3M 9713 Datasheet 3M 9713

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  • Description for 3M 9713

    An isotropically conductive pressure sensitive tape. It conducts electricity through the thickness (Z-axis) and in the plane of the adhesive (X, Y planes) and is ideal for EMI/RFI shield and EMI/RFI gasket attachment to metal surfaces.

    *See Terms of Use Below

    Application Type Bond, EMI/RFI shield, EMI/RFI shield
    1 Part or 2 Part 1-Part
    Material Form Tape
    Substrate Aluminum, Copper, EMI/RFI gasket attachment to metal surfaces, PVC, Stainless Steel, Foam, Metal surfaces, PVC laminates
    Industry Electronic Devices, Electrical Devices, Attach conductive fabric/foam core EMI gaskets to electronic cabinetry
    Manufacturer 3M
    Chemistry Filled Acrylic
    Cure Method Pressure Sensitive, Heat
    Total Thickness (mm) 0.190
    Double Sided Double-sided
    High Temperature Resistance (°C) 121, 70
    Other Resistance Low electrical resistance
    Key Specifications Complies with the requirements of EU Directive 2002/95/EC, Complies with the requirements of EU Directive 2005/618/EC

  • Technical Data for 3M 9713

    *See Terms of Use Below

    Overview
    • Application Type
      • EMI Shielding - EMI/RFI shield
      • RFI/RMI Shielding - EMI/RFI shield
      • Adhesive - Bond
    • 1 Part or 2 Part
      • 1-Part
    • Material Form
      • Tape
    • Substrate
    • Industry
      • Electronics - Electronic Devices, Electrical Devices, Attach conductive fabric/foam core EMI gaskets to electronic cabinetry
    • Chemistry
    • Application Method
      • Dispenser - Finger pressure
      • Roll - Roller
      • Contact
    • Cure Method
      • Pressure Sensitive (min) - Pressure Sensitive
      • Heat
    • Key Specifications
      • RoHS (Restriction of Hazardous Substances) - Complies with the requirements of EU Directive 2002/95/EC, Complies with the requirements of EU Directive 2005/618/EC
    Specifications
    Bond Strength
    General Bond Strength (psi) Good
    Peel Strength (piw) > 30 (oz/in), > 20 (oz/in), > 20 (oz/in), > 45 (oz/in), > 35 (oz/in), > 40 (oz/in), > 50 (oz/in), > 40 (oz/in), > 45 (oz/in), > 50 (oz/in), > 40 (oz/in), > 40 (oz/in), > 55 (oz/in), > 55 (oz/in), > 60 (oz/in) Test Method
    Tape Properties
    Total Thickness (mm) 0.190
    Double Sided Double-sided
    Material Resistance
    High Temperature Resistance (°C) 121, 70 Test Method
    Other Resistance Low electrical resistance
    Conductivity
    Filler Conductive Fibers
    Electrical Conductivity (mhos/cm) Electrically conductivity
    Other Properties
    Outgassing 1.60%, 0.03%, 0.36% Test Method
    Business Information
    Shelf Life Details Shelf Life of Tape in Roll Form:24 months from date of manufacture when stored in original cartons at 70°F (21°C) and 50% relative humidity.
    Shelf Life Temperature (°F) 70
    Shelf Life Type From date of manufacature
    Shelf Life (mon) 24

  • Best Practices for 3M 9713

    *See Terms of Use Below

    1. Surface Preparation

      To obtain maximum adhesion, the bonding surfaces must be clean and dry. Isopropyl alcohol is recommended as a cleaning solvent.

      Electrical performance is dependent upon the nature of the metal and its surface. Most metal surfaces give enhanced electrical performance with tape 9713 when the surface has been lightly abraded. Scotch-Brite pads are recommended for preparing the metal surface.

      The surfaces should be cleaned again before applying a new piece of tape 9713. The force required to separate the parts and/or remove the adhesive can be reduced by softening the adhesive by heating to 158°F -212°F (70°C - 100°C) or using solvents such as acetone.

