| Application Type | Bond |
|---|---|
| 1 Part or 2 Part | 1 Part |
| Material Form | Transfer Tape |
| Substrate | Fabric, Glass, Metals, Paper, Many plastics, Polyester, Steel, Wood, Wide variety of similar and dissimilar materials, HSE (high surface energy) plastics, Cardboard |
| Industry | Foils, Industrial: Splicing of foils, Industrial: Splicing of films, Industrial: Splicing of fabrics |
| Manufacturer | 3M |
| Chemistry | Acrylic |
| Cure Method | Pressure Sensitive |
| Color | Clear |
| Chemical Resistance | Water Resistance, Chemical Resistance |
| Relative Solvent Resistance | Chemical Resistance: Good |
| High Temperature Resistance (°C) | 121, 82 |
| Key Specifications | Mil-Spec (United States Military Standard): P-19834B: U.S. Government specification MIL-P-19834B, Type I |
To obtain optimum adhesion, the bonding surfaces must be clean, dry, and well unified. Some typical surface cleaning solvents are isopropyl alcohol or heptane.
Be sure to follow manufacturer’s safety precautions and directions for use when using solvents.
Bond strength is dependent upon the amount of adhesive-to-surface contact developed. Firm application pressure helps develop better adhesive contact and improve bond strength.
Initial tape application to surfaces at temperatures below 50°F (10°C) is not recommended because the adhesive becomes too firm to adhere readily. However, once properly applied, low temperature holding is generally satisfactory.
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