• Description for 3M 583

    A high strength, flexible, nitrile phenolic based thermoplastic bonding film.

    *See Terms of Use Below

    Application Type Bond
    1 Part or 2 Part 1 Part
    Material Form Film
    Substrate Acrylic, Aluminum (solvent wiped), Aluminum, Denim Fabric, Phenolic Board, HDPE (high density polyethylene), HIPS (high intensity polystyrene), EPDM (ethylene-propylene-diene monomer rubber), SBR (styrene butadiene resin), Kapton 200E® (polyimide film), Soda Lime Glass, Neoprene, ABS (acrylonitrile-butadiene-styrene), PET (polyester film), Polypropylene, PVC (polyvinyl chloride), CRS (Cold Rolled Steel), Stainless Steel, Phenolic Board, Aluminum (etched), PEN (polyethylene naphthalate film), polyimide, Ultem® 1000 (polyetherimide), Aluminum (sanded, solvent wiped), Polyetherimide, Aluminum (scour pad abraded, solvent wiped), Thermoplastic
    Industry FR-4 printed circuit board
    Manufacturer 3M
    Chemistry nitrile phenolic
    Cure Method Pressure Sensitive
    Color Brown
    Relative Solvent Resistance Chemical Resistance: Solvent resistance
    High Temperature Resistance (°C) heat resistance, 121
    Low Temperature Resistance (°C) -55
  • Technical Data for 3M 583

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 1 Part
    • Material Form
      • Film
    • Substrate
      • Glass - Soda Lime Glass
      • Aluminum - Aluminum (solvent wiped), Aluminum (etched), Aluminum (sanded, solvent wiped), Aluminum (scour pad abraded, solvent wiped)
      • Steel - CRS (Cold Rolled Steel)
      • Plastic - ABS (acrylonitrile-butadiene-styrene), Ultem® 1000 (polyetherimide), Polyetherimide, Thermoplastic
      • Acrylic (PMMA) - Acrylic
      • Phenolic - Phenolic Board
      • Polyethylene (LDPE, HDPE) - HDPE (high density polyethylene), PEN (polyethylene naphthalate film)
      • Polystyrene (PS) - HIPS (high intensity polystyrene)
      • Polyimide (PI) - Kapton 200E® (polyimide film), polyimide
      • Polypropylene
      • Polyvinyl chloride (PVC) - PVC (polyvinyl chloride)
      • EPM/EPDM - EPDM (ethylene-propylene-diene monomer rubber)
      • Styrene Butadiene Rubber (SBR) - SBR (styrene butadiene resin)
      • Neoprene
      • Wood - Phenolic Board
      • Fabric - Denim Fabric
      • Polyester - PET (polyester film)
      • Stainless Steel
      • Other - FR-4, Nitrile
    • Industry
      • Printed Circuit Board (PCB) - FR-4 printed circuit board
    • Chemistry
      • Other - nitrile phenolic
    • Application Method
      • Roll - heated roll laminator
      • Brush
      • Spray
      • Dip
      • Other - heated static press, autoclave, Wip
    • Cure Method
      • Pressure Sensitive (min) - Pressure Sensitive
    • Color
      • Brown
    Specifications
    Bond Strength
    General Bond Strength (psi) High, 2 (lb.), 2 (lb) Test Method
    Peel Strength (piw) 9, 9, 9, 10, 11, 12, 13, 14, 14, 12, 12, 12, 11, 11, 11, 9, 9, 9, 10, 11, 13, 14, 14, 13, 12, 12, 11, 11, 11, 10, 5, 6, 6, 6, 7, 8, 9, 11, 12, 13, 12, 12, 11, 10, 6, 6, 6, 6, 7, 9, 10, 12, 14, 13, 13, 12, 12, 12, 11, 9, 10, 10, 10, 10, 11, 9, 11, 10, 10, 10, 9, 10, 10, <1, <1, 9, <1, 6, 7, 16, 5, 3, 2, 8, 2 (psi), 11 (psi), 4 (psi), 1 (psi), 9 (psi), 5 (psi), 2 (psi), 11 (psi), 2 (psi), 2 (psi), 10 (psi), 6 (psi) Test Method