      Note: Carefully read and follow the manufacturer's precautions and directions for use when handling cleaning solvents.

    2. Application

      Bond strength is dependent upon the amount of adhesive-to-surface contact developed. This wetted area can be increased by applying tape 9713 firmly with a roller or finger pressure to exclude air entrapment. Adhesion is optimized when the substrates are flat or conformable substrates. Adhesion increases after application, up to 24 hours later, due to increased wetting by the tape.

      Tape application below 50°F (10°C) is not recommended because the adhesive will be too firm to wet the substrates, resulting in low adhesion. Warming the substrates to 100°F (38°C) facilitates adhesion. Once properly applied, low temperature holding power is generally satisfactory.

    3. Removal

      Tape 9713 can be removed by separating the parts using torque for rigid parts or peel for flexible ones. Remove the adhesive by pulling off as much as possible by hand. Residual adhesive may be removed by rubbing with your finger or by application of 3M™Packaging Tape over the residual adhesive followed by removal of the packaging tape.

  • Comparable Materials for 3M 9713

    *See Terms of Use Below

    Spec Engine® Results

    • 3M
      9703(3M)

      Electrically Conductive Adhesive • Pressure sensitive adhesive • electrically conductive and offers good adhesion to common PCB substrates such as copper, gold, FR-4 epoxy, DuPont™ Kapton™ polyimide and polyester films •

    • 3M
      9712(3M)

      An isotropically conductive pressure sensitive tape. It conducts electricity through the thickness (Z-axis) and in the plane of the adhesive (X, Y planes) and is ideal for EMI/RFI shield and EMI/RFI gasket attachment to metal surfaces.

    • 3M
      9725(3M)

      An isotropically electrical conductive tape. It consists of conductive acrylic pressure sensitive adhesive loaded with conductive nonwoven.

    • Compare All
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Peel Strength Test Methods
Peel Strength Type Substrate Test Time Test Temperature Test Method
> 30 (oz/in) 90° Peel Strength Stainless Steel 15 min 22°C Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9713. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 20 (oz/in) 90° Peel Strength Aluminum 15 min 22°C Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9713. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 20 (oz/in) 90° Peel Strength Copper 15 min 22°C Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9713. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 45 (oz/in) 90° Peel Strength Stainless Steel 60 min 22°C Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9713. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 35 (oz/in) 90° Peel Strength Aluminum 60 min 22°C Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9713. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 40 (oz/in) 90° Peel Strength Copper 60 min 22°C Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9713. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 50 (oz/in) 90° Peel Strength Stainless Steel 1,440 min 24 (hr.)24 (hr)24 (hr) 22°C Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9713. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 40 (oz/in) 90° Peel Strength Aluminum 1,440 min 22°C Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9713. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 45 (oz/in) 90° Peel Strength Copper 1,440 min 22°C Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9713. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 50 (oz/in) 90° Peel Strength Stainless Steel 60 min 70°C Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9713. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 40 (oz/in) 90° Peel Strength Aluminum 60 min 70°C Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9713. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 40 (oz/in) 90° Peel Strength Copper 60 min 70°C Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9713. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 55 (oz/in) 90° Peel Strength Stainless Steel 1,440 min 70°C Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9713. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 55 (oz/in) 90° Peel Strength Aluminum 1,440 min 70°C Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9713. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
> 60 (oz/in) 90° Peel Strength Copper 1,440 min 70°C Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9713. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature.
High Temperature Resistance Test Methods
High Temperature Resistance Test Method
121°C Short Term Exposure, Operative Temperature
70°C Long Term, Operative Temperature
Outgassing Test Methods
Outgassing Test Method
1.60% Totla Mass Loss (TML), ASTM E-595
0.03% Collected Volatile Condensed Materials (CVCM), ASTM E-595
0.36% Water Vapor Recovered (WVR), ASTM E-595