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| Application Type | Bond |
|---|---|
| 1 Part or 2 Part | 1 Part |
| Material Form | Tape |
| Substrate | Ceramic, Glass, Metal, Engineered plastics |
| Industry | wire mesh, Non-conductive plastic to metal bonds in electronics |
| Manufacturer | 3M |
| Chemistry | Acrylic, Epoxy hybrid |
| Cure Method | Pressure Sensitive |
| Relative Solvent Resistance | Chemical Resistance: High solvent resistance |
| High Temperature Resistance (°C) | 204, 149 |
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