• Description for 3M 926

    Thick high performance adhesive transfer tape.

    *See Terms of Use Below

    Chemical Resistance Chemical Resistance: Very Good
    Application Type Bond
    1 Part or 2 Part 1-Part
    Material Form Transfer tape
    Substrate Steel
    Manufacturer 3M
    Chemistry Acrylic
    Cure Method Pressure Sensitive
    Application Temperature (°F) 70 to 100
    Color Clear
    High Temperature Resistance (°C) 149, 232, High temperature resistance
  • Technical Data for 3M 926

    • Chemical Resistance
      • Chemical Resistance : Relative Solvent Resistance - Very Good
    • Application Type
    • 1 Part or 2 Part
      • 1-Part
    • Material Form
      • Tape - Transfer tape
    • Substrate
      • Steel
      • Other - A variety of surfaces
    • Industry
      • Other - Nameplates on award plaques, Foam insulation, folders and boxes that have a highter degree of memory
    • Chemistry
    • Application Method
      • Contact
    • Cure Method
      • Pressure Sensitive (min) - Pressure Sensitive
    • Color
      • Clear / Transparent - Clear
    Cure Specs
    Application Temperature (°F) 70 to 100
    Bond Strength
    General Bond Strength (psi) High, 150 (oz./in.) Test Method
    Shear Strength (psi) Excellent
    Material Resistance
    UV Resistance Excellent, Excellent UV resistance, Good
    High Temperature Resistance (°C) 149, 232, High temperature resistance Test Method
    Business Information
    Shelf Life Details Shelf Life of Tape in Roll Form: 24 months from the manufacturing date when stored in original cartons at 70°F (21°C) and 50% relative humidity.
    Shelf Life Temperature (°F) 70
    Shelf Life Type From date of manufacture
    Shelf Life (mon) 24
  • Best Practices for 3M 926

    *See Terms of Use Below

    1. Surface Preparation

      To obtain optimum adhesion, the bonding surfaces must be clean, dry and well unified. Typical surface cleaning solvents are isopropyl alcohol and water (rubbing alcohol) or heptane. Note

      Be sure to follow the manufacturer's precautions and directions for use when using solvents.

    2. Application

      Bond strength is dependent upon the amount of adhesive-to-surface contact developed. Firm application pressure helps develop better adhesive contact and improve bond strength.

      Initial tape application to surfaces at temperatures below 50°F (10°C) is not recommended because the adhesive becomes too firm to adhere readily. However, once properly applied, low temperature holding is generally satisfactory.

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General Bond Strength Test Methods
General Bond Strength Substrate Test Method
150 (oz./in.) Steel ASTM D3330, 163 N/100 mm
High Temperature Resistance Test Methods
High Temperature Resistance Test Method
149°C Long Term
232°C Short Term
High temperature resistance