolled steel (MEK wiped). Bonds made on Sencorp device using 20 lbs. pressure. |
10 piw |
90° Peel Strength |
0.33 min |
179°C |
FR4/Aluminum |
|
ASTM D1876, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to either FR-4 printed circuit board substrate (alcohol wiped) or cold rolled steel (MEK wiped). Bonds made on Sencorp device using 20 lbs. pressure. |
5 piw |
90° Peel Strength |
0.03 min |
24°C |
CRS/Aluminum |
|
ASTM D1002, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to each test substrate.Sintech 5/GL peel rate was 2"/minute. |
6 piw |
90° Peel Strength |
0.03 min |
35°C |
CRS/Aluminum |
|
ASTM D1002, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to each test substrate.Sintech 5/GL peel rate was 2"/minute. |
6 piw |
90° Peel Strength |
0.03 min |
46°C |
CRS/Aluminum |
|
ASTM D1002, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to each test substrate.Sintech 5/GL peel rate was 2"/minute. |
6 piw |
90° Peel Strength |
0.03 min |
57°C |
CRS/Aluminum |
|
ASTM D1002, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to each test substrate.Sintech 5/GL peel rate was 2"/minute. |
7 piw |
90° Peel Strength |
0.03 min |
68°C |
CRS/Aluminum |
|
ASTM D1002, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to each test substrate.Sintech 5/GL peel rate was 2"/minute. |
8 piw |
90° Peel Strength |
0.03 min |
79°C |
CRS/Aluminum |
|
ASTM D1002, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to each test substrate.Sintech 5/GL peel rate was 2"/minute. |
9 piw |
90° Peel Strength |
0.03 min |
90°C |
CRS/Aluminum |
|
ASTM D1002, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to each test substrate.Sintech 5/GL peel rate was 2"/minute. |
11 piw |
90° Peel Strength |
0.03 min |
101°C |
CRS/Aluminum |
|
ASTM D1002, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to each test substrate.Sintech 5/GL peel rate was 2"/minute. |
12 piw |
90° Peel Strength |
0.03 min |
113°C |
CRS/Aluminum |
|
ASTM D1002, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to each test substrate.Sintech 5/GL peel rate was 2"/minute. |
13 piw |
90° Peel Strength |
0.03 min |
124°C |
CRS/Aluminum |
|
ASTM D1002, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to each test substrate.Sintech 5/GL peel rate was 2"/minute. |
12 piw |
90° Peel Strength |
0.03 min |
135°C |
CRS/Aluminum |
|
ASTM D1002, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to each test substrate.Sintech 5/GL peel rate was 2"/minute. |
12 piw |
90° Peel Strength |
0.03 min |
146°C |
CRS/Aluminum |
|
ASTM D1002, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to each test substrate.Sintech 5/GL peel rate was 2"/minute. |
11 piw |
90° Peel Strength |
0.03 min |
157°C |
CRS/Aluminum |
|
ASTM D1002, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to each test substrate.Sintech 5/GL peel rate was 2"/minute. |
10 piw |
90° Peel Strength |
0.03 min |
168°C |
CRS/Aluminum |
|
ASTM D1002, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to each test substrate.Sintech 5/GL peel rate was 2"/minute. |
6 piw |
90° Peel Strength |
0.03 min |
179°C |
CRS/Aluminum |
|
ASTM D1002, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to each test substrate.Sintech 5/GL peel rate was 2"/minute. |
6 piw |
90° Peel Strength |
0.33 min |
24°C |
CRS/Aluminum |
|
ASTM D1002, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to each test substrate.Sintech 5/GL peel rate was 2"/minute. |
6 piw |
90° Peel Strength |
0.33 min |
35°C |
CRS/Aluminum |
|
ASTM D1002, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to each test substrate.Sintech 5/GL peel rate was 2"/minute. |
6 piw |
90° Peel Strength |
0.33 min |
46°C |
CRS/Aluminum |
|
ASTM D1002, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to each test substrate.Sintech 5/GL peel rate was 2"/minute. |
7 piw |
90° Peel Strength |
0.33 min |
57°C |
CRS/Aluminum |
|
ASTM D1002, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to each test substrate.Sintech 5/GL peel rate was 2"/minute. |
