3M 9498 Adhesive Transfer Tape-2 mil Datasheet 3M 9498 Adhesive Transfer Tape-2 mil

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  • Description for 3M 9498 Adhesive Transfer Tape-2 mil

    Splicing Tapes offer excellent flying splice and core starting wet grab characteristics. They are typically used in the printing industry and perform well at process speeds in excess of 2000 feet per minute.

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    Application Type Bond
    1 Part or 2 Part 1-Part
    Material Form Tape
    Substrate Steel
    Industry Printing
    Manufacturer 3M
    Chemistry Acrylic
    Cure Method Pressure Sensitive
    Application Temperature (°F) 70 to 100
    Color Clear
    High Temperature Resistance (°C) 121, 82
  • Technical Data for 3M 9498 Adhesive Transfer Tape-2 mil

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1-Part
    • Material Form
      • Tape
    • Substrate
    • Industry
      • Industrial - printing industry
      • Printing and Graphics - Printing
    • Chemistry
    • Application Method
      • Contact
    • Cure Method
      • Pressure Sensitive (min) - Pressure Sensitive
    • Color
      • Clear / Transparent - Clear
    Specifications
    Cure Specs
    Application Temperature (°F) 70 to 100
    Bond Strength
    Peel Strength (piw) 20 (oz./in.) Test Method
    Shear Strength (psi) Good
    Material Resistance
    High Temperature Resistance (°C) 121, 82
    Business Information
    Shelf Life Details Storage: Store in original cartons at 70°F (21°C) and 50% relative humidity., If stored under proper conditions, product retains its performance and properties for two years from date of manufacture.
    Shelf Life Temperature (°F) 70
    Shelf Life Type From date of manufacture.
    Shelf Life (mon) 24
  • Best Practices for 3M 9498 Adhesive Transfer Tape-2 mil

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    1. Surface Preparation

      To obtain optimum adhesion, the bonding surfaces must be clean, dry and well unified. Some typical surfaces cleaning solvents are isopropyl alcohol or heptane.

      Carefully read and follow the manufacturer's precautions and directions for use when using solvents.

    2. Application

      Bond strength is dependent upon the amount of adhesive-to-surface contact developed. Firm application pressure helps develop better adhesive contact and improves bond strength.

      Initial tape application to surfaces at temperatures below 50°F (10°C) is not recommended because the adhesive becomes too firm to adhere readily. However, once properly applied, low temperature holding is generally satisfactory.

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Peel Strength Test Methods
Peel Strength Type Substrate Test Method
20 (oz./in.) 180° Peel Strength Steel ASTM D3330