

-
Description for 3M 9713
An isotropically conductive pressure sensitive tape. It conducts electricity through the thickness (Z-axis) and in the plane of the adhesive (X, Y planes) and is ideal for EMI/RFI shield and EMI/RFI gasket attachment to metal surfaces.Application Type Bond, EMI/RFI shield, EMI/RFI shield 1 Part or 2 Part 1-Part Material Form Tape Substrate Aluminum, Copper, EMI/RFI gasket attachment to metal surfaces, PVC, Stainless Steel, Foam, Metal surfaces, PVC laminates Industry Electronic Devices, Electrical Devices, Attach conductive fabric/foam core EMI gaskets to electronic cabinetry Manufacturer 3M Chemistry Filled Acrylic Cure Method Pressure Sensitive, Heat Total Thickness (mm) 0.190 Double Sided Double-sided High Temperature Resistance (°C) 121, 70 Other Resistance Low electrical resistance Key Specifications Complies with the requirements of EU Directive 2002/95/EC, Complies with the requirements of EU Directive 2005/618/EC -
Technical Data for 3M 9713
Overview
-
Application Type
- EMI Shielding - EMI/RFI shield
- RFI/RMI Shielding - EMI/RFI shield
- Adhesive - Bond
-
1 Part or 2 Part
- 1-Part
-
Material Form
- Tape
-
Substrate
- Foam
- Metal - EMI/RFI gasket attachment to metal surfaces, Metal surfaces
- Aluminum
- Copper
- Polyvinyl chloride (PVC) - PVC, PVC laminates
- Stainless Steel
- Other - Fiber
-
Industry
- Electronics - Electronic Devices, Electrical Devices, Attach conductive fabric/foam core EMI gaskets to electronic cabinetry
-
Chemistry
- Acrylic - Filled Acrylic
-
Application Method
- Dispenser - Finger pressure
- Roll - Roller
- Contact
-
Cure Method
- Pressure Sensitive (min) - Pressure Sensitive
- Heat
-
Key Specifications
- RoHS (Restriction of Hazardous Substances) - Complies with the requirements of EU Directive 2002/95/EC, Complies with the requirements of EU Directive 2005/618/EC
Specifications
Bond Strength
General Bond Strength (psi) Good Peel Strength (piw) > 30 (oz/in), > 20 (oz/in), > 20 (oz/in), > 45 (oz/in), > 35 (oz/in), > 40 (oz/in), > 50 (oz/in), > 40 (oz/in), > 45 (oz/in), > 50 (oz/in), > 40 (oz/in), > 40 (oz/in), > 55 (oz/in), > 55 (oz/in), > 60 (oz/in) Test Method Tape Properties
Total Thickness (mm) 0.190 Double Sided Double-sided Material Resistance
High Temperature Resistance (°C) 121, 70 Test Method Other Resistance Low electrical resistance Conductivity
Filler Conductive Fibers Electrical Conductivity (mhos/cm) Electrically conductivity Other Properties
Outgassing 1.60%, 0.03%, 0.36% Test Method Business Information
Shelf Life Details Shelf Life of Tape in Roll Form:24 months from date of manufacture when stored in original cartons at 70°F (21°C) and 50% relative humidity. Shelf Life Temperature (°F) 70 Shelf Life Type From date of manufacature Shelf Life (mon) 24 -
-
Best Practices for 3M 9713
-
Surface Preparation
To obtain maximum adhesion, the bonding surfaces must be clean and dry. Isopropyl alcohol is recommended as a cleaning solvent.
Electrical performance is dependent upon the nature of the metal and its surface. Most metal surfaces give enhanced electrical performance with tape 9713 when the surface has been lightly abraded. Scotch-Brite pads are recommended for preparing the metal surface.
The surfaces should be cleaned again before applying a new piece of tape 9713. The force required to separate the parts and/or remove the adhesive can be reduced by softening the adhesive by heating to 158°F -212°F (70°C - 100°C) or using solvents such as acetone.
Note: Carefully read and follow the manufacturer's precautions and directions for use when handling cleaning solvents.
-
Application
Bond strength is dependent upon the amount of adhesive-to-surface contact developed. This wetted area can be increased by applying tape 9713 firmly with a roller or finger pressure to exclude air entrapment. Adhesion is optimized when the substrates are flat or conformable substrates. Adhesion increases after application, up to 24 hours later, due to increased wetting by the tape.
