

-
Description for 3M 9882
Designed to provide a preferential heat-transfer path between heat-generating components and heat sinks or other cooling devices (e.g., fans, heat spreaders or heat pipes).Application Type Bond, Lamination 1 Part or 2 Part 1-Part Material Form Transfer tape Substrate Ceramic Industry Other cooling devices, CPU, Heat pipes, Heat spreaders, Heat sinks Manufacturer 3M Chemistry specialized acrylic Cure Method Pressure Sensitive Color Gray Key Specifications UL recognized -
Technical Data for 3M 9882
Overview
-
Application Type
- Laminate - Lamination
- Adhesive - Bond
-
1 Part or 2 Part
- 1-Part
-
Material Form
- Tape - Transfer tape
-
Substrate
- Ceramic
- Other - Rigid to rigid, Flexible to rigid, Flexible to flexible
-
Industry
- Storage & Graphics - CPU
- Electronics - Other cooling devices, Heat pipes, Heat spreaders, Heat sinks
- Appliances - Fans
- Other - Die cutting
-
Chemistry
- Acrylic - specialized acrylic
-
Application Method
- Roll - Rubber nip rollers, heated steel rollers
- Contact
- Other - squeegee, rubber roller or finger pressure to help reduce the potential for air entrapment under the tape during its application
-
Cure Method
- Pressure Sensitive (min) - Pressure Sensitive
-
Color
- Gray
-
Key Specifications
- UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association) - UL recognized
Specifications
Conductivity
Filler Ceramic Dielectric Strength (V/mil) 750 Test Method Dielectric Constant 6.00 Test Method Thermal Conductivity (W/m°K) Good, 0.60 Test Method Other Properties
Coefficient of Thermal Expansion (CTE) 400 (ppm/°C), 250 (ppm/°C) Test Method -
-
Best Practices for 3M 9882
-
Surface Preparation
Substrate surfaces should be clean and dry prior to tape application. Isopropyl alcohol (isopropanol) applied with a lint-free wipe or swab should be adequate for removing surface contamination such as dust or finger prints. Do not use “denatured alcohol” or glass cleaners, which often contain oily components. Allow the surface to dry for several minutes before applying the tape. More aggressive solvents (such as acetone, methyl ethyl ketone [MEK] or toluene) may be required to remove heavier contamination (grease, machine oils, solder flux, etc.) but should be followed by a final isopropanol wipe as described above.
Be sure to read and follow the manufacturer's precautions and directions when using primers and solvents.
Primers may be employed to increase adhesion to low surface energy substrates (eg. plastic packages).
-
Application
Apply the tape to one substrate at a modest angle with the use of a squeegee, rubber roller or finger pressure to help reduce the potential for air entrapment under the tape during its application. The liner can be removed after positioning the tape onto the first substrate.
Assemble the part by applying compression to the substrates to ensure a good wetting of the substrate surfaces with the tape. Proper application of pressure (amount of pressure, time applied, temperature applied) will depend upon design of the parts. Rigid substrates are more difficult to bond without air entrapment as most rigid parts are not flat. Use of a thicker tape may result in increased wetting of rigid substrates. Flexible substrates can be bonded to rigid or flexible parts with much less concern about air entrapment because one of the flexible substrate can conform to the other substrates.
For rigid to rigid bonding, a twisting motion during assembly of the substrates will improve wetting. This should be a back and forth twisting motion during the application of compression.
For flexible to rigid or flexible to flexible bonding, a roll lamination system may be employed to apply the flexible substrate down to the rigid (or other flexible) substrate. Rubber nip rollers, heated steel rollers, and other methods can be employed to bond in a continuous manner.
Heat can be employed to increase wetting percentage and wetting rate of the substrates and to build room temperature bond strength.
For best product performance, it is important to use pressure and time conditions to achieve as much wetting as possible.
-
Removal
Rework requires separation of the two substrates. Separation can be accomplished by any practical means: prying, torquing or peeling. The tape will be destroyed upon separation and must be replaced. The surfaces should be re-cleaned according to the recommendations in this data page.
Heating up the substrates can reduce the adhesion level and make removal easier.
Part separation can be aided by immersion in warm water. This should eventually reduce the adhesion and make prying, torquing or peeling apart the substrates easier.
-
-
Comparable Materials for 3M 9882
Spec Engine® Results
Popular Articles
Infographic: ENSURING A STRONG BOND - 6 Basic Methods of Surface Preparation
Read ArticleWhat Projects Require Custom Adhesive Formulations and Why?
Read ArticlePlastic Bonding with Adhesives - Considerations Q&A
Read ArticleTesting the effectiveness of surface treatments
Read ArticleSponsored Articles
Unique Advantages of Contact Adhesives
Read ArticleUsing LOCTITE® 454™ is a Valid Option for Engineers Working with a Wide Variety of Materials
Read ArticleSylgard 184 by DOW is the Top Choice for a Transparent, Silicone Encapsulant. Read Why:
Read ArticleCase Study: Creating reliable, corrosion-free bonds with LORD® 406 acrylic adhesive
Read ArticleFeatured Ads

Dielectric Constant Test Methods
Dielectric Constant | Test Method |
---|---|
6.00 | ASTM D-150, Dielectric Properties (frequency) , 1 KHz |
Dielectric Strength Test Methods
Dielectric Strength | Test Method |
---|---|
750 V/mil | ASTM D-149 |
Thermal Conductivity Test Methods
Thermal Conductivity | Test Method |
---|---|
Good | |
0.60 W/m°K | ASTM C-177 |
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) | CTE Temperature (°C) | CTE Test Method |
---|---|---|
400 (ppm/°C) | 23 to 150°C | ASTM D-3386 |
250 (ppm/°C) | -55°C | ASTM D-3386 |