| Application Type | Bond |
|---|---|
| 1 Part or 2 Part | 1 Part |
| Material Form | Double-Coated Tape |
| Manufacturer | 3M |
| Chemistry | Rubber |
| Cure Method | Pressure Sensitive |
| Chemical Resistance | Excellent |
| High Temperature Resistance (°C) | 121, 177, 66 |
To obtain optimum adhesion, all substrate surfaces must be clean and dry. A typical cleaning solvent is an isopropyl alcohol/water solution with a mixture ratio of 50:50 (rubbing alcohol). Be sure to follow solvent manufacturer’s precautions and directions for use when using solvents.
Ideal tape application temperature range is 70°F to 100°F (21°C to 38°C). Initial tape application to surfaces at temperatures below 50°F (10°C) is not recommended because the adhesive becomes too firm to adhere readily. However, once properly applied, low temperature holding is generally satisfactory.
Bond strength is dependent upon the amount of adhesive-to-surface contact developed. Firm application pressure develops better adhesive contact and helps improve bond strength. The bond strength will increase as the adhesive flows onto the surface. At room temperature approximately 50% of the ultimate strength will be achieved after 20 minutes, 90% after 24 hours and 100% after 72 hours. In some cases ultimate bond strength can be achieved more quickly by exposure of the bond to elevated temperatures (e.g. 150°F or 66°C for one hour). This provides better adhesive wet-out onto the surface.
Please also refer to the technical bulletin of “Lamination Techniques for Converters for Laminating Adhesives” for more useful information on lamination techniques.
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