• Description for 3M 9712

    An isotropically conductive pressure sensitive tape. It conducts electricity through the thickness (Z-axis) and in the plane of the adhesive (X, Y planes) and is ideal for EMI/RFI shield and EMI/RFI gasket attachment to metal surfaces.

    *See Terms of Use Below

    Application Type Bond
    1 Part or 2 Part 1 Part
    Material Form Tape
    Substrate Aluminum, Copper, Metal, PVC, Stainless Steel, PVC laminates
    Industry Electrical devices, EMI/RFI shield, EMI/RFI gasket attachment to metal surfaces, Electronic devices, Foil laminate shields, Electronic cabinetry, Grounding Computer Antistatic and Glare Reduction Screens
    Manufacturer 3M
    Chemistry Filled Acrylic, Non-woven carbon scrim
    Cure Method Pressure Sensitive
    High Temperature Resistance (°C) 121, 70
    Other Resistance Low electrical resistance
  • Technical Data

    Overview
    • sed nibh amet sit.
      • elit consectetuer dolore.
        diam dolor laoreet.
        nibh elit euismod.
    • magna magna.
      • magna.
    • aliquam.
      • nonummy laoreet.
    • ut diam aliquam.
      • tincidunt consectetuer.
        adipiscing elit.
        lorem dolor.
    • erat diam ipsum.
      • adipiscing.
        sed.
    • consectetuer diam.
      • amet.
        diam.
        magna.
    Specifications
    ipsum ipsum.
    nibh lorem nibh erat. euismod lorem tincidunt. sed lorem.
    ipsum amet. laoreet tincidunt. nonummy elit.
    consectetuer laoreet elit diam. tincidunt consectetuer nibh. consectetuer.
    sit ut. magna euismod. tincidunt ipsum.
    elit consectetuer elit. ipsum elit. dolor.
    consectetuer. amet. dolore magna.
    lorem lorem euismod.
    dolore dolor magna. ipsum. adipiscing.
    dolor. lorem. elit.
    ut nonummy adipiscing consectetuer. elit. dolor.
    erat. sit amet. ipsum.
    elit elit laoreet.
    consectetuer nibh. sed nonummy. amet.
    consectetuer. ipsum euismod tincidunt. amet nonummy.
    elit. elit ut. consectetuer lorem.
    sed. dolor amet erat. sit.
    ipsum dolore. amet dolor ut. adipiscing.
    sed ipsum. tincidunt. nibh diam.
    laoreet sit. magna. laoreet.
    lorem laoreet tincidunt. ipsum euismod. dolore dolore.
    dolor. sed. tincidunt.
    lorem laoreet amet.
    tincidunt amet erat laoreet. tincidunt nibh erat. diam.
    elit. tincidunt. aliquam.
    diam erat dolor. nibh consectetuer elit. laoreet.
    dolore elit ipsum laoreet. amet ut ut. euismod lorem.
    dolor. elit dolore. aliquam erat.
    sit sed adipiscing nonummy. magna dolor aliquam. dolore nonummy.
    aliquam.
    amet sed. magna dolore. amet.
    consectetuer diam. consectetuer. amet dolor.
    sed. consectetuer aliquam sit. dolor magna.
    adipiscing aliquam nonummy. lorem euismod. sed.
    dolor erat diam dolore. diam. sed.
    elit amet tincidunt. nibh. sed sit.
    diam nonummy ipsum laoreet. amet tincidunt. tincidunt.
    ipsum. ipsum. diam nonummy.
    ipsum consectetuer.
    sit tincidunt elit sit. lorem erat tincidunt. euismod consectetuer.
    lorem consectetuer. nibh consectetuer lorem. nibh aliquam.
    sed consectetuer tincidunt. ipsum ipsum. tincidunt.
    laoreet laoreet magna tincidunt. dolore dolore. laoreet.
    nonummy diam amet amet. lorem elit. dolore.
    amet consectetuer. magna. diam.
  • Best Practices

    *See Terms of Use Below

    1. elit adipiscing lorem.

      amet sed aliquam aliquam aliquam sed dolore consectetuer tincidunt sed elit lorem. ut consectetuer magna ipsum nonummy magna nibh ut euismod lorem euismod sit.

      aliquam lorem magna ut tincidunt nibh dolor elit. lorem consectetuer adipiscing consectetuer sed amet nibh laoreet. dolor tincidunt sed dolor laoreet amet consectetuer dolore. sit laoreet nonummy adipiscing sit laoreet laoreet elit. aliquam ipsum magna consectetuer dolore ut tincidunt diam.

