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Description for 3M 9703
Electrically Conductive Adhesive • Pressure sensitive adhesive • electrically<br/>conductive and offers good adhesion to common PCB substrates such as copper, gold, FR-4 epoxy, DuPont™ Kapton™ polyimide and polyester films •Application Type Bond, Gaskets, EMI/RFI shield, EMI/RFI shield 1 Part or 2 Part 1-Part Material Form Transfer tape Substrate Aluminum, Copper, Stainless Steel, Gold, polyimide, FR-4 epoxy, Metals Industry Medium pitch flexible circuits, Polyester flex circuit splicing, Rigid printed circuit boards (PCB), Keyboard manufacturing, LCD screens, PCB substrates, LCD assembly Manufacturer 3M Chemistry Acrylic Cure Method Pressure Sensitive, Heat Application Temperature (°F) 60 to 158 High Temperature Resistance (°C) 85 Low Temperature Resistance (°C) -40 Other Resistance Contact Resistance, < 0.3 ohms -
Technical Data for 3M 9703
Overview
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Application Type
- Gasketing - Gaskets
- EMI Shielding - EMI/RFI shield
- RFI/RMI Shielding - EMI/RFI shield
- Adhesive - Bond
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1 Part or 2 Part
- 1-Part
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Material Form
- Tape - Transfer tape
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Substrate
- Metal - Metals
- Aluminum
- Copper
- Gold
- Polyimide (PI) - polyimide
- Epoxy - FR-4 epoxy
- Stainless Steel
- Other - Kapton, Polyester films, EMI/RFI substrates, Smooth gasket materials
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Industry
- Keyboards - Keyboard manufacturing
- Electronics - Medium pitch flexible circuits, LCD screens, LCD assembly
- Printed Circuit Board (PCB) - Rigid printed circuit boards (PCB), PCB substrates
- Splicing - Polyester flex circuit splicing
- Other - Metal frames, Enclosures
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Chemistry
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Application Method
- Contact
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Cure Method
- Pressure Sensitive (min) - Pressure Sensitive
- Heat
Specifications
Cure Specs
Application Temperature (°F) 60 to 158 Bond Strength
General Bond Strength (psi) High Peel Strength (piw) >35 (oz./in.), 50 (oz./in.), 55 (oz./in.), 50 (oz./in.), 60 (oz./in.), 65 (oz./in.), 29 (oz./in.), 32 (oz./in.) Test Method Material Resistance
High Temperature Resistance (°C) 85 Low Temperature Resistance (°C) -40 Other Resistance Contact Resistance, < 0.3 ohms Test Method Conductivity
Filler Filled Insulation Resistance (O) 3.4e14 (Ohms/square) Test Method Electrical Conductivity (mhos/cm) Electrically Conductive Other Properties
Outgassing 0.7%, 0.01% Test Method Business Information
Shelf Life Details Shelf Life and Storage Conditions: Tape in roll form: Shelf life 24 months from the date of manufacture when stored in original cartons at 21°C (70°F) and 50% relative humidity. Shelf Life Temperature (°F) 70 Shelf Life Type From date of manufacture Shelf Life (mon) 24 -
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Best Practices for 3M 9703
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Surface Preparation
To obtain maximum adhesion, the bonding surfaces must be clean and dry.
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Application
To obtain maximum adhesion, the bonding surfaces must be clean and dry.
Pressure must be applied to the bond line after assembly to wet the substrates with 3M™ Electrically Conductive Adhesive Transfer Tape 9703 and to engage the conductive particles with the substrates to make electrical connection. Mechanical pressure (roller, metal bar) or finger pressure at 15 psi (0.10 Mpa) or greater is suggested. Heat may be applied simultaneously to improve wetting and final bond strength.
Tape 9703 should be applied between 60°F - 158°F (15°C - 70°C). Tape application below 50°F (10°C) is not recommended because the adhesive will be too firm to wet the surface of the substrate, resulting in low adhesion.
Adhesion builds with time, up to 24 hours may be required to reach final adhesion values.
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Removal
Mechanically separate the parts using torque for rigid parts and peel for flexible ones. Remove the adhesive by rubbing it off with a Scotch-Brite® Hand Pad, clean up the site and apply new adhesive. The force needed to separate the parts and/or remove the adhesive can be reduced by softening the adhesive by heating 158°F - 212°F (70°C - 100°C) or using solvents.
Note: When using solvents, be sure to follow the manufacturer’s precautions and directions for use when handling such materials.
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Comparable Materials for 3M 9703
Spec Engine® Results
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Peel Strength Test Methods
Peel Strength | Type | Substrate | Test Time | Test Temperature | Test Method |
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>35 (oz./in.) | Stainless steel | 15 min | 23°C | ASTM D3330, 2 mil Aluminum foil used as backing. | |
50 (oz./in.) | Stainless steel | 60 min | 23°C | ASTM D3330, 2 mil Aluminum foil used as backing. | |
55 (oz./in.) | Stainless steel | 1,440 min | 23°C | ASTM D3330, 2 mil Aluminum foil used as backing. | |
50 (oz./in.) | Stainless steel | 15 min | 70°C | ASTM D3330, 2 mil Aluminum foil used as backing. | |
60 (oz./in.) | Stainless steel | 60 min | 70°C | ASTM D3330, 2 mil Aluminum foil used as backing. | |
65 (oz./in.) | Stainless steel | 1,440 min | 70°C | ASTM D3330, 2 mil Aluminum foil used as backing. | |
29 (oz./in.) | 180 degree Peel strength | Stainless steel | 60 min | 23°C | Test Method is based on a modified ASTM D3330, 12 ipm peel rate, 1 in. width, 2 mil PET backing |
32 (oz./in.) | 180 degree Peel strength | Stainless steel | 1,440 min | 23°C | Test Method is based on a modified ASTM D3330, 12 ipm peel rate, 1 in. width, 2 mil PET backing |
Other Resistance Test Methods
Other Resistance | Test Method |
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Contact Resistance, < 0.3 ohms | 3M Test Method, Gold PI Flex onto Gold PCB, RT Initial R, 6 mm2 |
Insulation Resistance Test Methods
Insulation Resistance | Test Method |
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3.4e14 (Ohms/square) | Based upon ASTM D-257, Estimate based on 3M™ Electrically Conductive Adhesive Transfer Tape 9703 test data. |
Outgassing Test Methods
Outgassing | Temperature (°C) | Test Method |
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0.7% | 125°C | NASA SP-R-0022 or ASTM E595, 125°C, 24 hrs, 2 x 10-6 Torr vacuum Total Mass Loss (TML) |
0.01% | NASA SP-R-0022 or ASTM E595, Collected Volatile Condensable Materials (CVCM) |