| Application Type | Bond |
|---|---|
| 1 Part or 2 Part | 1 Part |
| Material Form | Tape |
| Substrate | Polypropylene, Steel, Paper |
| Industry | Industrial: Splicing Tapes |
| Manufacturer | 3M |
| Chemistry | Acrylic |
| Cure Method | Pressure Sensitive, Ovens |
| Color | Black |
| High Temperature Resistance (°C) | 50, 75 |
To obtain optimum adhesion, the bonding surfaces must be clean, dry and well unified. Some typical surface cleaning solvents are isopropyl alcohol or heptane.*
*Note: Carefully read and follow the manufacturer’s precautions and directions for use when using solvents.
Bond strength is dependent upon the amount of adhesive-to-surface contact developed. Firm application pressure helps develop better adhesive contact and improves bond strength.
Ideal tape application temperature range is 70°F to 100°F (21°C to 38°C). Initial tape application to surfaces at temperatures below 50°F (10°C) is not recommended because the adhesive becomes too firm to adhere readily. However, once properly applied, low temperature holding is generally satisfactory.
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| Peel Strength | Type | Substrate | Test Method |
|---|---|---|---|
| 30 (Oz./in.) | 180° Peel strength | Steel | ASTM D3330 |
| High Temperature Resistance | Test Method |
|---|---|
| 50°C | Relative High Temperature Operating Ranges: Long Term (days, weeks) |
| 75°C | Relative High Temperature Operating Ranges: Short Term (minutes, hours) |
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