    Shear Strength (psi) 580, 630, 640, 660, 600, 500, 750, 600, 650, 40, 380, 860, 270, 740, 680, 7, 670, 950, 170, 810, 780, 730, 770 Test Method
    Tensile Strength (psi) 400, 3,140 Test Method
    Material Resistance
    High Temperature Resistance (°C) heat resistance, 121
    Low Temperature Resistance (°C) -55
    Conductivity
    Dissipation Factor 0.06400, 0.03700 Test Method
    Dielectric Strength (V/mil) 3,000, 990 Test Method
    Dielectric Constant 3.10, 5.70 Test Method
    Surface Resistivity (O) 3.14e10 (ohms/sq.), 3.43e10 (ohms/sq.) Test Method
    Volume Resistivity (O) 1.44e12 (ohms-cm.), 2.13e13 (ohms-cm.) Test Method
    Hardness
    Elongation (%) 800, 180 Test Method
    Flexibility Flexible
    Modulus (psi) 240, 13,800 Test Method
    Other Properties
    Coefficient of Thermal Expansion (CTE) 280e-6 (Below Tg CTE/°C), 740e-6 (Above Tg CTE/°C ), 380e-6 (Above Tg CTE/°C) Test Method
    Business Information
    Shelf Life Details Storage: Store product at or below 40°F (4°C) for maximum storage life. Higher temperatures reduce normal storage life., Shelf life is 6 months from date of shipment at 75°F (23°C) and 18 months from date of shipment at 40°F (4°C).
    Shelf Life Temperature (°F) 73, At 40 (F)
    Shelf Life (mon) 6, 18
  • Best Practices for 3M 583

    *See Terms of Use Below

  • Comparable Materials for 3M 583

    *See Terms of Use Below

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Shear Strength Test Methods
Shear Strength Type Cure Time Cure Temperature Substrate Test Temperature Test Method
580 psi Overlap shear strength 0.25 min 157°C Aluminum (solvent wiped) ASTM D1002, OLS bonds were 1" x 1" using 20 mil etched aluminum bonded to each test substrate. Sintech 5/GL shear rate was 0.2"/minute.
630 psi Overlap shear strength 0.25 min 157°C Aluminum (etched) ASTM D1002, OLS bonds were 1" x 1" using 20 mil etched aluminum bonded to each test substrate. Sintech 5/GL shear rate was 0.2"/minute.
640 psi Overlap shear strength 0.25 min 157°C Aluminum (sanded, solvent wiped) ASTM D1002, OLS bonds were 1" x 1" using 20 mil etched aluminum bonded to each test substrate. Sintech 5/GL shear rate was 0.2"/minute.
660 psi Overlap shear strength 0.25 min 157°C Aluminum (scour pad abraded, solvent wiped) ASTM D1002, OLS bonds were 1" x 1" using 20 mil etched aluminum bonded to each test substrate. Sintech 5/GL shear rate was 0.2"/minute.
600 psi Overlap shear strength 0.25 min 157°C FR-4 (printed circuit board substrate) ASTM D1002, OLS bonds were 1" x 1" using 20 mil etched aluminum bonded to each test substrate. Sintech 5/GL shear rate was 0.2"/minute.
500 psi Overlap shear strength 0.25 min 157°C Phenolic Board ASTM D1002, OLS bonds were 1" x 1" using 20 mil etched aluminum bonded to each test substrate. Sintech 5/GL shear rate was 0.2"/minute.
750 psi Overlap shear strength 0.25 min 157°C Cold Rolled Steel ASTM D1002, OLS bonds were 1" x 1" using 20 mil etched aluminum bonded to each test substrate. Sintech 5/GL shear rate was 0.2"/minute.
