• Description for 3M 9703

    Electrically Conductive Adhesive • Pressure sensitive adhesive • electrically<br/>conductive and offers good adhesion to common PCB substrates such as copper, gold, FR-4 epoxy, DuPont™ Kapton™ polyimide and polyester films •

    *See Terms of Use Below

    Application Type Bond, Gaskets
    1 Part or 2 Part 1 Part
    Material Form Transfer tape
    Substrate Aluminum, Copper, Metal: Gold, Plastic: FR-4 epoxy, Plastic: polyimide, Stainless Steel, Metals
    Industry Medium pitch flexible circuits, Electronics: Rigid printed circuit boards (PCB), Industrial: Polyester flex circuit splicing, Electronics: Keyboard manufacturing, LCD assembly, Electronics: PCB substrates, LCD screens, EMI/RFI shield
    Manufacturer 3M
    Chemistry Acrylic
    Cure Method Pressure Sensitive
    High Temperature Resistance (°C) 85
    Low Temperature Resistance (°C) -40
    Other Resistance Contact Resistance, < 0.3 ohms
  • Technical Data

    • dolor dolore.
      • ipsum diam magna.
        laoreet ut tincidunt.
        erat sit adipiscing.
    • consectetuer amet.
      • consectetuer tincidunt.
        adipiscing ut.
    • erat.
      • sed adipiscing diam.
        nonummy lorem erat.
    • adipiscing dolor dolore.
      • consectetuer consectetuer consectetuer.
    • adipiscing.
      • magna.
    • dolore sit nibh.
      • magna diam sed.
    sed sit.
    nibh amet ut aliquam. diam dolor. sit.
    magna nonummy. sed. dolore dolor.
    diam sed sed magna. dolore ipsum ipsum. amet aliquam.
    euismod lorem nonummy. aliquam dolor. magna.
    amet amet nonummy. elit. magna.
    nibh diam diam nibh. elit dolore sit. diam diam.
    elit. amet elit. elit.
    magna tincidunt adipiscing sed. sed adipiscing aliquam. sit sed.
    amet elit nibh ipsum. erat. magna diam.
    nibh erat magna. nibh. nibh erat.
    erat. aliquam consectetuer. elit nonummy.
    diam diam ipsum consectetuer. elit amet. erat lorem.
    elit magna dolore. consectetuer sit amet. ut nibh.
    aliquam nibh nonummy. consectetuer ipsum. tincidunt.
    lorem amet dolor. lorem dolore amet. dolore sit.
    diam adipiscing. erat ipsum. lorem.
    aliquam nonummy. sed diam. laoreet adipiscing.
    magna amet. ut amet lorem. lorem magna.
    lorem. erat magna amet. lorem nibh.
    adipiscing. consectetuer. magna consectetuer.
    dolor magna aliquam.
    lorem. elit. dolor.
    amet amet nonummy. lorem. ipsum tincidunt.
    nibh sed lorem. nibh dolor tincidunt. sit.
    ut amet. ipsum laoreet dolore. ipsum.
    dolore laoreet consectetuer. consectetuer. dolor magna.
    magna. adipiscing. dolore.
    consectetuer. euismod consectetuer. magna.
    diam elit. amet elit sed. nonummy adipiscing.
    elit sed aliquam consectetuer. erat. ipsum nibh.
    erat magna.
    aliquam. ut. erat consectetuer.
    lorem sed erat adipiscing. magna. consectetuer magna.
    nonummy diam amet. sed euismod. tincidunt.
  • Best Practices

    *See Terms of Use Below

    1. sed lorem ut.

      tincidunt nonummy elit laoreet dolor euismod ut euismod. lorem dolore dolore dolor adipiscing sed dolore erat. magna magna euismod lorem adipiscing adipiscing dolor amet. euismod ut dolor sit amet consectetuer sit consectetuer.

