| Application Type | Bond |
|---|---|
| 1 Part or 2 Part | 1 Part |
| Material Form | Tape |
| Substrate | Aluminum, Copper, Metal, PVC, Stainless Steel, PVC laminates |
| Industry | Electrical devices, EMI/RFI shield, EMI/RFI gasket attachment to metal surfaces, Electronic devices, Foil laminate shields, Electronic cabinetry, Grounding Computer Antistatic and Glare Reduction Screens |
| Manufacturer | 3M |
| Chemistry | Filled Acrylic, Non-woven carbon scrim |
| Cure Method | Pressure Sensitive |
| High Temperature Resistance (°C) | 121, 70 |
| Other Resistance | Low electrical resistance |
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| Peel Strength | Type | Substrate | Test Time | Test Temperature | Test Method |
|---|---|---|---|---|---|
| > 41 (oz./in) | 90° Peel Strength | Stainless Steel | 20 min | 22°C | Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9712. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature. |
| >35 (oz./in) | 90° Peel Strength | Aluminum | 20 min | 22°C | Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9712. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature. |
| > 37 (oz./in) | 90° Peel Strength | Copper | 20 min | 22°C | Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9712. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature. |
| > 42 (oz./in) | 90° Peel Strength | Stainless Steel | 1,440 min | 22°C | Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9712. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature. |
| > 33 (oz./in) | 90° Peel Strength | Aluminum | 1,440 min | 22°C | Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9712. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature. |
| > 39 (oz./in) | 90° Peel Strength | Copper | 1,440 min | 22°C | Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9712. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature. |
| > 43 (oz./in) | 90° Peel Strength | Stainless Steel | 20 min | 70°C | Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9712. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature. |
| > 36 (oz./in) | 90° Peel Strength | Aluminum | 20 min | 70°C | Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9712. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature. |
| > 43 (oz./in) | 90° Peel Strength | Copper | 20 min | 70°C | Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9712. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature. |
| > 53 (oz./in) | 90° Peel Strength | Stainless Steel | 1,440 min | 70°C | Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9712. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature. |
| > 43 (oz./in) | 90° Peel Strength | Aluminum | 1,440 min | 70°C | Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9712. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature. |
| > 55 (oz./in) | 90° Peel Strength | Copper | 1,440 min | 70°C | Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9712. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature. |
| High Temperature Resistance | Test Method |
|---|---|
| 121°C | Operating Temperature, Long Term |
| 70°C | Operating Temperature, Short Term Exposure |
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