600 psi Overlap shear strength 0.08 min 149°C -55°C ASTM D1002, OLS bonds were 1" x 1" using either FR-4 printed circuit board (alcohol wiped) or cold rolled steel (MEK wiped) bonded to 20 mil etched aluminum. Sintech 5/GL shear rate was 0.2"/minute., No X-link
650 psi Overlap shear strength 0.08 min 149°C 24°C ASTM D1002, OLS bonds were 1" x 1" using either FR-4 printed circuit board (alcohol wiped) or cold rolled steel (MEK wiped) bonded to 20 mil etched aluminum. Sintech 5/GL shear rate was 0.2"/minute., No X-link
40 psi Overlap shear strength 0.08 min 149°C immersion in distilled water 121°C ASTM D1002, OLS bonds were 1" x 1" using either FR-4 printed circuit board (alcohol wiped) or cold rolled steel (MEK wiped) bonded to 20 mil etched aluminum. Sintech 5/GL shear rate was 0.2"/minute., No X-link
380 psi Overlap shear strength 13 min 177°C -55°C ASTM D1002, OLS bonds were 1" x 1" using either FR-4 printed circuit board (alcohol wiped) or cold rolled steel (MEK wiped) bonded to 20 mil etched aluminum. Sintech 5/GL shear rate was 0.2"/minute., X-linked
860 psi Overlap shear strength 13 min 177°C 24°C ASTM D1002, OLS bonds were 1" x 1" using either FR-4 printed circuit board (alcohol wiped) or cold rolled steel (MEK wiped) bonded to 20 mil etched aluminum. Sintech 5/GL shear rate was 0.2"/minute., X-linked
270 psi Overlap shear strength 13 min 177°C 121°C ASTM D1002, OLS bonds were 1" x 1" using either FR-4 printed circuit board (alcohol wiped) or cold rolled steel (MEK wiped) bonded to 20 mil etched aluminum. Sintech 5/GL shear rate was 0.2"/minute.,X-linked
740 psi Overlap shear strength 0.08 min 149°C -55°C ASTM D1002, OLS bonds were 1" x 1" using either FR-4 printed circuit board (alcohol wiped) or cold rolled steel (MEK wiped) bonded to 20 mil etched aluminum. Sintech 5/GL shear rate was 0.2"/minute., No X-link
680 psi Overlap shear strength 0.08 min 149°C 24°C ASTM D1002, OLS bonds were 1" x 1" using either FR-4 printed circuit board (alcohol wiped) or cold rolled steel (MEK wiped) bonded to 20 mil etched aluminum. Sintech 5/GL shear rate was 0.2"/minute. No X-link
7 psi Overlap shear strength 0.08 min 149°C 121°C ASTM D1002, OLS bonds were 1" x 1" using either FR-4 printed circuit board (alcohol wiped) or cold rolled steel (MEK wiped) bonded to 20 mil etched aluminum. Sintech 5/GL shear rate was 0.2"/minute., No X-link
670 psi Overlap shear strength 13 min 177°C -55°C ASTM D1002, OLS bonds were 1" x 1" using either FR-4 printed circuit board (alcohol wiped) or cold rolled steel (MEK wiped) bonded to 20 mil etched aluminum. Sintech 5/GL shear rate was 0.2"/minute., X-linked
950 psi Overlap shear strength 13 min 177°C 24°C ASTM D1002, OLS bonds were 1" x 1" using either FR-4 printed circuit board (alcohol wiped) or cold rolled steel (MEK wiped) bonded to 20 mil etched aluminum. Sintech 5/GL shear rate was 0.2"/minute., X-linked
170 psi Overlap shear strength 13 min 177°C 121°C ASTM D1002, OLS bonds were 1" x 1" using either FR-4 printed circuit board (alcohol wiped) or cold rolled steel (MEK wiped) bonded to 20 mil etched aluminum. Sintech 5/GL shear rate was 0.2"/minute., X-linked.
