• Description for 3M 9703

    Electrically Conductive Adhesive • Pressure sensitive adhesive • electrically<br/>conductive and offers good adhesion to common PCB substrates such as copper, gold, FR-4 epoxy, DuPont™ Kapton™ polyimide and polyester films •

    *See Terms of Use Below

    Application Type Bond, Gaskets, EMI/RFI shield, EMI/RFI shield
    1 Part or 2 Part 1 Part
    Material Form Transfer tape
    Substrate Aluminum, Copper, Stainless Steel, Gold, polyimide, FR-4 epoxy, Metals
    Industry Medium pitch flexible circuits, Polyester flex circuit splicing, Rigid printed circuit boards (PCB), Keyboard manufacturing, LCD screens, PCB substrates, LCD assembly
    Manufacturer 3M
    Chemistry Acrylic
    Cure Method Pressure Sensitive
    High Temperature Resistance (°C) 85
    Low Temperature Resistance (°C) -40
    Other Resistance Contact Resistance, < 0.3 ohms
  • Technical Data

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  • Best Practices

    *See Terms of Use Below

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Peel Strength Test Methods
Peel Strength Type Substrate Test Time Test Temperature Test Method
>35 (oz./in.) Stainless steel 15 min 23°C ASTM D3330, 2 mil Aluminum foil used as backing.
50 (oz./in.) Stainless steel 60 min 23°C ASTM D3330, 2 mil Aluminum foil used as backing.
55 (oz./in.) Stainless steel 1,440 min 23°C ASTM D3330, 2 mil Aluminum foil used as backing.
50 (oz./in.) Stainless steel 15 min 70°C ASTM D3330, 2 mil Aluminum foil used as backing.
60 (oz./in.) Stainless steel 60 min 70°C ASTM D3330, 2 mil Aluminum foil used as backing.
65 (oz./in.) Stainless steel 1,440 min 70°C ASTM D3330, 2 mil Aluminum foil used as backing.
29 (oz./in.) 180 degree Peel strength Stainless steel 60 min 23°C Test Method is based on a modified ASTM D3330, 12 ipm peel rate, 1 in. width, 2 mil PET backing
32 (oz./in.) 180 degree Peel strength Stainless steel 1,440 min 23°C Test Method is based on a modified ASTM D3330, 12 ipm peel rate, 1 in. width, 2 mil PET backing
Other Resistance Test Methods
Other Resistance Test Method
Contact Resistance, < 0.3 ohms 3M Test Method, Gold PI Flex onto Gold PCB, RT Initial R, 6 mm2
Insulation Resistance Test Methods
Insulation Resistance Test Method
3.4e14 (Ohms/square) Based upon ASTM D-257, Estimate based on 3M™ Electrically Conductive Adhesive Transfer Tape 9703 test data.
Outgassing Test Methods
Outgassing Temperature (°C) Test Method
0.7% 125°C NASA SP-R-0022 or ASTM E595, 125°C, 24 hrs, 2 x 10-6 Torr vacuum Total Mass Loss (TML)
0.01% NASA SP-R-0022 or ASTM E595, Collected Volatile Condensable Materials (CVCM)