• Description for 3M 9703

    Electrically Conductive Adhesive • Pressure sensitive adhesive • electrically<br/>conductive and offers good adhesion to common PCB substrates such as copper, gold, FR-4 epoxy, DuPont™ Kapton™ polyimide and polyester films •

    *See Terms of Use Below

    Application Type Bond, Gaskets
    1 Part or 2 Part 1 Part
    Material Form Transfer tape
    Substrate Aluminum, Copper, Metal: Gold, Plastic: FR-4 epoxy, Plastic: polyimide, Stainless Steel, Metals
    Industry Medium pitch flexible circuits, Electronics: Rigid printed circuit boards (PCB), Industrial: Polyester flex circuit splicing, Electronics: Keyboard manufacturing, LCD assembly, Electronics: PCB substrates, LCD screens, EMI/RFI shield
    Manufacturer 3M
    Chemistry Acrylic
    Cure Method Pressure Sensitive
    High Temperature Resistance (°C) 85
    Low Temperature Resistance (°C) -40
    Other Resistance Contact Resistance, < 0.3 ohms
  • Technical Data

    Overview
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    Specifications
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  • Best Practices

    *See Terms of Use Below

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Peel Strength Test Methods
Peel Strength Type Substrate Test Time Test Temperature Test Method
>35 (oz./in.) Stainless steel 15 min 23°C ASTM D3330, 2 mil Aluminum foil used as backing.
50 (oz./in.) Stainless steel 60 min 23°C ASTM D3330, 2 mil Aluminum foil used as backing.
55 (oz./in.) Stainless steel 1,440 min 23°C ASTM D3330, 2 mil Aluminum foil used as backing.
50 (oz./in.) Stainless steel 15 min 70°C ASTM D3330, 2 mil Aluminum foil used as backing.
60 (oz./in.) Stainless steel 60 min 70°C ASTM D3330, 2 mil Aluminum foil used as backing.
65 (oz./in.) Stainless steel 1,440 min 70°C ASTM D3330, 2 mil Aluminum foil used as backing.
29 (oz./in.) 180 degree Peel strength Stainless steel 60 min 23°C Test Method is based on a modified ASTM D3330, 12 ipm peel rate, 1 in. width, 2 mil PET backing
32 (oz./in.) 180 degree Peel strength Stainless steel 1,440 min 23°C Test Method is based on a modified ASTM D3330, 12 ipm peel rate, 1 in. width, 2 mil PET backing
Other Resistance Test Methods
Other Resistance Test Method
Contact Resistance, < 0.3 ohms 3M Test Method, Gold PI Flex onto Gold PCB, RT Initial R, 6 mm2
Insulation Resistance Test Methods
Insulation Resistance Test Method
3.4e14 (Ohms/square) Based upon ASTM D-257, Estimate based on 3M™ Electrically Conductive Adhesive Transfer Tape 9703 test data.
Outgassing Test Methods
Outgassing Temperature (°C) Test Method
0.7% 125°C NASA SP-R-0022 or ASTM E595, 125°C, 24 hrs, 2 x 10-6 Torr vacuum Total Mass Loss (TML)
0.01% NASA SP-R-0022 or ASTM E595, Collected Volatile Condensable Materials (CVCM)