810 psi Overlap shear strength 157°C 25°C ASTM D1002, OLS bonds were 1" x 1" using FR-4 printed circuit board substrate bonded to FR-4 (alcohol wiped).* Sintech 5/GL shear rate was 0.2"/minute.
780 psi Overlap shear strength 157°C 71°C ASTM D1002, OLS bonds were 1" x 1" using FR-4 printed circuit board substrate bonded to FR-4 (alcohol wiped).* Sintech 5/GL shear rate was 0.2"/minute.
730 psi Overlap shear strength 157°C 49°C ASTM D1002, OLS bonds were 1" x 1" using FR-4 printed circuit board substrate bonded to FR-4 (alcohol wiped).* Sintech 5/GL shear rate was 0.2"/minute.
770 psi Overlap shear strength 157°C ASTM D1002, OLS bonds were 1" x 1" using FR-4 printed circuit board substrate bonded to FR-4 (alcohol wiped).* Sintech 5/GL shear rate was 0.2"/minute.
Tensile Strength Test Methods
Tensile Strength Test Method
400 psi Tensile conducted on Sintech 5/GL at 0.2"/minute speed. ASTM D638, Before Crosslinking
3,140 psi Tensile conducted on Sintech 5/GL at 0.2"/minute speed. ASTM D638, After Crosslinking.
Peel Strength Test Methods
Peel Strength Type Cure Time Cure Temperature Substrate Test Temperature Test Method
9 piw 90° Peel Strength 0.03 min 24°C FR-4/Aluminum ASTM D1876, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to either FR-4 printed circuit board substrate (alcohol wiped) or cold rolled steel (MEK wiped). Bonds made on Sencorp device using 20 lbs. pressure.
9 piw 90° Peel Strength 0.03 min 35°C FR-4/Aluminum ASTM D1876, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to either FR-4 printed circuit board substrate (alcohol wiped) or cold rolled steel (MEK wiped). Bonds made on Sencorp device using 20 lbs. pressure.
9 piw 90° Peel Strength 0.03 min 46°C FR-4/Aluminum ASTM D1876, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to either FR-4 printed circuit board substrate (alcohol wiped) or cold rolled steel (MEK wiped). Bonds made on Sencorp device using 20 lbs. pressure.
10 piw 90° Peel Strength 0.03 min 57°C FR-4/Aluminum ASTM D1876, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to either FR-4 printed circuit board substrate (alcohol wiped) or cold rolled steel (MEK wiped). Bonds made on Sencorp device using 20 lbs. pressure.
11 piw 90° Peel Strength 0.03 min 68°C FR-4/Aluminum ASTM D1876, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to either FR-4 printed circuit board substrate (alcohol wiped) or cold rolled steel (MEK wiped). Bonds made on Sencorp device using 20 lbs. pressure.
12 piw 90° Peel Strength 0.03 min 79°C FR-4/Aluminum ASTM D1876, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to either FR-4 printed circuit board substrate (alcohol wiped) or cold rolled steel (MEK wiped). Bonds made on Sencorp device using 20 lbs. pressure.
13 piw 90° Peel Strength 0.03 min 90°C FR-4/Aluminum ASTM D1876, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to either FR-4 printed circuit board substrate (alcohol wiped) or cold rolled steel (MEK wiped). Bonds made on Sencorp device using 20 lbs. pressure.
14 piw 90° Peel Strength 0.03 min 101°C FR-4/Aluminum ASTM D1876, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to either FR-4 printed circuit board substrate (alcohol wiped) or cold rolled steel (MEK wiped). Bonds made on Sencorp device using 20 lbs. pressure.
14 piw 90° Peel Strength 0.03 min 113°C FR-4/Aluminum ASTM D1876, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to either FR-4 printed circuit board substrate (alcohol wiped) or cold rolled steel (MEK wiped). Bonds made on Sencorp device using 20 lbs. pressure.
