| Application Type | Bond |
|---|---|
| 1 Part or 2 Part | 1 Part |
| Material Form | Transfer Tape |
| Substrate | Aluminum, Metal, low surface energy plastics, High surface energy plastic (polycarbonate), Low surface energy plastic (polypropylene), Stainless Steel, High Surface Energy plastics |
| Industry | Transportation: Automotive |
| Manufacturer | 3M |
| Chemistry | Acrylic |
| Cure Method | Pressure Sensitive |
| Color | Tan |
| Chemical Resistance | oil, mild acids, alkalis |
| High Temperature Resistance (°C) | Heat Resistance, <121, <66 |
| Low Temperature Resistance (°C) | -40 |
| Other Resistance | Water resistance, Temperature Cycling Resistance |
| Key Specifications | International Organization for Standardization, UL 969, Mil-Spec (United States Military Standard): P-19834B: Meets Mil-P 19834B Type 1. |
For maximum bond strength (during installation of the final part) the surface should be thoroughly cleaned and dried. Typical cleaning solvents are heptane (for oily surfaces) or isopropyl alcohol for plastics. Use reagent grade solvents since common household materials like rubbing alcohol frequently contain oils to minimize the drying affect on skin. These oils can interfere with the performance of a pressure-sensitive adhesive. Consult solvent manufacturers MSDS for proper handling and storage instructions. Also, use disposable wipes that do not contain oils, to remove the cleaning solvents.
It is necessary to provide pressure during lamination (1.5-20 PLI recommended) and during final part installation (10-15 PLI) to allow to adhesive the come into direct contact with the substrate. Using a hard edged plastic tool, which is the full width of the laminated part, helps to provide the necessary pressure at the point of lamination. Heat can increase bond strength when bonding to metal parts (generally this same increase is observed at room temperature over longer times, weeks). For plastic parts, the bond strength is not enhanced with the addition of heat.
Application is not recommended if the surface temperature is below 50°F (10°C) because the adhesive becomes too firm to adhere readily. Once properly applied, at the recommended application temperature, low temperature holding is generally satisfactory
When bonding a thin, smooth, flexible material to a smooth surface, it is generally acceptable to use 2 mils of adhesive. If a texture is visible on one or both surfaces, the 5 mil adhesive would be suggested. If both materials are rigid, it may be necessary to use a thicker adhesive to successfully bond the components. 3M™VHB™Acrylic Foam Tapes may be required
To apply adhesives in a wide web format, lamination equipment is required to ensure acceptable quality.
Heat can increase bond strength when bonding to metal parts (generally this same increase is observed at room temperature over longer times, weeks). For plastic parts, the bond strength is not enhanced with the addition of heat
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| Peel Strength | Type | Substrate | Test Time | Test Temperature | Test Method |
|---|---|---|---|---|---|
| 36 (Oz./In.) | 90° Peel Strength | Aluminum foil to stainless steel | 15 min | ASTM D-3330 (modified) 15 minute dwell, 12"/min. 305 mm/min. | |
| 51 (Oz./In.) | 90° Peel Strength | Aluminum to Metal (Stainless Steel) | 4,320 min | 25°C | ASTM D-3330 (modified),12"/min. 305 mm/min. |
| 51 (Oz./In.) | 90° Peel Strength | Aluminum to High Surface Energy Plastic (Polycarbonate) | 4,320 min | 25°C | ASTM D-3330 (modified),12"/min. 305 mm/min. |
| 36 (Oz./In.) | 90° Peel Strength | Aluminum to Low Surface Energy Plastic (Polypropylene) | 4,320 min | 25°C | ASTM D-3330 (modified),12"/min. 305 mm/min. |
| 85 (Oz./In.) | 90° Peel Strength | Aluminum to Metal (Stainless Steel) | 4,320 min | 70°C | ASTM D-3330 (modified),12"/min. 305 mm/min. |
| 75 (Oz./In.) | 90° Peel Strength | Aluminum to High Surface Energy Plastic (Polycarbonate) | 4,320 min | 70°C | ASTM D-3330 (modified),12"/min. 305 mm/min. |
| 32 (Oz./In.) | 90° Peel Strength | Aluminum to Low Surface Energy Plastic (Polypropylene) | 4,320 min | 70°C | ASTM D-3330 (modified),12"/min. 305 mm/min. |
| High Temperature Resistance | Test Method |
|---|---|
| Heat Resistance | Short periods (minutes, hours) |
| <121°C | Short periods (minutes, hours) |
| <66°C | Intermittent longer periods (days, weeks) |
| Dielectric Constant | Test Method |
|---|---|
| 3.21 | ASTM D 150-92, 1KHz |
| Dielectric Strength | Test Method |
|---|---|
| 340 V/mil | (500 vac, rms [60 hz/sec]), ASTM D149-92 |
| Coefficient of Thermal Expansion (CTE) | CTE Test Method |
|---|---|
| 20e-5 (m/m/°C) | ASTM D696, first heat |
| 58e-5 (m/m/°C) | ASTM D696, second heat |
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