• Description for 3M 9458

    It offer excellent adhesion to a wide variety of surfaces, including low surface energy plastics and foam. It is available in several thickness for a wide variety of surface bonding and provides a variety of liner configurations to help ensure excellent process flexibility.

    *See Terms of Use Below

    Application Type Bond, Laminate, Gasket application
    1 Part or 2 Part 1 Part
    Material Form Tape
    Substrate Aluminum, Metal, Low surface energy plastics, Polycarbonate, Polypropylene, Stainless Steel, Foam, Low surface energy foam, High Surface Energy plastics, Low surface energy foam, Low surface energy plastics, ABS
    Industry Electronic, Graphic nameplates, Automotive, Aerospace
    Manufacturer 3M
    Chemistry Acrylic
    Cure Method Pressure Sensitive
    Chemical Resistance Oil Resistance, Mild acids Resistance, Alkalis Resistance, Water resistance, Chemical Resistance
    High Temperature Resistance (°C) <121, <66, Heat Resistance, Temperature Cycling Resistance
    Low Temperature Resistance (°C) -40
    Key Specifications UL 969, Mil-Spec (United States Military Standard): P-19834B: Meets Mil-P 19834B Type 1
  • Technical Data for 3M 9458

    Overview
    • Application Type
      • Laminate
      • Gasketing - Gasket application
      • Adhesive - Bond
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 1 Part
    • Material Form
      • Tape
    • Substrate
    • Industry
    • Chemistry
    • Application Method
      • Contact
    • Cure Method
      • Pressure Sensitive (min) - Pressure Sensitive
    • Key Specifications
      • UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association) - UL 969
      • Mil-Spec (United States Military Standard): P-19834B: Type 1 - Meets Mil-P 19834B Type 1
    Specifications
    Cure Specs
    Application Temperature (°F) 70 to 100
    Bond Strength
    General Bond Strength (psi) Excellent
    Peel Strength (piw) 42 (Oz./In.), 30 (Oz./In.), 31 (Oz./In.), 50 (Oz./In.), 30 (Oz./In.), 41 (Oz./In.) Test Method
    Material Resistance
    Chemical Resistance Oil Resistance, Mild acids Resistance, Alkalis Resistance, Water resistance, Chemical Resistance
    UV Resistance UV resistance
    High Temperature Resistance (°C) <121, <66, Heat Resistance, Temperature Cycling Resistance Test Method
    Low Temperature Resistance (°C) -40
    Moisture/Humidity Resistance Humidity Resistance
    Conductivity
    Dissipation Factor
    Dielectric Strength (V/mil) 340 Test Method
    Dielectric Constant 3.21 Test Method
    Hardness
    Flexibility Excellent
    Other Properties
    Coefficient of Thermal Expansion (CTE) 20e-5 (m/m/°C), 58e-5 (m/m/°C) Test Method
    Business Information
    Shelf Life Details It is suggested that products are stored at room temperature conditions of 70°F (21°C) and 50% relative humidity.;If stored properly, product retains its performance and properties for 18 months from date of shipment., It is suggested that products are stored at room temperature conditions of 70°F (21°C) and 50% relative humidity.; If stored properly, product retains its performance and properties for 24 months from date of manufacture.
    Shelf Life Temperature (°F) 70, 70
    Shelf Life Type From date of shipment, from date of manufacture
    Shelf Life (mon) 18, 24
  • Best Practices for 3M 9458

    *See Terms of Use Below

    1. Surface Preparation

      For maximum bond strength (during installation of the final part) the surface should be thoroughly cleaned and dried. Typical cleaning solvents are heptane (for oily surfaces) or isopropyl alcohol for plastics.

    2. Application

      It is necessary to provide pressure during lamination (1.5-20 PLI recommended) and during final part installation (10-15 PLI) to allow to adhesive the come into direct contact with the substrate. Using a hard edged plastic tool, which is the full width of the laminated part, helps to provide the necessary pressure at the point of lamination. Heat can increase bond strength when bonding to metal parts (generally this same increase is observed at room temperature over longer times, weeks). For plastic parts, the bond strength is not enhanced with the addition of heat.

      Application is not recommended if the surface temperature is below 50°F (10°C) because the adhesive becomes too firm to adhere readily. Once properly applied, at the recommended application temperature, low temperature holding is generally satisfactory

      When bonding a thin, smooth, flexible material to a smooth surface, it is generally acceptable to use 2 mils of adhesive. If a texture is visible on one or both surfaces, the 5 mil adhesive would be suggested. If both materials are rigid, it may be necessary to use a thicker adhesive to successfully bond the components. 3M™VHB™Acrylic Foam Tapes may be required

      To apply adhesives in a wide web format, lamination equipment is required to ensure acceptable quality.

    3. Curing

      Heat can increase bond strength when bonding to metal parts (generally this same increase is observed at room temperature over longer times, weeks). For plastic parts, the bond strength is not enhanced with the addition of heat

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    *See Terms of Use Below

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Peel Strength Test Methods
Peel Strength Type Substrate Test Time Test Temperature Test Method
42 (Oz./In.) 90° Peel Strength Stainless Steel 15 min RT ASTM D-3330 (Modified), 2 mil Aluminum Foil Backer
30 (Oz./In.) 90° Peel Strength ABS 15 min 25°C RT ASTM D-3330 (Modified), 2 mil Aluminum Foil Backer
31 (Oz./In.) 90° Peel Strength Polypropylene 15 min 25°C RT ASTM D-3330 (Modified), 2 mil Aluminum Foil Backer
50 (Oz./In.) 90° Peel Strength Stainless Steel 4,320 min 25°C RT ASTM D-3330 (Modified), 2 mil Aluminum Foil Backer
30 (Oz./In.) 90° Peel Strength ABS 4,320 min 25°C RT ASTM D-3330 (Modified), 2 mil Aluminum Foil Backer
41 (Oz./In.) 90° Peel Strength Polypropylene 4,320 min 25°C RT ASTM D-3330 (Modified), 2 mil Aluminum Foil Backer
High Temperature Resistance Test Methods
High Temperature Resistance Test Method
<121°C Short periods (minutes, hours)
<66°C Intermittent longer periods (days, weeks)
Heat Resistance
Temperature Cycling Resistance
Dielectric Constant Test Methods
Dielectric Constant Test Method
3.21 (at 1 KHz) ASTM D150-92
Dielectric Strength Test Methods
Dielectric Strength Test Method
340 V/mil (500 vac, rms [60 hz/sec]) ASTM D149-92
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Test Method
20e-5 (m/m/°C) ASTM D696, First heat
58e-5 (m/m/°C) ASTM D696, Second heat