12 piw 90° Peel Strength 0.03 min 124°C FR-4/Aluminum ASTM D1876, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to either FR-4 printed circuit board substrate (alcohol wiped) or cold rolled steel (MEK wiped). Bonds made on Sencorp device using 20 lbs. pressure.
12 piw 90° Peel Strength 0.03 min 135°C FR-4/Aluminum ASTM D1876, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to either FR-4 printed circuit board substrate (alcohol wiped) or cold rolled steel (MEK wiped). Bonds made on Sencorp device using 20 lbs. pressure.
12 piw 90° Peel Strength 0.03 min 146°C FR-4/Aluminum ASTM D1876, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to either FR-4 printed circuit board substrate (alcohol wiped) or cold rolled steel (MEK wiped). Bonds made on Sencorp device using 20 lbs. pressure.
11 piw 90° Peel Strength 0.03 min 157°C FR-4/Aluminum ASTM D1876, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to either FR-4 printed circuit board substrate (alcohol wiped) or cold rolled steel (MEK wiped). Bonds made on Sencorp device using 20 lbs. pressure.
11 piw 90° Peel Strength 0.03 min 168°C FR-4/Aluminum ASTM D1876, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to either FR-4 printed circuit board substrate (alcohol wiped) or cold rolled steel (MEK wiped). Bonds made on Sencorp device using 20 lbs. pressure.
11 piw 90° Peel Strength 0.03 min 179°C FR-4/Aluminum ASTM D1876, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to either FR-4 printed circuit board substrate (alcohol wiped) or cold rolled steel (MEK wiped). Bonds made on Sencorp device using 20 lbs. pressure.
9 piw 90° Peel Strength 0.33 min 24°C FR-4/Aluminum ASTM D1876, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to either FR-4 printed circuit board substrate (alcohol wiped) or cold rolled steel (MEK wiped). Bonds made on Sencorp device using 20 lbs. pressure.
9 piw 90° Peel Strength 0.33 min 35°C FR-4/Aluminum ASTM D1876, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to either FR-4 printed circuit board substrate (alcohol wiped) or cold rolled steel (MEK wiped). Bonds made on Sencorp device using 20 lbs. pressure.
9 piw 90° Peel Strength 0.33 min 46°C FR-4/Aluminum ASTM D1876, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to either FR-4 printed circuit board substrate (alcohol wiped) or cold rolled steel (MEK wiped). Bonds made on Sencorp device using 20 lbs. pressure.
10 piw 90° Peel Strength 0.33 min 57°C FR-4/Aluminum ASTM D1876, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to either FR-4 printed circuit board substrate (alcohol wiped) or cold rolled steel (MEK wiped). Bonds made on Sencorp device using 20 lbs. pressure.
11 piw 90° Peel Strength 0.33 min 68°C FR-4/Aluminum ASTM D1876, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to either FR-4 printed circuit board substrate (alcohol wiped) or cold rolled steel (MEK wiped). Bonds made on Sencorp device using 20 lbs. pressure.
13 piw 90° Peel Strength 0.33 min 79°C FR-4/Aluminum ASTM D1876, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to either FR-4 printed circuit board substrate (alcohol wiped) or cold rolled steel (MEK wiped). Bonds made on Sencorp device using 20 lbs. pressure.
14 piw 90° Peel Strength 0.33 min 90°C FR-4/Aluminum ASTM D1876, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to either FR-4 printed circuit board substrate (alcohol wiped) or cold rolled steel (MEK wiped). Bonds made on Sencorp device using 20 lbs. pressure.
14 piw 90° Peel Strength 0.33 min 101°C FR-4/Aluminum ASTM D1876, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to either FR-4 printed circuit board substrate (alcohol wiped) or cold rolled steel (MEK wiped). Bonds made on Sencorp device using 20 lbs. pressure.
13 piw 90° Peel Strength 0.33 min 113°C FR-4/Aluminum ASTM D1876, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to either FR-4 printed circuit board substrate (alcohol wiped) or cold rolled steel (MEK wiped). Bonds made on Sencorp device using 20 lbs. pressure.
