3M AF111 Datasheet 3M AF111

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  • Description for 3M AF111

    An epoxy, thermoset film adhesive developed for structural bonding of metals and high-strength plastic materials (epoxy and phenolic).

    *See Terms of Use Below

    Chemical Resistance Chemical Resistance: Isopropyl Alcohol, Chemical Resistance: Methyl Ethyl Ketone, Chemical Resistance: Heptane, Chemical Resistance: 3M™ Citrus Base Cleaner
    Application Type Bond
    1 Part or 2 Part 1-Part
    Material Form Film
    Substrate Al (etched), Borosilicate Glass, Metals, PEN Plastic, Polyester Film, Phenolic Board, Stainless Steel, Phenolic Board, Polyimide Film, High-strength plastic materials (epoxy and phenolic), Al (sanded, solvent wiped), Polyetherimide, Stainless Steel (solvent wiped), Al (scour pad abraded, solvent wiped), Ultem®1000, Al (solvent wiped), Etched Aluminum
    Industry Electronics applications
    Manufacturer 3M
    Chemistry Epoxy
    Cure Method Heat
    Cure Temperature (°C) 113, 121, 135, 149, 163, 177, 204
    Cure Time (min) 90, 60, 40, 35, 20, 10, 5.00
    Color Off-white
    Total Thickness (mm) 0.254
    Single Sided Single Sided
    High Temperature Resistance (°C) 121
    Low Temperature Resistance (°C) -55
    Volume Resistivity (O) 4.1e16 (ohm-cm) (10 mil)

  • Technical Data for 3M AF111

    *See Terms of Use Below

    Overview
    • Chemical Resistance
      • Chemical Resistance : Relative Solvent Resistance - Isopropyl Alcohol, Methyl Ethyl Ketone, Heptane, 3M™ Citrus Base Cleaner
    • Application Type
    • 1 Part or 2 Part
      • 1-Part
    • Material Form
      • Film
    • Substrate
      • Glass - Borosilicate Glass
      • Metal - Metals
      • Aluminum - Al (etched), Al (sanded, solvent wiped), Al (scour pad abraded, solvent wiped), Al (solvent wiped), Etched Aluminum
      • Plastic - PEN Plastic, Polyetherimide, Ultem®1000
      • Phenolic - Phenolic Board
      • Polyimide (PI) - Polyimide Film
      • Epoxy - High-strength plastic materials (epoxy and phenolic)
      • Wood - Phenolic Board
      • Polyester - Polyester Film
      • Stainless Steel - Stainless Steel (solvent wiped)
      • Other - CRS (scour pad abraded, solvent wiped), FR-4 (solvent wiped), LCP (solvent wiped), Black E-coat
    • Industry
    • Chemistry
    • Cure Method
      • Heat
    • Color
      • Off-White
    Specifications
    Cure Specs
    Cure Temperature (°C) 113, 121, 135, 149, 163, 177, 204
    Cure Time (min) 90, 60, 40, 35, 20, 10, 5.00
    Work / Pot Time (min) 40,320 Test Method
    Bond Strength
    Structural/Load-Bearing Structural
    Peel Strength (piw) 33, 33, 32, 35, 33, 25, 33, 33, 20, 38, 36, 36, 36, 35, 3, 33, 4, 20, 3, 34, 19, 26, 14, 1 Test Method
    Shear Strength (psi) 5,300, 3,500, 3,250, 3,100, 2,450, 450, 1,150, 300, 1,750, 1,075, 1,150, 1,100, 650, 450, 2,300, 2,600, 1,200, 1,600, 2,400, 2,700, 2,300, 2,700, 2,250 Test Method
    Tensile Strength (psi) 7,200
    Tape Properties
    Total Thickness (mm) 0.254
    Single Sided Single Sided
    Material Resistance
    High Temperature Resistance (°C) 121
    Low Temperature Resistance (°C) -55
    Conductivity
    Dissipation Factor 0.00500, 0.00700, 0.01100 Test Method
    Dielectric Strength (V/mil) 650 Test Method
    Dielectric Constant 4.20, 4.00, 3.90 Test Method
    Volume Resistivity (O) 4.1e16 (ohm-cm) (10 mil) Test Method
    Hardness
    Elongation (%) 10
    Modulus (psi) 150,000
    Other Properties
    Glass Transition Temp (Tg) (°C) 107, 118, 114 Test Method
    Coefficient of Thermal Expansion (CTE) 28e-6 (units/unit/°C), 67e-6 (units/unit/°C) Test Method
    Business Information
    Shelf Life Details Bonding Film AF111 must be stored at or below 40°F (4°C) before use.
    Shelf Life Temperature (°F) 70, 40, 0
    Shelf Life Type From date of shipment
    Shelf Life (mon) 1, 6, 12

  • Best Practices for 3M AF111

    *See Terms of Use Below

    1. Surface Preparation

      A thoroughly cleaned, dry, grease-free surface is essential for maximum performance. Cleaning methods which will produce a break-free water film on metal surfaces are generally satisfactory.

