Application Type Bond, Seal 1 Part or 2 Part 1 Part Material Form Filament Tape Substrate Steel Manufacturer 3M Chemistry Synthetic rubber resin Cure Method Pressure Sensitive Color Clear
Technical Data for 3M 8988
1 Part or 2 Part
- 1 Part or 2 Part - 1 Part
- Tape - Filament Tape
- Other - When printed, the tape provides advertising, warning, and labeling capability to be seen through the tape., Good clarity of artwork and important messages even when covered by the tape., Sealing corrugated cartons , Good holding under wide range ofapplication conditions with minimumamount of tape, Tough film backing protects
- Synthetic Rubber - Synthetic rubber resin
- Dispenser - hand held manual dispensers, an automatic L-Clip applicator, Ease of dispensing and tape
- Pressure Sensitive (min) - Pressure Sensitive
- Clear / Transparent - Clear
Application Temperature (°F) 68 to 77 Fixture or Handling Strength Time (min) Good
General Bond Strength (psi) 75 (oz./in.), Exceptional initial adhesion, Good holding with minimum amount of tape, Holds instantly with minimum rubdown Test Method Shear Strength (psi) High Tensile Strength (psi) Very High, 380 (lbs./in.) Test Method
Abrasion Resistance Excellent Moisture/Humidity Resistance Excellent
Elongation (%) 3 Test Method
Shelf Life Details Storage Conditions: Store behind present stock. Store in a clean, dry place. Temperature of 40-80°F (4-26°C) and 40 to 50% relative humidity are recomme nded. Rotate your stock.;Shelf Life: To obtain best performance, use this product within 18 months from date of manufacture. Shelf Life Temperature (°F) 40 to 80 Shelf Life Type From date of manufacture Shelf Life (mon) 18
Best Practices for 3M 8988
Substrate surfaces should be clean and dry prior to tape application. Isopropyl alcohol (isopropanol) applied with a lint-free wipe or swab should be adequate for removing surface contamination such as dust or finger prints. Do not use “denatured alcohol” or glass cleaners which often contain oily components. Allow the surface to dry for several minutes before applying the tape. More aggressive solvents (such as acetone, methyl ethyl ketone (MEK) or toluene) may be required to remove heavier contamination (grease, machine oils, solder flux, etc.) but should be followed by a final isopropanol wipe as described above.
Note: Be sure to read and follow the manufacturers’ precautions and directions when using primers and solvents.
Apply the tape to one substrate at a modest angle with the use of a squeegee, rubber roller or finger pressure to help reduce the potential for air entrapment under the tape during its application. The liner can be removed after positioning the tape onto the first substrate.
Assemble the part by applying compression to the substrates to ensure a good wetting of the substrate surfaces with the tape. Proper application of pressure (amount of pressure, time applied, temperature applied) will depend upon design of the parts. Rigid substrates are more difficult to bond without air entrapment as most rigid parts are not flat. Use of a thicker tape may result in increased wetting of rigid substrates. Flexible substrates can be bonded to rigid or flexible parts with much less concern about air entrapment because one of the flexible substrates can conform to the other substrate.
Comparable Materials for 3M 8988
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Tensile Strength Test Methods
|Tensile Strength||Test Method|
|380 (lbs./in.)||ASTM D-3759, width (6655 N/100 mm width)|
General Bond Strength Test Methods
|General Bond Strength||Substrate||Test Method|
|75 (oz./in.)||Steel||ASTM D-3330, width (82 N/100 mm width)|
|Exceptional initial adhesion|
|Good holding with minimum amount of tape|
|Holds instantly with minimum rubdown|
Elongation Test Methods
|3 %||ASTM D-3759 (at Break)|