| Application Type | Bond |
|---|---|
| 1 Part or 2 Part | 1 Part |
| Material Form | Transfer tape |
| Substrate | Aluminum, Copper, Metals, polyimide, Stainless Steel, Gold |
| Industry | Electronics: Rigid printed circuit boards (PCB), Industrial: Polyester flex circuit splicing, Electronics: Keyboard manufacturing, Electronics: PCB substrates |
| Manufacturer | 3M |
| Chemistry | Acrylic |
| Cure Method | Pressure Sensitive |
| High Temperature Resistance (°C) | 85 |
| Low Temperature Resistance (°C) | -40 |
| Other Resistance | Contact Resistance, < 0.3 ohms |
To obtain maximum adhesion, the bonding surfaces must be clean and dry.
To obtain maximum adhesion, the bonding surfaces must be clean and dry.
Pressure must be applied to the bond line after assembly to wet the substrates with 3M™ Electrically Conductive Adhesive Transfer Tape 9703 and to engage the conductive particles with the substrates to make electrical connection. Mechanical pressure (roller, metal bar) or finger pressure at 15 psi (0.10 Mpa) or greater is suggested. Heat may be applied simultaneously to improve wetting and final bond strength.
Tape 9703 should be applied between 60°F - 158°F (15°C - 70°C). Tape application below 50°F (10°C) is not recommended because the adhesive will be too firm to wet the surface of the substrate, resulting in low adhesion.
Adhesion builds with time, up to 24 hours may be required to reach final adhesion values.
Mechanically separate the parts using torque for rigid parts and peel for flexible ones. Remove the adhesive by rubbing it off with a Scotch-Brite® Hand Pad, clean up the site and apply new adhesive. The force needed to separate the parts and/or remove the adhesive can be reduced by softening the adhesive by heating 158°F - 212°F (70°C - 100°C) or using solvents.
Note: When using solvents, be sure to follow the manufacturer’s precautions and directions for use when handling such materials.
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| Peel Strength | Type | Substrate | Test Time | Test Temperature | Test Method |
|---|---|---|---|---|---|
| >35 (oz./in.) | Stainless steel | 15 min | 23°C | ASTM D3330, 2 mil Aluminum foil used as backing. | |
| 50 (oz./in.) | Stainless steel | 60 min | 23°C | ASTM D3330, 2 mil Aluminum foil used as backing. | |
| 55 (oz./in.) | Stainless steel | 1,440 min | 23°C | ASTM D3330, 2 mil Aluminum foil used as backing. | |
| 50 (oz./in.) | Stainless steel | 15 min | 70°C | ASTM D3330, 2 mil Aluminum foil used as backing. | |
| 60 (oz./in.) | Stainless steel | 60 min | 70°C | ASTM D3330, 2 mil Aluminum foil used as backing. | |
| 65 (oz./in.) | Stainless steel | 1,440 min | 70°C | ASTM D3330, 2 mil Aluminum foil used as backing. | |
| 29 (oz./in.) | 180 degree Peel strength | Stainless steel | 60 min | 23°C | Test Method is based on a modified ASTM D3330, 12 ipm peel rate, 1 in. width, 2 mil PET backing |
| 32 (oz./in.) | 180 degree Peel strength | Stainless steel | 1,440 min | 23°C | Test Method is based on a modified ASTM D3330, 12 ipm peel rate, 1 in. width, 2 mil PET backing |
| Other Resistance | Test Method |
|---|---|
| Contact Resistance, < 0.3 ohms | 3M Test Method, Gold PI Flex onto Gold PCB, RT Initial R, 6 mm2 |
| Insulation Resistance | Test Method |
|---|---|
| 3.4e14 (Ohms/square) | Based upon ASTM D-257, Estimate based on 3M™ Electrically Conductive Adhesive Transfer Tape 9703 test data. |
| Outgassing | Temperature (°C) | Test Method |
|---|---|---|
| 0.7% | 125°C | NASA SP-R-0022 or ASTM E595, 125°C, 24 hrs, 2 x 10-6 Torr vacuum Total Mass Loss (TML) |
| 0.01% | NASA SP-R-0022 or ASTM E595, Collected Volatile Condensable Materials (CVCM) |
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