Application Type Bond 1 Part or 2 Part 1-Part Material Form Tape Substrate Ceramic Industry Other cooling devices (e.g., fans, heat spreaders or heat pipes), Powertrain, Heat sinks, power transformer bonding to heat sinks, CPU, Human Machine Interface, flex circuit Manufacturer 3M Chemistry Filled Acrylic Polymer, Halogen free Cure Method Pressure Sensitive Color White Other Resistance Torque Resistance Volume Resistivity (O) 3.9e11 (Ohm-cm) Key Specifications UL recognized
Technical Data for 3M 8810
- Adhesive - Bond
1 Part or 2 Part
- Other - Rigid to rigid, Flexible to rigid, Flexible to flexible, Improved surface wet-out for rough surface/LSE substrates
- Storage & Graphics - CPU
- Human Machine Interface
- Electronics - flex circuit, Other cooling devices (e.g., fans, heat spreaders or heat pipes)
- Heat sink - Heat sinks
- Transformers - power transformer bonding to heat sinks
- Industrial - good thermal transfer
- Other - Preferential heat-transfer path between heat-generating components, Ideal for thin bonding applications, Rigid to rigid bonding, Flexible to rigid, Flexible to flexible bonding
- Halogen-free - Halogen free
- Acrylic - Filled Acrylic Polymer
- Roll - Rubber nip rollers, heated steel rollers
- Other - squeegee, finger pressure to help
- Pressure Sensitive (min) - Pressure Sensitive
- UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association) - UL recognized
Peel Strength (piw) 46 (oz/in), 72 (oz/in), 75 (oz/in), 88 (oz/in) Test Method Shear Strength (psi) 1000 (g), 500 (g) Test Method
Other Resistance Torque Resistance Vibration Resistance/Shock Resistance Excellent shock performance
Filler Ceramic Dielectric Strength (V/mil) Good, 688 Test Method Dielectric Constant 3.20 Test Method Thermal Conductivity (W/m°K) Good, 0.60 Test Method Surface Resistivity (O) 1.6e11 (ohms-cm) Test Method Volume Resistivity (O) 3.9e11 (Ohm-cm) Test Method
Specific Gravity 1.07 (g/cc)
Shelf Life Details The shelf life of 3M™ Thermally Conductive Adhesive Transfer Tapes 8805, 8810, 8815 and 8820 is 24 months from the date of manufacture when stored in the original packaging materials and stored at 22°C (72°F) and 50% relative humidity. Shelf Life Temperature (°F) 72 Shelf Life Type From date of manufacture Shelf Life (mon) 24
Best Practices for 3M 8810
Substrate surfaces should be clean and dry prior to tape application. Isopropyl alcohol (isopropanol) applied with a lint-free wipe or swab should be adequate for removing surface contamination such as dust or finger prints. Do not use “denatured alcohol” or glass cleaners which often contain oily components. Allow the surface to dry for several minutes before applying the tape. More aggressive solvents (such as acetone, methyl ethyl ketone (MEK) or toluene) may be required to remove heavier contamination (grease, machine oils, solder flux, etc.) but should be followed by a final isopropanol wipe as described above.
Note: Be sure to read and follow the manufacturers’ precautions and directions when using primers and solvents.
Apply the tape to one substrate at a modest angle with the use of a squeegee, rubber roller or finger pressure to help reduce the potential for air entrapment under the tape during its application. The liner can be removed after positioning the tape onto the first substrate.
Assemble the part by applying compression to the substrates to ensure a good wetting of the substrate surfaces with the tape. Proper application of pressure (amount of pressure, time applied, temperature applied) will depend upon design of the parts. Rigid substrates are more difficult to bond without air entrapment as most rigid parts are not flat. Use of a thicker tape may result in increased wetting of rigid substrates. Flexible substrates can be bonded to rigid or flexible parts with much less concern about air entrapment because one of the flexible substrates can conform to the other substrate.
These tapes are tacky pressure sensitive adhesives loaded with thermally conductive ceramic fillers that do not require a heat cure cycle to form an excellent bond to many substrates. Only pressure is needed to form an excellent bond and thermal interface.
Rework requires separation of the two substrates. Separation can be accomplished by any practical means: prying, torquing or peeling. The tape will be destroyed upon separation and must be replaced. The surfaces should be recleaned according to the recommendations in this data page.
Heating up the substrates can reduce the adhesion level and make removal easier.
Part separation can be aided by immersion in warm water. This should eventually reduce the adhesion and make prying, torquing or peeling apart the substrates easier.
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Peel Strength Test Methods
|Peel Strength||Type||Substrate||Test Time||Test Temperature||Test Method|
|46 (oz/in)||90° Peel Strength||Untreated aluminum||15 min||25°C||Dwell, 3M TM 1 mil PET Backing|
|72 (oz/in)||90° Peel Strength||Untreated aluminum||15 min||65°C||Dwell, 3M TM 1 mil PET Backing|
|75 (oz/in)||90° Peel Strength||Untreated aluminum||4,320 min||25°C||Dwell, 3M TM 1 mil PET Backing|
|88 (oz/in)||90° Peel Strength||Untreated aluminum||4,320 min||65°C||Dwell, 3M TM 1 mil PET Backing|
Shear Strength Test Methods
|Shear Strength||Type||Test Temperature||Test Method|
|1000 (g)||Static shear strength||25°C||3M TM: SS & PET Hold weight 1 week, holding 1000g @ Room Temp using 1 in2|
|500 (g)||Static shear strength||72°C||3M TM: SS & PET Hold weight 1 week, holding 500g @ Room Temp using 1 in2|
Dielectric Constant Test Methods
|Dielectric Constant||Test Method|
|3.20||ASTM D-150, 100 MHz|
Dielectric Strength Test Methods
|Dielectric Strength||Test Method|
|688 V/mil||ASTM D-149|
Surface Resistivity Test Methods
|Surface Resistivity||Test Method|
|1.6e11 (ohms-cm)||ASTM D-2577|
Thermal Conductivity Test Methods
|Thermal Conductivity||Test Method|
|0.60 W/m°K||ASTM C-177|
Volume Resistivity Test Methods
|Volume Resistivity||Test Method|
|3.9e11 (Ohm-cm)||ASTM D-2577|