Application Type Bond, Lamination 1 Part or 2 Part 1-Part Material Form Transfer tape Substrate Ceramic Industry Other cooling devices, CPU, Heat pipes, Heat spreaders, Heat sinks Manufacturer 3M Chemistry specialized acrylic Cure Method Pressure Sensitive Color Gray Key Specifications UL recognized
Technical Data for 3M 9882
- Laminate - Lamination
- Adhesive - Bond
1 Part or 2 Part
- Tape - Transfer tape
- Other - Rigid to rigid, Flexible to rigid, Flexible to flexible
- Storage & Graphics - CPU
- Electronics - Other cooling devices, Heat pipes, Heat spreaders, Heat sinks
- Appliances - Fans
- Other - Die cutting
- Acrylic - specialized acrylic
- Roll - Rubber nip rollers, heated steel rollers
- Other - squeegee, rubber roller or finger pressure to help reduce the potential for air entrapment under the tape during its application
- Pressure Sensitive (min) - Pressure Sensitive
- UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association) - UL recognized
Filler Ceramic Dielectric Strength (V/mil) 750 Test Method Dielectric Constant 6.00 Test Method Thermal Conductivity (W/m°K) Good, 0.60 Test Method
Coefficient of Thermal Expansion (CTE) 400 (ppm/°C), 250 (ppm/°C) Test Method
Best Practices for 3M 9882
Substrate surfaces should be clean and dry prior to tape application. Isopropyl alcohol (isopropanol) applied with a lint-free wipe or swab should be adequate for removing surface contamination such as dust or finger prints. Do not use “denatured alcohol” or glass cleaners, which often contain oily components. Allow the surface to dry for several minutes before applying the tape. More aggressive solvents (such as acetone, methyl ethyl ketone [MEK] or toluene) may be required to remove heavier contamination (grease, machine oils, solder flux, etc.) but should be followed by a final isopropanol wipe as described above.
Be sure to read and follow the manufacturer's precautions and directions when using primers and solvents.
Primers may be employed to increase adhesion to low surface energy substrates (eg. plastic packages).
Apply the tape to one substrate at a modest angle with the use of a squeegee, rubber roller or finger pressure to help reduce the potential for air entrapment under the tape during its application. The liner can be removed after positioning the tape onto the first substrate.
Assemble the part by applying compression to the substrates to ensure a good wetting of the substrate surfaces with the tape. Proper application of pressure (amount of pressure, time applied, temperature applied) will depend upon design of the parts. Rigid substrates are more difficult to bond without air entrapment as most rigid parts are not flat. Use of a thicker tape may result in increased wetting of rigid substrates. Flexible substrates can be bonded to rigid or flexible parts with much less concern about air entrapment because one of the flexible substrate can conform to the other substrates.
For rigid to rigid bonding, a twisting motion during assembly of the substrates will improve wetting. This should be a back and forth twisting motion during the application of compression.
For flexible to rigid or flexible to flexible bonding, a roll lamination system may be employed to apply the flexible substrate down to the rigid (or other flexible) substrate. Rubber nip rollers, heated steel rollers, and other methods can be employed to bond in a continuous manner.
Heat can be employed to increase wetting percentage and wetting rate of the substrates and to build room temperature bond strength.
For best product performance, it is important to use pressure and time conditions to achieve as much wetting as possible.
Rework requires separation of the two substrates. Separation can be accomplished by any practical means: prying, torquing or peeling. The tape will be destroyed upon separation and must be replaced. The surfaces should be re-cleaned according to the recommendations in this data page.
Heating up the substrates can reduce the adhesion level and make removal easier.
Part separation can be aided by immersion in warm water. This should eventually reduce the adhesion and make prying, torquing or peeling apart the substrates easier.
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Dielectric Constant Test Methods
|Dielectric Constant||Test Method|
|6.00||ASTM D-150, Dielectric Properties (frequency) , 1 KHz|
Dielectric Strength Test Methods
|Dielectric Strength||Test Method|
|750 V/mil||ASTM D-149|
Thermal Conductivity Test Methods
|Thermal Conductivity||Test Method|
|0.60 W/m°K||ASTM C-177|
Coefficient of Thermal Expansion (CTE) Test Methods
|Coefficient of Thermal Expansion (CTE)||CTE Temperature (°C)||CTE Test Method|
|400 (ppm/°C)||23 to 150°C||ASTM D-3386|
|250 (ppm/°C)||-55°C||ASTM D-3386|