| Application Type | Bond |
|---|---|
| 1 Part or 2 Part | 2 Part |
| Material Form | Double coated Tape |
| Substrate | Paper, Steel |
| Manufacturer | 3M |
| Chemistry | Non-siliconized |
| Cure Method | Pressure Sensitive |
| Color | Translucent |
| High Temperature Resistance (°C) | 70 |
To obtain optimum adhesion, the bonding surfaces must be clean, dry and well unified. Some typical surface cleaning solvents are ispropyl alcohol or heptane.
Note: Carefully read and follow the manufacturer's precautions and directions for use when using solvents.
Bond strength is dependent upon the amount of adhesive-to-surface contact developed. Firm application pressure helps develop better adhesive contact and improve bond strength.
Initial tape application to surfaces at temperatures below 50°F (10°C) is not recommended because the adhesive becomes too firm to adhere readily. However, once properly applied, low temperature holding is generally satisfactory. An exception is 3M™ Repositionable Tapes 9425 and 9425HT which can be applied at temperature as low as 32°F (0°C).
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