12 piw 90° Peel Strength 0.33 min 124°C FR-4/Aluminum ASTM D1876, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to either FR-4 printed circuit board substrate (alcohol wiped) or cold rolled steel (MEK wiped). Bonds made on Sencorp device using 20 lbs. pressure.
12 piw 90° Peel Strength 0.33 min 135°C FR-4/Aluminum ASTM D1876, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to either FR-4 printed circuit board substrate (alcohol wiped) or cold rolled steel (MEK wiped). Bonds made on Sencorp device using 20 lbs. pressure.
11 piw 90° Peel Strength 0.33 min 146°C FR-4/Aluminum ASTM D1876, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to either FR-4 printed circuit board substrate (alcohol wiped) or cold rolled steel (MEK wiped). Bonds made on Sencorp device using 20 lbs. pressure.
11 piw 90° Peel Strength 0.33 min 157°C FR-4/Aluminum ASTM D1876, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to either FR-4 printed circuit board substrate (alcohol wiped) or cold rolled steel (MEK wiped). Bonds made on Sencorp device using 20 lbs. pressure.
11 piw 90° Peel Strength 0.33 min 168°C FR-4/Aluminum ASTM D1876, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to either FR-4 printed circuit board substrate (alcohol wiped) or cold rolled steel (MEK wiped). Bonds made on Sencorp device using 20 lbs. pressure.
10 piw 90° Peel Strength 0.33 min 179°C FR4/Aluminum ASTM D1876, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to either FR-4 printed circuit board substrate (alcohol wiped) or cold rolled steel (MEK wiped). Bonds made on Sencorp device using 20 lbs. pressure.
5 piw 90° Peel Strength 0.03 min 24°C CRS/Aluminum ASTM D1002, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to each test substrate.Sintech 5/GL peel rate was 2"/minute.
6 piw 90° Peel Strength 0.03 min 35°C CRS/Aluminum ASTM D1002, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to each test substrate.Sintech 5/GL peel rate was 2"/minute.
6 piw 90° Peel Strength 0.03 min 46°C CRS/Aluminum ASTM D1002, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to each test substrate.Sintech 5/GL peel rate was 2"/minute.
6 piw 90° Peel Strength 0.03 min 57°C CRS/Aluminum ASTM D1002, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to each test substrate.Sintech 5/GL peel rate was 2"/minute.
7 piw 90° Peel Strength 0.03 min 68°C CRS/Aluminum ASTM D1002, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to each test substrate.Sintech 5/GL peel rate was 2"/minute.
8 piw 90° Peel Strength 0.03 min 79°C CRS/Aluminum ASTM D1002, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to each test substrate.Sintech 5/GL peel rate was 2"/minute.
9 piw 90° Peel Strength 0.03 min 90°C CRS/Aluminum ASTM D1002, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to each test substrate.Sintech 5/GL peel rate was 2"/minute.
11 piw 90° Peel Strength 0.03 min 101°C CRS/Aluminum ASTM D1002, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to each test substrate.Sintech 5/GL peel rate was 2"/minute.
12 piw 90° Peel Strength 0.03 min 113°C CRS/Aluminum ASTM D1002, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to each test substrate.Sintech 5/GL peel rate was 2"/minute.
13 piw 90° Peel Strength 0.03 min 124°C CRS/Aluminum ASTM D1002, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to each test substrate.Sintech 5/GL peel rate was 2"/minute.
12 piw 90° Peel Strength 0.03 min 135°C CRS/Aluminum ASTM D1002, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to each test substrate.Sintech 5/GL peel rate was 2"/minute.
12 piw 90° Peel Strength 0.03 min 146°C CRS/Aluminum ASTM D1002, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to each test substrate.Sintech 5/GL peel rate was 2"/minute.
11 piw 90° Peel Strength 0.03 min 157°C CRS/Aluminum ASTM D1002, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to each test substrate.Sintech 5/GL peel rate was 2"/minute.
