• Description for 3M 9712

    An isotropically conductive pressure sensitive tape. It conducts electricity through the thickness (Z-axis) and in the plane of the adhesive (X, Y planes) and is ideal for EMI/RFI shield and EMI/RFI gasket attachment to metal surfaces.

    *See Terms of Use Below

    Application Type Bond, EMI/RFI shield, EMI/RFI gasket attachment to metal surfaces , EMI/RFI gasket attachment to metal surfaces, EMI/RFI shield
    1 Part or 2 Part 1 Part
    Material Form Tape
    Substrate Aluminum, Copper, Metal, PVC, Stainless Steel, PVC laminates
    Industry Electronic devices, Electronics: Grounding Computer Antistatic and Glare Reduction Screens, Foil laminate shields, Electronic cabinetry, Electrical devices
    Manufacturer 3M
    Chemistry Filled Acrylic, Non-woven carbon scrim
    Cure Method Pressure Sensitive
    High Temperature Resistance (°C) 121, 70
    Other Resistance Low electrical resistance
  • Technical Data

    Overview
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    Specifications
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  • Best Practices

    *See Terms of Use Below

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Peel Strength Test Methods
Peel Strength Type Substrate Test Time Test Temperature Test Method
> 41 (oz./in) 90° Peel Strength Stainless Steel 20 min 22°C Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9712. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
>35 (oz./in) 90° Peel Strength Aluminum 20 min 22°C Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9712. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 37 (oz./in) 90° Peel Strength Copper 20 min 22°C Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9712. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 42 (oz./in) 90° Peel Strength Stainless Steel 1,440 min 22°C Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9712. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 33 (oz./in) 90° Peel Strength Aluminum 1,440 min 22°C Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9712. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 39 (oz./in) 90° Peel Strength Copper 1,440 min 22°C Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9712. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 43 (oz./in) 90° Peel Strength Stainless Steel 20 min 70°C Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9712. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 36 (oz./in) 90° Peel Strength Aluminum 20 min 70°C Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9712. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 43 (oz./in) 90° Peel Strength Copper 20 min 70°C Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9712. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 53 (oz./in) 90° Peel Strength Stainless Steel 1,440 min 70°C Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9712. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 43 (oz./in) 90° Peel Strength Aluminum 1,440 min 70°C Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9712. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 55 (oz./in) 90° Peel Strength Copper 1,440 min 70°C Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9712. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
High Temperature Resistance Test Methods
High Temperature Resistance Test Method
121°C Operating Temperature, Long Term
70°C Operating Temperature, Short Term Exposure