3M 9703

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Description for 3M 9703

Electrically Conductive Adhesive • Pressure sensitive adhesive • electrically<br/>conductive and offers good adhesion to common PCB substrates such as copper, gold, FR-4 epoxy, DuPont™ Kapton™ polyimide and polyester films •

*See Terms of Use Below

Application Type	Bond
1 Part or 2 Part	1 Part
Material Form	Transfer tape
Substrate	Aluminum, Copper, Metal: Gold, Plastic: FR-4 epoxy, Plastic: polyimide, Stainless Steel, Metals
Industry	Medium pitch flexible circuits, Electronics: Rigid printed circuit boards (PCB), Industrial: Polyester flex circuit splicing, Electronics: Keyboard manufacturing, LCD assembly, Electronics: PCB substrates, LCD screens, EMI/RFI shield
Manufacturer	3M
Chemistry	Acrylic
Cure Method	Pressure Sensitive
High Temperature Resistance (°C)	85
Low Temperature Resistance (°C)	-40
Other Resistance	Contact Resistance, < 0.3 ohms

Best Practices for 3M 9703

*See Terms of Use Below

Surface Preparation

To obtain maximum adhesion, the bonding surfaces must be clean and dry.
Application

To obtain maximum adhesion, the bonding surfaces must be clean and dry.

Pressure must be applied to the bond line after assembly to wet the substrates with 3M™ Electrically Conductive Adhesive Transfer Tape 9703 and to engage the conductive particles with the substrates to make electrical connection. Mechanical pressure (roller, metal bar) or finger pressure at 15 psi (0.10 Mpa) or greater is suggested. Heat may be applied simultaneously to improve wetting and final bond strength.

Tape 9703 should be applied between 60°F - 158°F (15°C - 70°C). Tape application below 50°F (10°C) is not recommended because the adhesive will be too firm to wet the surface of the substrate, resulting in low adhesion.

Adhesion builds with time, up to 24 hours may be required to reach final adhesion values.
Removal

Mechanically separate the parts using torque for rigid parts and peel for flexible ones. Remove the adhesive by rubbing it off with a Scotch-Brite® Hand Pad, clean up the site and apply new adhesive. The force needed to separate the parts and/or remove the adhesive can be reduced by softening the adhesive by heating 158°F - 212°F (70°C - 100°C) or using solvents.

Note: When using solvents, be sure to follow the manufacturer’s precautions and directions for use when handling such materials.

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Technical Data

Overview

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Specifications

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Best Practices

*See Terms of Use Below
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Peel Strength	Type	Substrate	Test Time	Test Temperature	Test Method
>35 (oz./in.)		Stainless steel	15 min	23°C	ASTM D3330, 2 mil Aluminum foil used as backing.
50 (oz./in.)		Stainless steel	60 min	23°C	ASTM D3330, 2 mil Aluminum foil used as backing.
55 (oz./in.)		Stainless steel	1,440 min	23°C	ASTM D3330, 2 mil Aluminum foil used as backing.
50 (oz./in.)		Stainless steel	15 min	70°C	ASTM D3330, 2 mil Aluminum foil used as backing.
60 (oz./in.)		Stainless steel	60 min	70°C	ASTM D3330, 2 mil Aluminum foil used as backing.
65 (oz./in.)		Stainless steel	1,440 min	70°C	ASTM D3330, 2 mil Aluminum foil used as backing.
29 (oz./in.)	180 degree Peel strength	Stainless steel	60 min	23°C	Test Method is based on a modified ASTM D3330, 12 ipm peel rate, 1 in. width, 2 mil PET backing
32 (oz./in.)	180 degree Peel strength	Stainless steel	1,440 min	23°C	Test Method is based on a modified ASTM D3330, 12 ipm peel rate, 1 in. width, 2 mil PET backing

Outgassing	Temperature (°C)	Test Method
0.7%	125°C	NASA SP-R-0022 or ASTM E595, 125°C, 24 hrs, 2 x 10-6 Torr vacuum Total Mass Loss (TML)
0.01%		NASA SP-R-0022 or ASTM E595, Collected Volatile Condensable Materials (CVCM)

3M 9703

Description for 3M 9703

Best Practices for 3M 9703

Surface Preparation

Application