9 piw |
90° Peel Strength |
0.33 min |
68°C |
CRS/Aluminum |
|
ASTM D1002, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to each test substrate.Sintech 5/GL peel rate was 2"/minute. |
10 piw |
90° Peel Strength |
0.33 min |
79°C |
CRS/Aluminum |
|
ASTM D1002, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to each test substrate.Sintech 5/GL peel rate was 2"/minute. |
12 piw |
90° Peel Strength |
0.33 min |
90°C |
CRS/Aluminum |
|
ASTM D1002, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to each test substrate.Sintech 5/GL peel rate was 2"/minute. |
14 piw |
90° Peel Strength |
0.33 min |
101°C |
CRS/Aluminum |
|
ASTM D1002, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to each test substrate.Sintech 5/GL peel rate was 2"/minute. |
13 piw |
90° Peel Strength |
0.33 min |
113°C |
CRS/Aluminum |
|
ASTM D1002, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to each test substrate.Sintech 5/GL peel rate was 2"/minute. |
13 piw |
90° Peel Strength |
0.33 min |
124°C |
CRS/Aluminum |
|
|
12 piw |
90° Peel Strength |
0.33 min |
135°C |
CRS/Aluminum |
|
|
12 piw |
90° Peel Strength |
0.33 min |
146°C |
CRS/Aluminum |
|
|
12 piw |
90° Peel Strength |
0.33 min |
157°C |
CRS/Aluminum |
|
|
11 piw |
90° Peel Strength |
0.33 min |
168°C |
CRS/Aluminum |
|
|
9 piw |
90° Peel Strength |
0.33 min |
179°C |
CRS/Aluminum |
|
|
10 piw |
90° Peel Strength |
0.25 min |
157°C |
Aluminum (solvent wiped) |
|
|
10 piw |
90° Peel Strength |
0.25 min |
157°C |
Aluminum (etched) |
|
|
10 piw |
90° Peel Strength |
0.25 min |
157°C |
Aluminum (sanded, solvent wiped) |
|
|
10 piw |
90° Peel Strength |
0.25 min |
157°C |
Aluminum (scour pad abraded, solvent wiped) |
|
|
11 piw |
90° Peel Strength |
0.25 min |
157°C |
FR-4 (printed circuit board substrate) |
|
|
9 piw |
90° Peel Strength |
0.25 min |
157°C |
Phenolic Board |
|
|
11 piw |
90° Peel Strength |
0.25 min |
157°C |
Cold Rolled Steel |
|
|
10 piw |
90° Peel Strength |
0.25 min |
157°C |
Stainless Steel |
|
|
10 piw |
90° Peel Strength |
0.25 min |
157°C |
ABS (acrylonitrile-butadiene-styrene) |
|
|
10 piw |
90° Peel Strength |
0.25 min |
157°C |
Ultem® 1000 (polyetherimide) |
|
|
9 piw |
90° Peel Strength |
0.25 min |
157°C |
Soda Lime Glass |
|
|
10 piw |
90° Peel Strength |
0.25 min |
157°C |
PVC (polyvinyl chloride) |
|
|
10 piw |
90° Peel Strength |
0.25 min |
157°C |
Acrylic |
|
|
<1 piw |
90° Peel Strength |
0.25 min |
157°C |
Polypropylene |
|
|
<1 piw |
90° Peel Strength |
0.25 min |
157°C |
HDPE (high density polyethylene) |
|
|
9 piw |
90° Peel Strength |
0.25 min |
149°C |
HIPS (high intensity polystyrene) |
|
|
<1 piw |
90° Peel Strength |
0.25 min |
149°C |
EPDM (ethylene-propylene-diene monomer rubber) |
|
|
6 piw |
90° Peel Strength |
0.25 min |
149°C |
Neoprene (Shore A60) |
|
|
7 piw |
90° Peel Strength |
0.25 min |
177°C |
Nitrile (Shore A60) |
|
|
16 piw |
90° Peel Strength |
0.25 min |
177°C |
SBR (styrene butadiene resin) |
|
|
5 piw |
90° Peel Strength |
0.25 min |
177°C |
Kapton 200E® (polyimide film) |
|
|
3 piw |
90° Peel Strength |
0.25 min |
149°C |
PET (polyester film) |
|
|
2 piw |
90° Peel Strength |
0.25 min |
149°C |
PEN (polyethylene naphthalate film) |
|
|
8 piw |
90° Peel Strength |
0.25 min |
149°C |
Denim Fabric |
|
|
2 (psi) |
90° Peel Strength |
0.08 min |
177°C |
|
-55°C |
|
11 (psi) |
90° Peel Strength |
0.08 min |
177°C |
|
24°C |
|
4 (psi) |
90° Peel Strength |
0.08 min |
177°C |
|
121°C |
|
1 (psi) |
90° Peel Strength |
13 min |
|
|
-55°C |
|
9 (psi) |
90° Peel Strength |
0.22 min |
|
|
24°C |
|
5 (psi) |
90° Peel Strength |
0.22 min |
|
|
121°C |
|
2 (psi) |
90° Peel Strength |
0.08 min |
|
|
-55°C |
|
11 (psi) |
90° Peel Strength |
0.08 min |
|
|
24°C |
|
2 (psi) |
90° Peel Strength |
0.08 min |
|
|
121°C |
|
2 (psi) |
90° Peel Strength |
13 min |
|
|
-55°C |
|
10 (psi) |
90° Peel Strength |
13 min |
|
|
24°C |
|
6 (psi) |
90° Peel Strength |
13 min |
|
|
121°C |
|