10 piw 90° Peel Strength 0.03 min 168°C CRS/Aluminum ASTM D1002, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to each test substrate.Sintech 5/GL peel rate was 2"/minute.
6 piw 90° Peel Strength 0.03 min 179°C CRS/Aluminum ASTM D1002, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to each test substrate.Sintech 5/GL peel rate was 2"/minute.
6 piw 90° Peel Strength 0.33 min 24°C CRS/Aluminum ASTM D1002, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to each test substrate.Sintech 5/GL peel rate was 2"/minute.
6 piw 90° Peel Strength 0.33 min 35°C CRS/Aluminum ASTM D1002, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to each test substrate.Sintech 5/GL peel rate was 2"/minute.
6 piw 90° Peel Strength 0.33 min 46°C CRS/Aluminum ASTM D1002, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to each test substrate.Sintech 5/GL peel rate was 2"/minute.
7 piw 90° Peel Strength 0.33 min 57°C CRS/Aluminum ASTM D1002, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to each test substrate.Sintech 5/GL peel rate was 2"/minute.
9 piw 90° Peel Strength 0.33 min 68°C CRS/Aluminum ASTM D1002, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to each test substrate.Sintech 5/GL peel rate was 2"/minute.
10 piw 90° Peel Strength 0.33 min 79°C CRS/Aluminum ASTM D1002, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to each test substrate.Sintech 5/GL peel rate was 2"/minute.
12 piw 90° Peel Strength 0.33 min 90°C CRS/Aluminum ASTM D1002, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to each test substrate.Sintech 5/GL peel rate was 2"/minute.
14 piw 90° Peel Strength 0.33 min 101°C CRS/Aluminum ASTM D1002, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to each test substrate.Sintech 5/GL peel rate was 2"/minute.
13 piw 90° Peel Strength 0.33 min 113°C CRS/Aluminum ASTM D1002, Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to each test substrate.Sintech 5/GL peel rate was 2"/minute.
13 piw 90° Peel Strength 0.33 min 124°C CRS/Aluminum
12 piw 90° Peel Strength 0.33 min 135°C CRS/Aluminum
12 piw 90° Peel Strength 0.33 min 146°C CRS/Aluminum
12 piw 90° Peel Strength 0.33 min 157°C CRS/Aluminum
11 piw 90° Peel Strength 0.33 min 168°C CRS/Aluminum
9 piw 90° Peel Strength 0.33 min 179°C CRS/Aluminum
10 piw 90° Peel Strength 0.25 min 157°C Aluminum (solvent wiped)
10 piw 90° Peel Strength 0.25 min 157°C Aluminum (etched)
10 piw 90° Peel Strength 0.25 min 157°C Aluminum (sanded, solvent wiped)
10 piw 90° Peel Strength 0.25 min 157°C Aluminum (scour pad abraded, solvent wiped)
11 piw 90° Peel Strength 0.25 min 157°C FR-4 (printed circuit board substrate)
9 piw 90° Peel Strength 0.25 min 157°C Phenolic Board
11 piw 90° Peel Strength 0.25 min 157°C Cold Rolled Steel
10 piw 90° Peel Strength 0.25 min 157°C Stainless Steel
10 piw 90° Peel Strength 0.25 min 157°C ABS (acrylonitrile-butadiene-styrene)
10 piw 90° Peel Strength 0.25 min 157°C Ultem® 1000 (polyetherimide)
9 piw 90° Peel Strength 0.25 min 157°C Soda Lime Glass
10 piw 90° Peel Strength 0.25 min 157°C PVC (polyvinyl chloride)
10 piw 90° Peel Strength 0.25 min 157°C Acrylic
