• Description for 3M 9713

    An isotropically conductive pressure sensitive tape. It conducts electricity through the thickness (Z-axis) and in the plane of the adhesive (X, Y planes) and is ideal for EMI/RFI shield and EMI/RFI gasket attachment to metal surfaces.

    *See Terms of Use Below

    Application Type Bond, EMI/RFI shield, EMI/RFI shield
    1 Part or 2 Part 1 Part
    Material Form Tape
    Substrate Aluminum, Copper, EMI/RFI gasket attachment to metal surfaces, PVC, Stainless Steel, Metal surfaces, PVC laminates
    Industry Electronic Devices, Electrical Devices, Attach conductive fabric/foam core EMI gaskets to electronic cabinetry
    Manufacturer 3M
    Chemistry Filled Acrylic
    Cure Method Pressure Sensitive
    High Temperature Resistance (°C) 121, 70
    Other Resistance Low electrical resistance
    Key Specifications Complies with the requirements of EU Directive 2002/95/EC, Complies with the requirements of EU Directive 2005/618/EC
  • Technical Data

    Overview
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    Specifications
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  • Best Practices

    *See Terms of Use Below

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Peel Strength Test Methods
Peel Strength Type Substrate Test Time Test Temperature Test Method
> 30 (oz/in) 90° Peel Strength Stainless Steel 15 min 22°C Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9713. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 20 (oz/in) 90° Peel Strength Aluminum 15 min 22°C Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9713. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 20 (oz/in) 90° Peel Strength Copper 15 min 22°C Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9713. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 45 (oz/in) 90° Peel Strength Stainless Steel 60 min 22°C Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9713. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 35 (oz/in) 90° Peel Strength Aluminum 60 min 22°C Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9713. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 40 (oz/in) 90° Peel Strength Copper 60 min 22°C Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9713. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 50 (oz/in) 90° Peel Strength Stainless Steel 1,440 min 24 (hr.)24 (hr)24 (hr) 22°C Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9713. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 40 (oz/in) 90° Peel Strength Aluminum 1,440 min 22°C Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9713. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 45 (oz/in) 90° Peel Strength Copper 1,440 min 22°C Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9713. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 50 (oz/in) 90° Peel Strength Stainless Steel 60 min 70°C Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9713. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 40 (oz/in) 90° Peel Strength Aluminum 60 min 70°C Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9713. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 40 (oz/in) 90° Peel Strength Copper 60 min 70°C Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9713. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 55 (oz/in) 90° Peel Strength Stainless Steel 1,440 min 70°C Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9713. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 55 (oz/in) 90° Peel Strength Aluminum 1,440 min 70°C Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9713. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 60 (oz/in) 90° Peel Strength Copper 1,440 min 70°C Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9713. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
High Temperature Resistance Test Methods
High Temperature Resistance Test Method
121°C Short Term Exposure, Operative Temperature
70°C Long Term, Operative Temperature
Outgassing Test Methods
Outgassing Test Method
1.60% Totla Mass Loss (TML), ASTM E-595
0.03% Collected Volatile Condensed Materials (CVCM), ASTM E-595
0.36% Water Vapor Recovered (WVR), ASTM E-595