3M 9703

Surface Preparation

To obtain maximum adhesion, the bonding surfaces must be clean and dry.

Application

To obtain maximum adhesion, the bonding surfaces must be clean and dry.

Pressure must be applied to the bond line after assembly to wet the substrates with 3M™ Electrically Conductive Adhesive Transfer Tape 9703 and to engage the conductive particles with the substrates to make electrical connection. Mechanical pressure (roller, metal bar) or finger pressure at 15 psi (0.10 Mpa) or greater is suggested. Heat may be applied simultaneously to improve wetting and final bond strength.

Tape 9703 should be applied between 60°F - 158°F (15°C - 70°C). Tape application below 50°F (10°C) is not recommended because the adhesive will be too firm to wet the surface of the substrate, resulting in low adhesion.

Adhesion builds with time, up to 24 hours may be required to reach final adhesion values.

Removal

Mechanically separate the parts using torque for rigid parts and peel for flexible ones. Remove the adhesive by rubbing it off with a Scotch-Brite® Hand Pad, clean up the site and apply new adhesive. The force needed to separate the parts and/or remove the adhesive can be reduced by softening the adhesive by heating 158°F - 212°F (70°C - 100°C) or using solvents.

Note: When using solvents, be sure to follow the manufacturer’s precautions and directions for use when handling such materials.