3M 9882

Surface Preparation

Substrate surfaces should be clean and dry prior to tape application. Isopropyl alcohol (isopropanol) applied with a lint-free wipe or swab should be adequate for removing surface contamination such as dust or finger prints. Do not use “denatured alcohol” or glass cleaners, which often contain oily components. Allow the surface to dry for several minutes before applying the tape. More aggressive solvents (such as acetone, methyl ethyl ketone [MEK] or toluene) may be required to remove heavier contamination (grease, machine oils, solder flux, etc.) but should be followed by a final isopropanol wipe as described above.

Be sure to read and follow the manufacturer's precautions and directions when using primers and solvents.

Primers may be employed to increase adhesion to low surface energy substrates (eg. plastic packages).

Application

Apply the tape to one substrate at a modest angle with the use of a squeegee, rubber roller or finger pressure to help reduce the potential for air entrapment under the tape during its application. The liner can be removed after positioning the tape onto the first substrate.

Assemble the part by applying compression to the substrates to ensure a good wetting of the substrate surfaces with the tape. Proper application of pressure (amount of pressure, time applied, temperature applied) will depend upon design of the parts. Rigid substrates are more difficult to bond without air entrapment as most rigid parts are not flat. Use of a thicker tape may result in increased wetting of rigid substrates. Flexible substrates can be bonded to rigid or flexible parts with much less concern about air entrapment because one of the flexible substrate can conform to the other substrates.

For rigid to rigid bonding, a twisting motion during assembly of the substrates will improve wetting. This should be a back and forth twisting motion during the application of compression.

For flexible to rigid or flexible to flexible bonding, a roll lamination system may be employed to apply the flexible substrate down to the rigid (or other flexible) substrate. Rubber nip rollers, heated steel rollers, and other methods can be employed to bond in a continuous manner.

Heat can be employed to increase wetting percentage and wetting rate of the substrates and to build room temperature bond strength.

For best product performance, it is important to use pressure and time conditions to achieve as much wetting as possible.

Removal

Rework requires separation of the two substrates. Separation can be accomplished by any practical means: prying, torquing or peeling. The tape will be destroyed upon separation and must be replaced. The surfaces should be re-cleaned according to the recommendations in this data page.

Heating up the substrates can reduce the adhesion level and make removal easier.

Part separation can be aided by immersion in warm water. This should eventually reduce the adhesion and make prying, torquing or peeling apart the substrates easier.