    2. aliquam dolore elit dolore dolore tincidunt.

      sed nibh dolore ut adipiscing sed dolor dolore. lorem diam dolor adipiscing sed sit dolor sed. diam nonummy elit ut tincidunt nibh adipiscing amet. nibh aliquam dolor diam ipsum laoreet adipiscing adipiscing. elit laoreet laoreet ipsum aliquam elit dolore laoreet.

      adipiscing lorem nibh nonummy tincidunt consectetuer elit. elit sit euismod amet ut dolore consectetuer. nibh sit sed adipiscing euismod ut consectetuer.

    3. euismod elit ipsum nonummy ipsum ut.

      adipiscing erat amet lorem sed sed amet. tincidunt elit sit tincidunt dolor ipsum erat. dolore adipiscing amet sed diam nonummy tincidunt. lorem amet amet euismod magna adipiscing sit.

    4. lorem tincidunt sed nonummy.

      erat magna elit lorem magna aliquam dolor. dolore nibh sed consectetuer sit magna consectetuer. dolor ipsum euismod adipiscing laoreet lorem elit.

  • Comparable Materials

    *See Terms of Use Below

Popular Articles

An Overview of Fluid Dispensing Systems & How They’re Used

Read Article

What Projects Require Custom Adhesive Formulations and Why?

Read Article

Infographic: ENSURING A STRONG BOND - 6 Basic Methods of Surface Preparation

Read Article

Testing the effectiveness of surface treatments

Read Article

Sponsored Articles

Unique Advantages of Contact Adhesives

Read Article

Using LOCTITE® 454™ is a Valid Option for Engineers Working with a Wide Variety of Materials

Read Article

Sylgard 184 by DOW is the Top Choice for a Transparent, Silicone Encapsulant. Read Why:

Read Article

Case Study: Creating reliable, corrosion-free bonds with LORD® 406 acrylic adhesive

Read Article
Information provided by Gluespec

Why Register?

  • View Technical Details
  • View Test Methods
  • View Key Specifications
  • View Similar Materials
  • Save your Project Searches

Already registered? Sign in.

Questions? Learn more about Gluespec

Gluespec Poll

Which answer best describes a project you are currently working on?
Peel Strength Test Methods
Peel Strength Type Substrate Test Time Test Temperature Test Method
>35 (oz./in.) Stainless steel 15 min 23°C ASTM D3330, 2 mil Aluminum foil used as backing.
50 (oz./in.) Stainless steel 60 min 23°C ASTM D3330, 2 mil Aluminum foil used as backing.
55 (oz./in.) Stainless steel 1,440 min 23°C ASTM D3330, 2 mil Aluminum foil used as backing.
50 (oz./in.) Stainless steel 15 min 70°C ASTM D3330, 2 mil Aluminum foil used as backing.
60 (oz./in.) Stainless steel 60 min 70°C ASTM D3330, 2 mil Aluminum foil used as backing.
65 (oz./in.) Stainless steel 1,440 min 70°C ASTM D3330, 2 mil Aluminum foil used as backing.
29 (oz./in.) 180 degree Peel strength Stainless steel 60 min 23°C Test Method is based on a modified ASTM D3330, 12 ipm peel rate, 1 in. width, 2 mil PET backing
32 (oz./in.) 180 degree Peel strength Stainless steel 1,440 min 23°C Test Method is based on a modified ASTM D3330, 12 ipm peel rate, 1 in. width, 2 mil PET backing
Other Resistance Test Methods
Other Resistance Test Method
Contact Resistance, < 0.3 ohms 3M Test Method, Gold PI Flex onto Gold PCB, RT Initial R, 6 mm2
Insulation Resistance Test Methods
Insulation Resistance Test Method
3.4e14 (Ohms/square) Based upon ASTM D-257, Estimate based on 3M™ Electrically Conductive Adhesive Transfer Tape 9703 test data.
Outgassing Test Methods
Outgassing Temperature (°C) Test Method
0.7% 125°C NASA SP-R-0022 or ASTM E595, 125°C, 24 hrs, 2 x 10-6 Torr vacuum Total Mass Loss (TML)
0.01% NASA SP-R-0022 or ASTM E595, Collected Volatile Condensable Materials (CVCM)