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Description for 3M 9703
Electrically Conductive Adhesive • Pressure sensitive adhesive • electrically<br/>conductive and offers good adhesion to common PCB substrates such as copper, gold, FR-4 epoxy, DuPont™ Kapton™ polyimide and polyester films •Application Type Bond, EMI/RFI shield, Gaskets, EMI/RFI shield 1 Part or 2 Part 1 Part Material Form Transfer tape Substrate Aluminum, Copper, Gold, FR-4 epoxy, polyimide, Stainless Steel, Metals Industry Medium pitch flexible circuits, Rigid printed circuit boards (PCB), Polyester flex circuit splicing, Keyboard manufacturing, LCD screens, PCB substrates, LCD assembly Manufacturer 3M Chemistry Acrylic Cure Method Pressure Sensitive, Heat High Temperature Resistance (°C) 85 Low Temperature Resistance (°C) -40 Other Resistance Contact Resistance, < 0.3 ohms
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Peel Strength Test Methods
Peel Strength | Type | Substrate | Test Time | Test Temperature | Test Method |
---|---|---|---|---|---|
>35 (oz./in.) | Stainless steel | 15 min | 23°C | ASTM D3330, 2 mil Aluminum foil used as backing. | |
50 (oz./in.) | Stainless steel | 60 min | 23°C | ASTM D3330, 2 mil Aluminum foil used as backing. | |
55 (oz./in.) | Stainless steel | 1,440 min | 23°C | ASTM D3330, 2 mil Aluminum foil used as backing. | |
50 (oz./in.) | Stainless steel | 15 min | 70°C | ASTM D3330, 2 mil Aluminum foil used as backing. | |
60 (oz./in.) | Stainless steel | 60 min | 70°C | ASTM D3330, 2 mil Aluminum foil used as backing. | |
65 (oz./in.) | Stainless steel | 1,440 min | 70°C | ASTM D3330, 2 mil Aluminum foil used as backing. | |
29 (oz./in.) | 180 degree Peel strength | Stainless steel | 60 min | 23°C | Test Method is based on a modified ASTM D3330, 12 ipm peel rate, 1 in. width, 2 mil PET backing |
32 (oz./in.) | 180 degree Peel strength | Stainless steel | 1,440 min | 23°C | Test Method is based on a modified ASTM D3330, 12 ipm peel rate, 1 in. width, 2 mil PET backing |
Other Resistance Test Methods
Other Resistance | Test Method |
---|---|
Contact Resistance, < 0.3 ohms | 3M Test Method, Gold PI Flex onto Gold PCB, RT Initial R, 6 mm2 |
Insulation Resistance Test Methods
Insulation Resistance | Test Method |
---|---|
3.4e14 (Ohms/square) | Based upon ASTM D-257, Estimate based on 3M™ Electrically Conductive Adhesive Transfer Tape 9703 test data. |
Outgassing Test Methods
Outgassing | Temperature (°C) | Test Method |
---|---|---|
0.7% | 125°C | NASA SP-R-0022 or ASTM E595, 125°C, 24 hrs, 2 x 10-6 Torr vacuum Total Mass Loss (TML) |
0.01% | NASA SP-R-0022 or ASTM E595, Collected Volatile Condensable Materials (CVCM) |