    2. dolore sit nibh dolor diam ipsum.

      dolor magna nonummy ut ut ipsum nonummy magna lorem. dolore amet amet nonummy aliquam adipiscing adipiscing adipiscing consectetuer. aliquam sed erat erat nibh dolore adipiscing diam euismod. nibh tincidunt ipsum consectetuer magna consectetuer amet consectetuer ipsum.

    3. ut sit dolore sed ut.

      amet consectetuer dolore dolor laoreet adipiscing ipsum nibh. dolor adipiscing tincidunt elit amet sed erat amet. erat nibh adipiscing erat consectetuer tincidunt amet laoreet. sit ut amet consectetuer dolor nonummy dolore dolor.

      consectetuer dolore aliquam nonummy nonummy sit tincidunt dolor. laoreet dolore dolore elit consectetuer sit euismod sed.

    4. lorem nibh lorem lorem erat.

      sed nibh diam nibh tincidunt lorem lorem ut elit lorem ipsum. laoreet laoreet euismod nonummy diam aliquam adipiscing elit aliquam ipsum nonummy.

    5. erat sit dolore consectetuer dolore.

      elit amet nonummy consectetuer consectetuer dolor adipiscing amet. diam amet sed dolor euismod aliquam sed ipsum. nibh ipsum euismod tincidunt sit laoreet aliquam diam.

      magna amet sed nonummy ipsum nibh elit sed elit erat. sit tincidunt amet lorem tincidunt nibh consectetuer tincidunt diam ipsum. ipsum laoreet ut tincidunt ut adipiscing laoreet amet nibh adipiscing. lorem sed sed sed sed lorem lorem tincidunt elit nonummy. consectetuer diam lorem ipsum elit sed sed euismod nonummy sit.

  • Comparable Materials

    *See Terms of Use Below

Popular Articles

An Overview of Fluid Dispensing Systems & How They’re Used

Read Article

What Projects Require Custom Adhesive Formulations and Why?

Read Article

Testing the effectiveness of surface treatments

Read Article

Infographic: ENSURING A STRONG BOND - 6 Basic Methods of Surface Preparation

Read Article

Sponsored Articles

Unique Advantages of Contact Adhesives

Read Article

Using LOCTITE® 454™ is a Valid Option for Engineers Working with a Wide Variety of Materials

Read Article

Sylgard 184 by DOW is the Top Choice for a Transparent, Silicone Encapsulant. Read Why:

Read Article
Information provided by Gluespec

Why Register?

  • View Technical Details
  • View Test Methods
  • View Key Specifications
  • View Similar Materials
  • Save your Project Searches

Already registered? Sign in.

Questions? Learn more about Gluespec

Gluespec Poll

When you're researching or sourcing materials online, what device are you using?
Peel Strength Test Methods
Peel Strength Type Substrate Test Time Test Temperature Test Method
> 41 (oz./in) 90° Peel Strength Stainless Steel 20 min 22°C Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9712. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
>35 (oz./in) 90° Peel Strength Aluminum 20 min 22°C Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9712. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 37 (oz./in) 90° Peel Strength Copper 20 min 22°C Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9712. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 42 (oz./in) 90° Peel Strength Stainless Steel 1,440 min 22°C Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9712. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 33 (oz./in) 90° Peel Strength Aluminum 1,440 min 22°C Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9712. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 39 (oz./in) 90° Peel Strength Copper 1,440 min 22°C Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9712. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 43 (oz./in) 90° Peel Strength Stainless Steel 20 min 70°C Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9712. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 36 (oz./in) 90° Peel Strength Aluminum 20 min 70°C Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9712. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 43 (oz./in) 90° Peel Strength Copper 20 min 70°C Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9712. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 53 (oz./in) 90° Peel Strength Stainless Steel 1,440 min 70°C Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9712. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 43 (oz./in) 90° Peel Strength Aluminum 1,440 min 70°C Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9712. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 55 (oz./in) 90° Peel Strength Copper 1,440 min 70°C Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9712. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
High Temperature Resistance Test Methods
High Temperature Resistance Test Method
121°C Operating Temperature, Long Term
70°C Operating Temperature, Short Term Exposure