3M 9712

3M 9712 Datasheet
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  • Description for 3M 9712

    An isotropically conductive pressure sensitive tape. It conducts electricity through the thickness (Z-axis) and in the plane of the adhesive (X, Y planes) and is ideal for EMI/RFI shield and EMI/RFI gasket attachment to metal surfaces.

    *See Terms of Use Below

    Application Type Bond, EMI/RFI shield, EMI/RFI shield
    1 Part or 2 Part 1 Part
    Material Form Tape
    Substrate Aluminum, Copper, EMI/RFI gasket attachment to metal surfaces, PVC, Stainless Steel, Foam, PVC laminates
    Industry Electronic devices, Grounding Computer Antistatic and Glare Reduction Screens, Foil laminate shields, Electronic cabinetry, Electrical devices
    Manufacturer 3M
    Chemistry Filled Acrylic, Non-woven carbon scrim
    Cure Method Pressure Sensitive
    High Temperature Resistance (°C) 121, 70
    Other Resistance Low electrical resistance

  • Technical Data for 3M 9712

    *See Terms of Use Below

    Overview
    • Application Type
      • EMI Shielding - EMI/RFI shield
      • RFI/RMI Shielding - EMI/RFI shield
      • Adhesive - Bond
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 1 Part
    • Material Form
      • Tape
    • Substrate
    • Industry
      • Electronics - Electronic devices, Foil laminate shields, Electronic cabinetry, Electrical devices
      • Storage & Graphics - Grounding Computer Antistatic and Glare Reduction Screens
    • Chemistry
      • Acrylic - Filled Acrylic
      • Other - Non-woven carbon scrim
    • Application Method
      • Dispenser - Finger pressure
      • Roll - Roller
      • Contact
    • Cure Method
      • Pressure Sensitive (min) - Pressure Sensitive
    Specifications
    Cure Specs
    Application Temperature (°F) 60 to 100
    Bond Strength
    General Bond Strength (psi) Good
    Peel Strength (piw) > 41 (oz./in), >35 (oz./in), > 37 (oz./in), > 42 (oz./in), > 33 (oz./in), > 39 (oz./in), > 43 (oz./in), > 36 (oz./in), > 43 (oz./in), > 53 (oz./in), > 43 (oz./in), > 55 (oz./in) Test Method
    Tape Properties
    Total Thickness (mil) 9
    Double Sided Double-sided
    Material Resistance
    High Temperature Resistance (°C) 121, 70 Test Method
    Other Resistance Low electrical resistance
    Conductivity
    Filler Conductive Fibers
    Electrical Conductivity (mhos/cm) Electrically conductivity
    Business Information
    Shelf Life Details Shelf life of Tape in Roll Form: 24 months from date of manufacture when stored in original cartons at 70°F (21°C) and 50% relative humidity.
    Shelf Life Temperature (°F) 70
    Shelf Life Type From date of manufacture
    Shelf Life (mon) 24

  • Best Practices for 3M 9712

    *See Terms of Use Below

    1. Surface Preparation

      To obtain maximum adhesion, the bonding surfaces must be clean and dry. Isopropyl alcohol is recommended as a cleaning solvent.

      Electrical performance is dependent upon the nature of the metal and its surface. Most metal surfaces give enhanced electrical performance with tape 9712 when the surface has been lightly abraded. Scotch-BriteTM pads are recommended for preparing the metal surface.

      The surfaces should be cleaned again before applying a new piece of 3M tape 9712. The force required to separate the parts and/or remove the adhesive can be reduced by softening the adhesive by heating to 158°F -212°F (70°C - 100°C) or using solvents such as acetone.

      Note Carefully read and follow the manufacturer's precautions and directions for use when handling cleaning solvents.

    2. Application

      Bond Strength is dependent upon the amount of adhesive-to-surface contact developed. This wetted area can be increased by applying 3MTM XYZ-Axis Electrically Conductive Tape 9712 firmly with a roller or finger pressure to exclude air entrapment. Adhesion is optimized when the substrates are flat or conformable substrates. Adhesion increases after application, up to 24 hours later, due to increased wetting by the tape.

      Tape application below 50°F (10°C) is not recommended because the adhesive will be too firm to wet the substrates, resulting in low adhesion. Warming the substrates to 100°F (38°C) facilitates adhesion. Once properly applied, low temperature holding power is generally satisfactory.

    3. Removal

      3M tape 9712 can be removed by separating the parts using torque for rigid parts or peel for flexible ones. Remove the adhesive by pulling off as much as possible by application of 3MTM packaging Tape over the residual adhesive followed by removal of packaging tape.

      Note Carefully read and follow the manufacturer's precautions and directions for use when handling cleaning solvents.

  • Comparable Materials for 3M 9712

    *See Terms of Use Below

    Spec Engine® Results

    • 3M
      9713(3M)

      An isotropically conductive pressure sensitive tape. It conducts electricity through the thickness (Z-axis) and in the plane of the adhesive (X, Y planes) and is ideal for EMI/RFI shield and EMI/RFI gasket attachment to metal surfaces.

    • 3M
      9720(3M)

      Ideal for EMI/RFI shielding/grounding and EMI/RFI gasket attachment to metal surfaces (including metal plated substrates) in electronic and electrical devices.

    • 3M
      Copper Foil Tape 1126(3M)

      Consists of a 1-ounce rolled copper foil backing and an electrically conductive, pressure-sensitive acrylic adhesive.

    • Compare All
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Peel Strength Test Methods
Peel Strength Type Substrate Test Time Test Temperature Test Method
> 41 (oz./in) 90° Peel Strength Stainless Steel 20 min 22°C Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9712. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
>35 (oz./in) 90° Peel Strength Aluminum 20 min 22°C Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9712. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 37 (oz./in) 90° Peel Strength Copper 20 min 22°C Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9712. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 42 (oz./in) 90° Peel Strength Stainless Steel 1,440 min 22°C Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9712. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 33 (oz./in) 90° Peel Strength Aluminum 1,440 min 22°C Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9712. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 39 (oz./in) 90° Peel Strength Copper 1,440 min 22°C Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9712. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 43 (oz./in) 90° Peel Strength Stainless Steel 20 min 70°C Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9712. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 36 (oz./in) 90° Peel Strength Aluminum 20 min 70°C Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9712. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 43 (oz./in) 90° Peel Strength Copper 20 min 70°C Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9712. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 53 (oz./in) 90° Peel Strength Stainless Steel 1,440 min 70°C Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9712. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 43 (oz./in) 90° Peel Strength Aluminum 1,440 min 70°C Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9712. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 55 (oz./in) 90° Peel Strength Copper 1,440 min 70°C Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9712. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
High Temperature Resistance Test Methods
High Temperature Resistance Test Method
121°C Operating Temperature, Long Term
70°C Operating Temperature, Short Term Exposure