Tape application below 50°F (10°C) is not recommended because the adhesive will be too firm to wet the substrates, resulting in low adhesion. Warming the substrates to 100°F (38°C) facilitates adhesion. Once properly applied, low temperature holding power is generally satisfactory.
-
Removal
Tape 9713 can be removed by separating the parts using torque for rigid parts or peel for flexible ones. Remove the adhesive by pulling off as much as possible by hand. Residual adhesive may be removed by rubbing with your finger or by application of 3M™Packaging Tape over the residual adhesive followed by removal of the packaging tape.
-
-
Comparable Materials for 3M 9713
Spec Engine® Results
Popular Articles
Testing the effectiveness of surface treatments
Read ArticlePlastic Bonding with Adhesives - Considerations Q&A
Read ArticleInfographic: ENSURING A STRONG BOND - 6 Basic Methods of Surface Preparation
Read ArticleWhat Projects Require Custom Adhesive Formulations and Why?
Read ArticleSponsored Articles
Unique Advantages of Contact Adhesives
Read ArticleUsing LOCTITE® 454™ is a Valid Option for Engineers Working with a Wide Variety of Materials
Read ArticleSylgard 184 by DOW is the Top Choice for a Transparent, Silicone Encapsulant. Read Why:
Read ArticleCase Study: Creating reliable, corrosion-free bonds with LORD® 406 acrylic adhesive
Read ArticleFeatured Ads

Peel Strength Test Methods
Peel Strength | Type | Substrate | Test Time | Test Temperature | Test Method |
---|---|---|---|---|---|
> 30 (oz/in) | 90° Peel Strength | Stainless Steel | 15 min | 22°C | Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9713. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature. |
> 20 (oz/in) | 90° Peel Strength | Aluminum | 15 min | 22°C | Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9713. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature. |
> 20 (oz/in) | 90° Peel Strength | Copper | 15 min | 22°C | Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9713. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature. |
> 45 (oz/in) | 90° Peel Strength | Stainless Steel | 60 min | 22°C | Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9713. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature. |
> 35 (oz/in) | 90° Peel Strength | Aluminum | 60 min | 22°C | Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9713. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature. |
> 40 (oz/in) | 90° Peel Strength | Copper | 60 min | 22°C | Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9713. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature. |
> 50 (oz/in) | 90° Peel Strength | Stainless Steel | 1,440 min 24 (hr.)24 (hr)24 (hr) | 22°C | Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9713. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature. |
> 40 (oz/in) | 90° Peel Strength | Aluminum | 1,440 min | 22°C | Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9713. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature. |
> 45 (oz/in) | 90° Peel Strength | Copper | 1,440 min | 22°C | Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9713. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature. |
> 50 (oz/in) | 90° Peel Strength | Stainless Steel | 60 min | 70°C | Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9713. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature. |
> 40 (oz/in) | 90° Peel Strength | Aluminum | 60 min | 70°C | Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9713. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature. |
> 40 (oz/in) | 90° Peel Strength | Copper | 60 min | 70°C | Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9713. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature. |
> 55 (oz/in) | 90° Peel Strength | Stainless Steel | 1,440 min | 70°C | Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9713. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature. |
> 55 (oz/in) | 90° Peel Strength | Aluminum | 1,440 min | 70°C | Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9713. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature. |
> 60 (oz/in) | 90° Peel Strength | Copper | 1,440 min | 70°C | Based upon a 90 degree peel sample, following ASTM D3330 test method. Aluminum foil (2 mil thick) was used as the flexible backing to the tape 9713. The substrates listed are all rigid metal plates. The 158°F (70°C) aged peel samples are indicative of the typical long term adhesion build expected at room temperature. |
High Temperature Resistance Test Methods
High Temperature Resistance | Test Method |
---|---|
121°C | Short Term Exposure, Operative Temperature |
70°C | Long Term, Operative Temperature |
Outgassing Test Methods
Outgassing | Test Method |
---|---|
1.60% | Totla Mass Loss (TML), ASTM E-595 |
0.03% | Collected Volatile Condensed Materials (CVCM), ASTM E-595 |
0.36% | Water Vapor Recovered (WVR), ASTM E-595 |