<1 piw 90° Peel Strength 0.25 min 157°C Polypropylene
<1 piw 90° Peel Strength 0.25 min 157°C HDPE (high density polyethylene)
9 piw 90° Peel Strength 0.25 min 149°C HIPS (high intensity polystyrene)
<1 piw 90° Peel Strength 0.25 min 149°C EPDM (ethylene-propylene-diene monomer rubber)
6 piw 90° Peel Strength 0.25 min 149°C Neoprene (Shore A60)
7 piw 90° Peel Strength 0.25 min 177°C Nitrile (Shore A60)
16 piw 90° Peel Strength 0.25 min 177°C SBR (styrene butadiene resin)
5 piw 90° Peel Strength 0.25 min 177°C Kapton 200E® (polyimide film)
3 piw 90° Peel Strength 0.25 min 149°C PET (polyester film)
2 piw 90° Peel Strength 0.25 min 149°C PEN (polyethylene naphthalate film)
8 piw 90° Peel Strength 0.25 min 149°C Denim Fabric
2 (psi) 90° Peel Strength 0.08 min 177°C -55°C
11 (psi) 90° Peel Strength 0.08 min 177°C 24°C
4 (psi) 90° Peel Strength 0.08 min 177°C 121°C
1 (psi) 90° Peel Strength 13 min -55°C
9 (psi) 90° Peel Strength 0.22 min 24°C
5 (psi) 90° Peel Strength 0.22 min 121°C
2 (psi) 90° Peel Strength 0.08 min -55°C
11 (psi) 90° Peel Strength 0.08 min 24°C
2 (psi) 90° Peel Strength 0.08 min 121°C
2 (psi) 90° Peel Strength 13 min -55°C
10 (psi) 90° Peel Strength 13 min 24°C
6 (psi) 90° Peel Strength 13 min 121°C
General Bond Strength Test Methods
General Bond Strength Test Temperature Test Method
High
2 (lb.) 71°C 2 lb. dead load overlap shear conducted in oven environment (reference ASTM D4502-85).
2 (lb) >65°C 2 lb. dead load overlap shear conducted in oven environment (reference ASTM D4502-85).
Dielectric Constant Test Methods
Dielectric Constant Test Method
3.10 ASTM D-150, 1 KHz, Before X-Link
5.70 ASTM D-150, 1 KHz, After X-Link
Dielectric Strength Test Methods
Dielectric Strength Test Method
3,000 V/mil ASTM D-149, Dielectric Breakdown Strength, Before X-Link, (on 1.5 mil)
990 V/mil ASTM D-149, Dielectric Breakdown Strength, After X-Link, (on 8 mil)
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.06400 ASTM D-150, 1 KHz, Before X-Link
0.03700 ASTM D-150, 1 KHz, After X-Link
Surface Resistivity Test Methods
Surface Resistivity Test Method
3.14e10 (ohms/sq.) ASTM D-257, Before X-Link
3.43e10 (ohms/sq.) ASTM D-257, After X-Link
Volume Resistivity Test Methods
Volume Resistivity Test Method
1.44e12 (ohms-cm.) ASTM D-257, Before X-Link
2.13e13 (ohms-cm.) ASTM D-257, After X-Link
Elongation Test Methods
Elongation Test Method
800 % Before Crosslinking
180 % After Crosslinking
Modulus Test Methods
Modulus Test Method
240 psi Before Crosslinking
13,800 psi After Crosslinking
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Test Method
280e-6 (Below Tg CTE/°C) Coefficient of Thermal Expansion by TMA (Thermomechanical analysis), Perkin-Elmer Series 7, -40°C to 125°C @ 10°C/min. (2 heat cycles, 2nd cycle reported)
740e-6 (Above Tg CTE/°C ) Coefficient of Thermal Expansion by TMA (Thermomechanical analysis), Perkin-Elmer Series 7, -40°C to 125°C @ 10°C/min. (2 heat cycles, 2nd cycle reported)
380e-6 (Above Tg CTE/°C) Coefficient of Thermal Expansion by TMA (Thermomechanical analysis), Perkin-Elmer Series 7, -40°C to 125°C @ 10°C/min. (2 heat cycles, 2nd cycle reported)