• Description for 3M 9703

    Electrically Conductive Adhesive • Pressure sensitive adhesive • electrically<br/>conductive and offers good adhesion to common PCB substrates such as copper, gold, FR-4 epoxy, DuPont™ Kapton™ polyimide and polyester films •

    *See Terms of Use Below

    Application Type Bond, EMI/RFI shield, Gaskets, EMI/RFI shield
    1 Part or 2 Part 1 Part
    Material Form Transfer tape
    Substrate Aluminum, Copper, Gold, FR-4 epoxy, polyimide, Stainless Steel, Metals
    Industry Medium pitch flexible circuits, Rigid printed circuit boards (PCB), Polyester flex circuit splicing, Keyboard manufacturing, LCD screens, PCB substrates, LCD assembly
    Manufacturer 3M
    Chemistry Acrylic
    Cure Method Pressure Sensitive
    High Temperature Resistance (°C) 85
    Low Temperature Resistance (°C) -40
    Other Resistance Contact Resistance, < 0.3 ohms
  • Technical Data for 3M 9703

    Overview
    • Application Type
      • EMI Shielding - EMI/RFI shield
      • Gasketing - Gaskets
      • RFI/RMI Shielding - EMI/RFI shield
      • Adhesive - Bond
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 1 Part
    • Material Form
      • Tape - Transfer tape
    • Substrate
      • Metal - Metals
      • Aluminum
      • Copper
      • Gold
      • Epoxy - FR-4 epoxy
      • Polyimide (PI) - polyimide
      • Stainless Steel
      • Other - Kapton, Polyester films, EMI/RFI substrates, Smooth gasket materials
    • Industry
      • Electronics - Medium pitch flexible circuits, LCD screens, LCD assembly
      • Printed Circuit Board (PCB) - Rigid printed circuit boards (PCB), PCB substrates
      • Keyboards - Keyboard manufacturing
      • Splicing - Polyester flex circuit splicing
      • Other - Metal frames, Enclosures
    • Chemistry
    • Application Method
      • Contact
    • Cure Method
      • Pressure Sensitive (min) - Pressure Sensitive
    Specifications
    Cure Specs
    Application Temperature (°F) 60 to 158
    Bond Strength
    General Bond Strength (psi) High
    Peel Strength (piw) >35 (oz./in.), 50 (oz./in.), 55 (oz./in.), 50 (oz./in.), 60 (oz./in.), 65 (oz./in.), 29 (oz./in.), 32 (oz./in.) Test Method
    Material Resistance
    High Temperature Resistance (°C) 85
    Low Temperature Resistance (°C) -40
    Other Resistance Contact Resistance, < 0.3 ohms Test Method
    Conductivity
    Filler Filled
    Insulation Resistance (O) 3.4e14 (Ohms/square) Test Method
    Electrical Conductivity (mhos/cm) Electrically Conductive
    Other Properties
    Outgassing 0.7%, 0.01% Test Method
    Business Information
    Shelf Life Details Shelf Life and Storage Conditions: Tape in roll form: Shelf life 24 months from the date of manufacture when stored in original cartons at 21°C (70°F) and 50% relative humidity.
    Shelf Life Temperature (°F) 70
    Shelf Life Type From date of manufacture
    Shelf Life (mon) 24
  • Best Practices for 3M 9703

    *See Terms of Use Below

    1. Surface Preparation

      To obtain maximum adhesion, the bonding surfaces must be clean and dry.

    2. Application

      To obtain maximum adhesion, the bonding surfaces must be clean and dry.

      Pressure must be applied to the bond line after assembly to wet the substrates with 3M™ Electrically Conductive Adhesive Transfer Tape 9703 and to engage the conductive particles with the substrates to make electrical connection. Mechanical pressure (roller, metal bar) or finger pressure at 15 psi (0.10 Mpa) or greater is suggested. Heat may be applied simultaneously to improve wetting and final bond strength.

      Tape 9703 should be applied between 60°F - 158°F (15°C - 70°C). Tape application below 50°F (10°C) is not recommended because the adhesive will be too firm to wet the surface of the substrate, resulting in low adhesion.

      Adhesion builds with time, up to 24 hours may be required to reach final adhesion values.

    3. Removal

      Mechanically separate the parts using torque for rigid parts and peel for flexible ones. Remove the adhesive by rubbing it off with a Scotch-Brite® Hand Pad, clean up the site and apply new adhesive. The force needed to separate the parts and/or remove the adhesive can be reduced by softening the adhesive by heating 158°F - 212°F (70°C - 100°C) or using solvents.

      Note: When using solvents, be sure to follow the manufacturer’s precautions and directions for use when handling such materials.

  • Comparable Materials for 3M 9703

    *See Terms of Use Below

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Peel Strength Test Methods
Peel Strength Type Substrate Test Time Test Temperature Test Method
>35 (oz./in.) Stainless steel 15 min 23°C ASTM D3330, 2 mil Aluminum foil used as backing.
50 (oz./in.) Stainless steel 60 min 23°C ASTM D3330, 2 mil Aluminum foil used as backing.
55 (oz./in.) Stainless steel 1,440 min 23°C ASTM D3330, 2 mil Aluminum foil used as backing.
50 (oz./in.) Stainless steel 15 min 70°C ASTM D3330, 2 mil Aluminum foil used as backing.
60 (oz./in.) Stainless steel 60 min 70°C ASTM D3330, 2 mil Aluminum foil used as backing.
65 (oz./in.) Stainless steel 1,440 min 70°C ASTM D3330, 2 mil Aluminum foil used as backing.
29 (oz./in.) 180 degree Peel strength Stainless steel 60 min 23°C Test Method is based on a modified ASTM D3330, 12 ipm peel rate, 1 in. width, 2 mil PET backing
32 (oz./in.) 180 degree Peel strength Stainless steel 1,440 min 23°C Test Method is based on a modified ASTM D3330, 12 ipm peel rate, 1 in. width, 2 mil PET backing
Other Resistance Test Methods
Other Resistance Test Method
Contact Resistance, < 0.3 ohms 3M Test Method, Gold PI Flex onto Gold PCB, RT Initial R, 6 mm2
Insulation Resistance Test Methods
Insulation Resistance Test Method
3.4e14 (Ohms/square) Based upon ASTM D-257, Estimate based on 3M™ Electrically Conductive Adhesive Transfer Tape 9703 test data.
Outgassing Test Methods
Outgassing Temperature (°C) Test Method
0.7% 125°C NASA SP-R-0022 or ASTM E595, 125°C, 24 hrs, 2 x 10-6 Torr vacuum Total Mass Loss (TML)
0.01% NASA SP-R-0022 or ASTM E595, Collected Volatile Condensable Materials (CVCM)