    2. Curing

      The suggested curing condition for Bonding Film AF111 is 60 minutes at 250°F (121°C). The adhesive may be cured either under pressure or in a vacuum bag

      During cure, pressure is required to keep parts in alignment and in intimate contact. A minimum of 20 psi is suggested, but higher psi is acceptable if resultant flow during cure is not excessive.

    3. Clean-Up

      Uncured 3M™ Bonding Film AF111 can be removed using acetone, MEK or 3M™ Citrus Base Cleaner.

      Note: When using solvents, extinguish all ignition sources and follow the manufacturer’s precautions and directions for use.

  • Comparable Materials for 3M AF111

    *See Terms of Use Below

    Spec Engine® Results

    • 3M
      1386(3M)

      A one-part, 100% solids, thermosetting liquid adhesive. Higher impact, peel and bond strength properties. Application by knife coating, trowel, roller coating and high pressure injection methods.

    • 3M
      Thermal Bonding Film AF42 (4 mil)(3M)

      It is a thermosetting epoxy film adhesive, Its flexibility provides excellent drop and impact resistance as well as stress relief for joints encountering coefficient of thermal expansion (CTE) mismatch, Structural bond strength to metals and glass.

    • Henkel
      D-275(Henkel)

      A one component, fast curing, epoxy structural adhesive. It features high tensile lap shear strength and good T-Peel strength.

