Chemical Resistance Oil, Chemical Resistance: Mild acids, Chemical Resistance: Fluid Resistance: Water resistance, Chemical Resistance, Alkalis Application Type Bond, Laminate, Lamination to foam for gasket application 1 Part or 2 Part 1-Part Material Form Transfer Tape Substrate Aluminum, Metal, Low surface energy plastics, High surface energy plastic (polycarbonate), Low surface energy plastic (polypropylene), Stainless Steel, Low surface energy foam, Low surface energy plastics, High Surface Energy plastics, Foam, Low surface energy plastic (polypropylene) Industry Electronic markets, Medical, Long term bonding of graphic nameplates, Automotive, Aerospace Manufacturer 3M Chemistry Acrylic Cure Method Pressure Sensitive Color Tan High Temperature Resistance (°C) <121, <66, Heat Resistance Low Temperature Resistance (°C) -40 Other Resistance Temperature Cycling Resistance Key Specifications UL 969, Mil-Spec (United States Military Standard): P-19834B: Meets Mil-P 19834B Type 1.
Technical Data for 3M 9671
- Chemical Resistance : Fluid Resistance : Water Resistance
- Chemical Resistance - Oil, Alkalis
- Chemical Resistance : Acid Resistance - Mild acids
- Gasketing - Lamination to foam for gasket application
- Adhesive - Bond
1 Part or 2 Part
- Tape - Transfer Tape
- Foam - Low surface energy foam
- Low Surface Energy - Low surface energy plastic (polypropylene), Low surface energy plastics
- Plastic - Low surface energy plastics, High Surface Energy plastics
- Polycarbonate - High surface energy plastic (polycarbonate)
- Polypropylene - Low surface energy plastic (polypropylene)
- Stainless Steel
- Other - Wide variety of surfaces
- Pressure Sensitive (min) - Pressure Sensitive
- Brown - Tan
- UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association) - UL 969
- Mil-Spec (United States Military Standard) : P-19834B : Type 1 - Meets Mil-P 19834B Type 1.
Application Temperature (°F) 70 to 100
General Bond Strength (psi) Excellent, Good holding power Peel Strength (piw) 52 (Oz./In.), 31 (Oz./In.), 45 (Oz./In.), 59 (Oz./In.), 34 (Oz./In.), 52 (Oz./In.) Test Method
UV Resistance UV resistance High Temperature Resistance (°C) <121, <66, Heat Resistance Test Method Low Temperature Resistance (°C) -40 Moisture/Humidity Resistance Humidity Resistance Other Resistance Temperature Cycling Resistance
Dissipation Factor 0.04000 Dielectric Strength (V/mil) 340 Test Method Dielectric Constant 3.21 Test Method
Flexibility Excellent flexibility
Coefficient of Thermal Expansion (CTE) 20e-5 (m/m/°C), 58e-5 (m/m/°C) Test Method
Shelf Life Details It is suggested that products are stored at room temperature conditions of 70 F (21 C) and 50% relative humidity.;If stored properly, product retains its performance and properties for 18 months from date of shipment. Shelf Life Temperature (°F) 70 Shelf Life Type From date of shipment Shelf Life (mon) 18
Best Practices for 3M 9671
For maximum bond strength (during installation of the final part) the surface should be thoroughly cleaned and dried. Typical cleaning solvents are heptane (for oily surfaces) or isopropyl alcohol for plastics. Use reagent grade solvents since common household materials like rubbing alcohol frequently contain oils to minimize the drying affect on skin. These oils can interfere with the performance of a pressure-sensitive adhesive.
Consult solvent manufacturers MSDS for proper handling and storage instructions. Also, use disposable wipes that do not contain oils, to remove the cleaning solvents.
It is necessary to provide pressure during lamination (1.5-20 PLI recommended) and during final part installation (10-15 PLI) to allow to adhesive the come into direct contact with the substrate. Using a hard edged plastic tool, which is the full width of the laminated part, helps to provide the necessary pressure at the point of lamination. Heat can increase bond strength when bonding to metal parts (generally this same increase is observed at room temperature over longer times, weeks). For plastic parts, the bond strength is not enhanced with the addition of heat.
Application is not recommended if the surface temperature is below 50°F (10°C) because the adhesive becomes too firm to adhere readily. Once properly applied, at the recommended application temperature, low temperature holding is generally satisfactory.
When bonding a thin, smooth, flexible material to a smooth surface, it is generally acceptable to use 2 mils of adhesive. If a texture is visible on one or both surfaces, the 5 mil adhesive would be suggested. If both materials are rigid, it may be necessary to use a thicker adhesive to successfully bond the components. 3M™VHB™Acrylic Foam Tapes may be required.
To apply adhesives in a wide web format, lamination equipment is required to ensure acceptable quality.
Heat can increase bond strength when bonding to metal parts (generally this same increase is observed at room temperature over longer times, weeks). For plastic parts, the bond strength is not enhanced with the addition of heat
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Peel Strength Test Methods
|Peel Strength||Type||Substrate||Test Time||Test Temperature||Test Method|
|52 (Oz./In.)||90° Peel Strength||Stainless Steel||15 min||ASTM D-3330 (Modified);2 mil Aluminum Foil Backer|
|31 (Oz./In.)||90° Peel Strength||ABS||15 min||25°C||ASTM D-3330 (Modified);2 mil Aluminum Foil Backer|
|45 (Oz./In.)||90° Peel Strength||Polypropylene||15 min||25°C||ASTM D-3330 (Modified);2 mil Aluminum Foil Backer|
|59 (Oz./In.)||90° Peel Strength||Stainless Steel||4,320 min||25°C||ASTM D-3330 (Modified);2 mil Aluminum Foil Backer|
|34 (Oz./In.)||90° Peel Strength||ABS||4,320 min||25°C||ASTM D-3330 (Modified);2 mil Aluminum Foil Backer|
|52 (Oz./In.)||90° Peel Strength||Polypropylene||4,320 min||25°C||ASTM D-3330 (Modified);2 mil Aluminum Foil Backer|
High Temperature Resistance Test Methods
|High Temperature Resistance||Test Method|
|<121°C||Short periods (minutes, hours)|
|<66°C||Intermittent longer periods (days, weeks)|
Dielectric Constant Test Methods
|Dielectric Constant||Test Method|
|3.21||(at 1 KHz) ASTM D150-92|
Dielectric Strength Test Methods
|Dielectric Strength||Test Method|
|340 V/mil||(500 vac, rms [60 hz/sec]) ASTM D149-92|
Coefficient of Thermal Expansion (CTE) Test Methods
|Coefficient of Thermal Expansion (CTE)||CTE Test Method|
|20e-5 (m/m/°C)||ASTM D696, first heat|
|58e-5 (m/m/°C)||ASTM D696, second heat|