• Description for 3M 976

    0.002 in. (0.05 mm) thick high-tack adhesive transfer tape. This tape is reverse wound on 1-inch diameter cores for use in Scotch ATG dispensers.

    *See Terms of Use Below

    Application Type Bond
    1 Part or 2 Part 1 Part
    Material Form Transfer tape
    Substrate Plastic, Steel
    Industry Assemble point-of-purchase displays
    Manufacturer 3M
    Chemistry Acrylic
    Cure Method Pressure Sensitive
    Color Clear
    Relative Solvent Resistance Chemical Resistance: Medium
    High Temperature Resistance (°C) 82, 121
  • Technical Data for 3M 976

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 1 Part
    • Material Form
      • Tape - Transfer tape
    • Substrate
    • Industry
      • Displays - Assemble point-of-purchase displays
      • Other - Folders and boxes, Attach fabric swatches in sample boods
    • Chemistry
    • Application Method
      • Contact
    • Cure Method
      • Pressure Sensitive (min) - Pressure Sensitive
    • Color
      • Clear / Transparent - Clear
    Specifications
    Cure Specs
    Application Temperature (°F) 70 to 100
    Bond Strength
    General Bond Strength (psi) High, 60 (oz./in.) Test Method
    Shear Strength (psi) Good
    Material Resistance
    High Temperature Resistance (°C) 82, 121
    Business Information
    Shelf Life Details Shelf Life of Tape in Roll Form: 24 months from the manufacturing date when stored in original cartons at 70°F (21°C) and 50% relative humidity.
    Shelf Life Temperature (°F) 70
    Shelf Life Type From date of manufacture
    Shelf Life (mon) 24
  • Best Practices for 3M 976

    *See Terms of Use Below

    1. Surface Preparation

      To obtain optimum adhesion, the bonding surfaces must be clean, dry and well unified. Typical surface cleaning solvents are isopropyl alcohol and water (rubbing alcohol) or heptane. Note

      Be sure to follow the manufacturer's precautions and directions for use when using solvents.

    2. Application

      Bond strength is dependent upon the amount of adhesive-to-surface contact developed. Firm application pressure helps develop better adhesive contact and improve bond strength.

      Initial tape application to surfaces at temperatures below 50°F (10°C) is not recommended because the adhesive becomes too firm to adhere readily. However, once properly applied, low temperature holding is generally satisfactory.

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General Bond Strength Test Methods
General Bond Strength Substrate Test Method
High
60 (oz./in.) Steel ASTM D3330