3M 9713

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Description for 3M 9713

An isotropically conductive pressure sensitive tape. It conducts electricity through the thickness (Z-axis) and in the plane of the adhesive (X, Y planes) and is ideal for EMI/RFI shield and EMI/RFI gasket attachment to metal surfaces.

*See Terms of Use Below

Application Type	Bond, EMI/RFI shield, EMI/RFI shield
1 Part or 2 Part	1 Part
Material Form	Tape
Substrate	Aluminum, Copper, EMI/RFI gasket attachment to metal surfaces, PVC, Stainless Steel, Metal surfaces, PVC laminates
Industry	Electronic Devices, Electrical Devices, Attach conductive fabric/foam core EMI gaskets to electronic cabinetry
Manufacturer	3M
Chemistry	Filled Acrylic
Cure Method	Pressure Sensitive
High Temperature Resistance (°C)	121, 70
Other Resistance	Low electrical resistance
Key Specifications	Complies with the requirements of EU Directive 2002/95/EC, Complies with the requirements of EU Directive 2005/618/EC

Best Practices for 3M 9713

*See Terms of Use Below

Surface Preparation

To obtain maximum adhesion, the bonding surfaces must be clean and dry. Isopropyl alcohol is recommended as a cleaning solvent.

Electrical performance is dependent upon the nature of the metal and its surface. Most metal surfaces give enhanced electrical performance with tape 9713 when the surface has been lightly abraded. Scotch-Brite pads are recommended for preparing the metal surface.

The surfaces should be cleaned again before applying a new piece of tape 9713. The force required to separate the parts and/or remove the adhesive can be reduced by softening the adhesive by heating to 158°F -212°F (70°C - 100°C) or using solvents such as acetone.

Note: Carefully read and follow the manufacturer's precautions and directions for use when handling cleaning solvents.
Application

Bond strength is dependent upon the amount of adhesive-to-surface contact developed. This wetted area can be increased by applying tape 9713 firmly with a roller or finger pressure to exclude air entrapment. Adhesion is optimized when the substrates are flat or conformable substrates. Adhesion increases after application, up to 24 hours later, due to increased wetting by the tape.

Tape application below 50°F (10°C) is not recommended because the adhesive will be too firm to wet the substrates, resulting in low adhesion. Warming the substrates to 100°F (38°C) facilitates adhesion. Once properly applied, low temperature holding power is generally satisfactory.
Removal

Tape 9713 can be removed by separating the parts using torque for rigid parts or peel for flexible ones. Remove the adhesive by pulling off as much as possible by hand. Residual adhesive may be removed by rubbing with your finger or by application of 3M™Packaging Tape over the residual adhesive followed by removal of the packaging tape.

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Technical Data

Overview

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Specifications

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Best Practices

*See Terms of Use Below
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Comparable Materials

*See Terms of Use Below
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Peel Strength Test Methods

Peel Strength	Type	Substrate	Test Time	Test Temperature	Test Method
> 30 (oz/in)	90° Peel Strength	Stainless Steel	15 min	22°C	Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9713. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 20 (oz/in)	90° Peel Strength	Aluminum	15 min	22°C	Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9713. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 20 (oz/in)	90° Peel Strength	Copper	15 min	22°C	Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9713. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 45 (oz/in)	90° Peel Strength	Stainless Steel	60 min	22°C	Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9713. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 35 (oz/in)	90° Peel Strength	Aluminum	60 min	22°C	Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9713. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 40 (oz/in)	90° Peel Strength	Copper	60 min	22°C	Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9713. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 50 (oz/in)	90° Peel Strength	Stainless Steel	1,440 min 24 (hr.)24 (hr)24 (hr)	22°C	Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9713. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 40 (oz/in)	90° Peel Strength	Aluminum	1,440 min	22°C	Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9713. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 45 (oz/in)	90° Peel Strength	Copper	1,440 min	22°C	Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9713. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 50 (oz/in)	90° Peel Strength	Stainless Steel	60 min	70°C	Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9713. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 40 (oz/in)	90° Peel Strength	Aluminum	60 min	70°C	Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9713. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 40 (oz/in)	90° Peel Strength	Copper	60 min	70°C	Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9713. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 55 (oz/in)	90° Peel Strength	Stainless Steel	1,440 min	70°C	Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9713. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 55 (oz/in)	90° Peel Strength	Aluminum	1,440 min	70°C	Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9713. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 60 (oz/in)	90° Peel Strength	Copper	1,440 min	70°C	Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9713. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.

High Temperature Resistance Test Methods

High Temperature Resistance	Test Method
121°C	Short Term Exposure, Operative Temperature
70°C	Long Term, Operative Temperature

Outgassing Test Methods

Outgassing	Test Method
1.60%	Totla Mass Loss (TML), ASTM E-595
0.03%	Collected Volatile Condensed Materials (CVCM), ASTM E-595
0.36%	Water Vapor Recovered (WVR), ASTM E-595

3M 9713

Description for 3M 9713

Best Practices for 3M 9713

Surface Preparation

Application