3M 9882

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Description for 3M 9882

Designed to provide a preferential heat-transfer path between heat-generating components and heat sinks or other cooling devices (e.g., fans, heat spreaders or heat pipes).

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Application Type	Bond, Lamination
1 Part or 2 Part	1 Part
Material Form	Transfer tape
Substrate	Ceramic
Industry	Other cooling devices, CPU, Heat pipes, Heat spreaders, Heat sinks
Manufacturer	3M
Chemistry	specialized acrylic
Cure Method	Pressure Sensitive
Color	Gray
Key Specifications	UL recognized

Best Practices for 3M 9882

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Technical Data for 3M 9882

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Overview

Application Type
- Laminate - Lamination
- Adhesive - Bond
1 Part or 2 Part
- 1 Part or 2 Part - 1 Part
Material Form
- Tape - Transfer tape
Substrate
- Ceramic
- Other - Rigid to rigid, Flexible to rigid, Flexible to flexible
Industry
- Electronics - Other cooling devices, Heat pipes, Heat spreaders, Heat sinks
- Storage & Graphics - CPU
- Appliances - Fans
- Other - Die cutting
Chemistry
- Acrylic - specialized acrylic
Application Method
- Roll - Rubber nip rollers, heated steel rollers
- Contact
- Other - squeegee, rubber roller or finger pressure to help reduce the potential for air entrapment under the tape during its application
Cure Method
- Pressure Sensitive (min) - Pressure Sensitive
Color
- Gray
Key Specifications
- UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association) - UL recognized

Specifications

Conductivity

Filler	Ceramic
Dielectric Strength (V/mil)	750	Test Method
Dielectric Constant	6.00	Test Method
Thermal Conductivity (W/m°K)	Good, 0.60	Test Method

Other Properties

Coefficient of Thermal Expansion (CTE)	400 (ppm/°C), 250 (ppm/°C)	Test Method

Best Practices for 3M 9882

*See Terms of Use Below
1. Surface Preparation
  
  Substrate surfaces should be clean and dry prior to tape application. Isopropyl alcohol (isopropanol) applied with a lint-free wipe or swab should be adequate for removing surface contamination such as dust or finger prints. Do not use “denatured alcohol” or glass cleaners, which often contain oily components. Allow the surface to dry for several minutes before applying the tape. More aggressive solvents (such as acetone, methyl ethyl ketone [MEK] or toluene) may be required to remove heavier contamination (grease, machine oils, solder flux, etc.) but should be followed by a final isopropanol wipe as described above.
  
  Be sure to read and follow the manufacturer's precautions and directions when using primers and solvents.
  
  Primers may be employed to increase adhesion to low surface energy substrates (eg. plastic packages).
2. Application
  
  Apply the tape to one substrate at a modest angle with the use of a squeegee, rubber roller or finger pressure to help reduce the potential for air entrapment under the tape during its application. The liner can be removed after positioning the tape onto the first substrate.
  
  Assemble the part by applying compression to the substrates to ensure a good wetting of the substrate surfaces with the tape. Proper application of pressure (amount of pressure, time applied, temperature applied) will depend upon design of the parts. Rigid substrates are more difficult to bond without air entrapment as most rigid parts are not flat. Use of a thicker tape may result in increased wetting of rigid substrates. Flexible substrates can be bonded to rigid or flexible parts with much less concern about air entrapment because one of the flexible substrate can conform to the other substrates.
  
  For rigid to rigid bonding, a twisting motion during assembly of the substrates will improve wetting. This should be a back and forth twisting motion during the application of compression.
  
  For flexible to rigid or flexible to flexible bonding, a roll lamination system may be employed to apply the flexible substrate down to the rigid (or other flexible) substrate. Rubber nip rollers, heated steel rollers, and other methods can be employed to bond in a continuous manner.
  
  Heat can be employed to increase wetting percentage and wetting rate of the substrates and to build room temperature bond strength.
  
  For best product performance, it is important to use pressure and time conditions to achieve as much wetting as possible.
3. Removal
  
  Rework requires separation of the two substrates. Separation can be accomplished by any practical means: prying, torquing or peeling. The tape will be destroyed upon separation and must be replaced. The surfaces should be re-cleaned according to the recommendations in this data page.
  
  Heating up the substrates can reduce the adhesion level and make removal easier.
  
  Part separation can be aided by immersion in warm water. This should eventually reduce the adhesion and make prying, torquing or peeling apart the substrates easier.
Comparable Materials for 3M 9882

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Spec Engine^® Results
- 4950(3M)
  • White, closed-cell acrylic foam carrier • used on high surface energy plastic substrates • Apply as low as 50°F (10°C) • UL 746C
- 9885(3M)
  Designed to provide a preferential heat-transfer path between heat-generating components and heat sinks or other cooling devices (e.g., fans, heat spreaders or heat pipes).
- 8805(3M)
  Designed to provide a preferential heat-transfer path between heat-generating components and heat sinks or other cooling devices (e.g., fans, heat spreaders or heat pipes).
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