• Description for 3M 921XL

    Tape has a liner that extends beyond the width of the adhesive to provide easy liner starting and removal.

    *See Terms of Use Below

    Chemical Resistance Chemical Resistance: Low
    Application Type Bond, Mounting, joining
    1 Part or 2 Part 1-Part
    Material Form Extended Liner Tapes
    Substrate Steel
    Manufacturer 3M
    Chemistry Acrylic
    Cure Method Pressure Sensitive
    Application Temperature (°F) 70 to 100
    Color Clear
    High Temperature Resistance (°C) 65, 93
  • Technical Data for 3M 921XL

    Overview
    • Chemical Resistance
      • Chemical Resistance : Relative Solvent Resistance - Low
    • Application Type
    • 1 Part or 2 Part
      • 1-Part
    • Material Form
      • Tape - Extended Liner Tapes
    • Substrate
    • Industry
      • Industrial
      • Other - ideal for mounting and joining materials where repositionability may be desired.
    • Chemistry
    • Cure Method
      • Pressure Sensitive (min) - Pressure Sensitive
    • Color
      • Clear / Transparent - Clear
    Specifications
    Cure Specs
    Application Temperature (°F) 70 to 100
    Bond Strength
    General Bond Strength (psi) 20 (oz./in.) Test Method
    Material Resistance
    UV Resistance Excellent
    High Temperature Resistance (°C) 65, 93
    Business Information
    Shelf Life Details 18 (months) from date of manufacture when stored in original cartons at 70°F (21°C) and 50% relative humidity.
    Shelf Life Temperature (°F) 70
    Shelf Life Type From date of manufacture
    Shelf Life (mon) 18
  • Best Practices for 3M 921XL

    *See Terms of Use Below

    1. Surface Preparation

      To obtain optimum adhesion, the bonding surfaces must be clean, dry, and well unified. Some typical surface cleaning solvents are isopropyl alcohol and heptane.

      Note: Be sure to follow manufacturer’s safety precautions and directions for use when using solvents.

    2. Application

      Bond strength is dependent upon the amount of adhesive-to-surface contact developed. Firm application pressure helps develop better adhesive contact and improve bond strength.

      Initial tape application to surfaces at temperatures below 50°F (10°C) is not recommended because the adhesive becomes too firm to adhere readily. However, once properly applied, low temperature holding is generally satisfactory.

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General Bond Strength Test Methods
General Bond Strength Substrate Test Method
20 (oz./in.) Steel ASTM D3330