• Description for 3M 9882

    Designed to provide a preferential heat-transfer path between heat-generating components and heat sinks or other cooling devices (e.g., fans, heat spreaders or heat pipes).

    *See Terms of Use Below

    Application Type Bond, Lamination
    1 Part or 2 Part 1-Part
    Material Form Transfer tape
    Substrate Ceramic
    Industry Other cooling devices, CPU, Heat pipes, Heat spreaders, Heat sinks
    Manufacturer 3M
    Chemistry specialized acrylic
    Cure Method Pressure Sensitive
    Color Gray
    Key Specifications UL recognized
  • Technical Data for 3M 9882

    • Application Type
    • 1 Part or 2 Part
      • 1-Part
    • Material Form
      • Tape - Transfer tape
    • Substrate
      • Ceramic
      • Other - Rigid to rigid, Flexible to rigid, Flexible to flexible
    • Industry
      • Storage & Graphics - CPU
      • Electronics - Other cooling devices, Heat pipes, Heat spreaders, Heat sinks
      • Appliances - Fans
      • Other - Die cutting
    • Chemistry
    • Application Method
      • Roll - Rubber nip rollers, heated steel rollers
      • Contact
      • Other - squeegee, rubber roller or finger pressure to help reduce the potential for air entrapment under the tape during its application
    • Cure Method
      • Pressure Sensitive (min) - Pressure Sensitive
    • Color
      • Gray
    • Key Specifications
      • UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association) - UL recognized
    Filler Ceramic
    Dielectric Strength (V/mil) 750 Test Method
    Dielectric Constant 6.00 Test Method
    Thermal Conductivity (W/m°K) Good, 0.60 Test Method
    Other Properties
    Coefficient of Thermal Expansion (CTE) 400 (ppm/°C), 250 (ppm/°C) Test Method
  • Best Practices for 3M 9882

    *See Terms of Use Below

    1. Surface Preparation

      Substrate surfaces should be clean and dry prior to tape application. Isopropyl alcohol (isopropanol) applied with a lint-free wipe or swab should be adequate for removing surface contamination such as dust or finger prints. Do not use “denatured alcohol” or glass cleaners, which often contain oily components. Allow the surface to dry for several minutes before applying the tape. More aggressive solvents (such as acetone, methyl ethyl ketone [MEK] or toluene) may be required to remove heavier contamination (grease, machine oils, solder flux, etc.) but should be followed by a final isopropanol wipe as described above.

      Be sure to read and follow the manufacturer's precautions and directions when using primers and solvents.

      Primers may be employed to increase adhesion to low surface energy substrates (eg. plastic packages).

    2. Application

      Apply the tape to one substrate at a modest angle with the use of a squeegee, rubber roller or finger pressure to help reduce the potential for air entrapment under the tape during its application. The liner can be removed after positioning the tape onto the first substrate.

      Assemble the part by applying compression to the substrates to ensure a good wetting of the substrate surfaces with the tape. Proper application of pressure (amount of pressure, time applied, temperature applied) will depend upon design of the parts. Rigid substrates are more difficult to bond without air entrapment as most rigid parts are not flat. Use of a thicker tape may result in increased wetting of rigid substrates. Flexible substrates can be bonded to rigid or flexible parts with much less concern about air entrapment because one of the flexible substrate can conform to the other substrates.

      For rigid to rigid bonding, a twisting motion during assembly of the substrates will improve wetting. This should be a back and forth twisting motion during the application of compression.

      For flexible to rigid or flexible to flexible bonding, a roll lamination system may be employed to apply the flexible substrate down to the rigid (or other flexible) substrate. Rubber nip rollers, heated steel rollers, and other methods can be employed to bond in a continuous manner.

      Heat can be employed to increase wetting percentage and wetting rate of the substrates and to build room temperature bond strength.

      For best product performance, it is important to use pressure and time conditions to achieve as much wetting as possible.

    3. Removal

      Rework requires separation of the two substrates. Separation can be accomplished by any practical means: prying, torquing or peeling. The tape will be destroyed upon separation and must be replaced. The surfaces should be re-cleaned according to the recommendations in this data page.

      Heating up the substrates can reduce the adhesion level and make removal easier.

      Part separation can be aided by immersion in warm water. This should eventually reduce the adhesion and make prying, torquing or peeling apart the substrates easier.

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    *See Terms of Use Below

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Top Catalog Pages for 3M 9882

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What level of expertise do you have in specialty chemicals like adhesives, sealants, conformal coatings, etc.?
Dielectric Constant Test Methods
Dielectric Constant Test Method
6.00 ASTM D-150, Dielectric Properties (frequency) , 1 KHz
Dielectric Strength Test Methods
Dielectric Strength Test Method
750 V/mil ASTM D-149
Thermal Conductivity Test Methods
Thermal Conductivity Test Method
0.60 W/m°K ASTM C-177
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Temperature (°C) CTE Test Method
400 (ppm/°C) 23 to 150°C ASTM D-3386
250 (ppm/°C) -55°C ASTM D-3386