    • Compare All
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Work / Pot Time Test Methods
Work / Pot Time Temperature
40,320 min 20 to 25°C
Peel Strength Test Methods
Peel Strength Type Cure Time Cure Temperature Cure Humidity Substrate Test Time Test Temperature Test Method
33 piw 67 min 121°C etched aluminum 43,200 min 25°C Peel bonds consisted of 10 mil etched aluminum strips bonded to 0.047" FR-4. Panels were cured 60 minutes + 7 minutes (ramp time) at 250°F (121°C) and peeled at 2"/minute speed.
33 piw 67 min 121°C etched aluminum 43,200 min 71°C Peel bonds consisted of 10 mil etched aluminum strips bonded to 0.047" FR-4. Panels were cured 60 minutes + 7 minutes (ramp time) at 250°F (121°C) and peeled at 2"/minute speed.
32 piw 67 min 121°C 100 % etched aluminum 43,200 min 49°C Peel bonds consisted of 10 mil etched aluminum strips bonded to 0.047" FR-4. Panels were cured 60 minutes + 7 minutes (ramp time) at 250°F (121°C) and peeled at 2"/minute speed.
35 piw 17 (hours), 5 (hours) 121°C etched aluminum 43,200 min Peel bonds consisted of 10 mil etched aluminum strips bonded to 0.047" FR-4. Panels were cured 60 minutes + 7 minutes (ramp time) at 250°F (121°C) and peeled at 2"/minute speed.
33 piw 120 (F), -5 (F) etched aluminum 17 (hours), 5 (hours) -55°C Peel bonds consisted of 10 mil etched aluminum strips bonded to 0.047" FR-4. Panels were cured 60 minutes + 7 minutes (ramp time) at 250°F (121°C) and peeled at 2"/minute speed., Hot/cold cycle was 17 hours at 120°F (49°C) and 5 hours at -5°F (-21°C) with one hour at room temperature between temperature changes.
25 piw etched aluminum 24°C Peel bonds were 0.5" wide, 10 mil etched aluminum strips bonded to 0.047" FR-4 board.
33 piw etched aluminum 82°C Peel bonds were 0.5" wide, 10 mil etched aluminum strips bonded to 0.047" FR-4 board.
33 piw etched aluminum 121°C Peel bonds were 0.5" wide, 10 mil etched aluminum strips bonded to 0.047" FR-4 board.
20 piw 67 min etched aluminum Peel bonds were 0.5" wide, 10 mil etched aluminum strips bonded to 0.047" FR-4 board.
38 piw 90° Peel Strenth 67 min 121°C Al (etched) ASTM D1876, 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute.
36 piw 90° Peel Strenth 67 min 121°C Al (sanded, solvent wiped) ASTM D1876, 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute.
36 piw 90° Peel Strenth 67 min 121°C Al (scour pad abraded, solvent wiped) ASTM D1876, 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute.
36 piw 90° Peel Strenth 67 min 121°C Al (solvent wiped) ASTM D1876, 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute.
35 piw 90° Peel Strenth 67 min 121°C CRS (scour pad abraded, solvent wiped) ASTM D1876, 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute.
3 piw 90° Peel Strenth 67 min 121°C Stainless Steel (solvent wiped) ASTM D1876, 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute.
33 piw 90° Peel Strenth 67 min 121°C FR-4 (solvent wiped) ASTM D1876, 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute.
4 piw 90° Peel Strenth 67 min 121°C LCP (solvent wiped) ASTM D1876, 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute.
20 piw 90° Peel Strenth 67 min 121°C Polyimide Film ASTM D1876, 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute.
3 piw 90° Peel Strenth 67 min 121°C Polyester Film ASTM D1876, 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute.
34 piw 90° Peel Strenth 67 min 121°C Black E-coat ASTM D1876, 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute.
19 piw 90° Peel Strenth 67 min 121°C Phenolic Board ASTM D1876, 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute.
26 piw 90° Peel Strenth 67 min 121°C Ultem® 1000 ASTM D1876, 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute.
14 piw 90° Peel Strenth 67 min 121°C PEN Plastic ASTM D1876, 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute.
1 piw 90° Peel Strenth 121°C Borosilicate Glass ASTM D1876, 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute.
Shear Strength Test Methods
Shear Strength Type Cure Time Cure Temperature Cure Humidity Substrate Test Time Test Temperature Test Method
5,300 psi Overlap shear strength 67 min 121°C Al (etched) ASTM D-1002., OLS bonds were 1" x 0.5" and tested at 0.2"/minute.
3,500 psi Overlap shear strength 67 min 121°C Al (sanded, solvent wiped) ASTM D-1002., OLS bonds were 1" x 0.5" and tested at 0.2"/minute.
3,250 psi Overlap shear strength 67 min 121°C Al (scour pad abraded, solvent wiped) ASTM D-1002., OLS bonds were 1" x 0.5" and tested at 0.2"/minute.
3,100 psi Overlap shear strength 67 min 121°C Al (solvent wiped) ASTM D-1002., OLS bonds were 1" x 0.5" and tested at 0.2"/minute.
2,450 psi Overlap shear strength 67 min 121°C CRS (scour pad abraded, solvent wiped) ASTM D-1002., OLS bonds were 1" x 0.5" and tested at 0.2"/minute.
450 psi Overlap shear strength 67 min 121°C Stainless Steel (solvent wiped) ASTM D-1002., OLS bonds were 1" x 0.5" and tested at 0.2"/minute.
1,150 psi Overlap shear strength 67 min 121°C FR-4 (solvent wiped) ASTM D-1002., OLS bonds were 1" x 0.5" and tested at 0.2"/minute.
300 psi Overlap shear strength 67 min 121°C LCP (solvent wiped) ASTM D-1002., OLS bonds were 1" x 0.5" and tested at 0.2"/minute.
1,750 psi Overlap shear strength 67 min 121°C Polyimide Film ASTM D-1002., OLS bonds were 1" x 0.5" and tested at 0.2"/minute.
1,075 psi Overlap shear strength 67 min 121°C Polyester Film ASTM D-1002., OLS bonds were 1" x 0.5" and tested at 0.2"/minute.
1,150 psi Overlap shear strength 67 min 121°C Black E-coat ASTM D-1002., OLS bonds were 1" x 0.5" and tested at 0.2"/minute.
1,100 psi Overlap shear strength 67 min 121°C Phenolic Board ASTM D-1002., OLS bonds were 1" x 0.5" and tested at 2"/minute.
650 psi Overlap shear strength 67 min 121°C Ultem® 1000 ASTM D-1002., OLS bonds were 1" x 0.5" and tested at 0.2"/minute.
450 psi Overlap shear strength 67 min 121°C PEN Plastic ASTM D-1002., OLS bonds were 1" x 0.5" and tested at 0.2"/minute.
2,300 psi Overlap shear strength 67 min 121°C 2,592,000 sec 25°C OLS (overlap shear) bonds consisted of 3M™ Scotch-Brite™ Scour Pad (green) abraded CRS to CRS, cured 60 minutes + 7 minutes (ramp time) at 250°F (121°C) and tested at 0.2"/minute speed.
2,600 psi Overlap shear strength 67 min 121°C 2,592,000 sec 71°C OLS (overlap shear) bonds consisted of 3M™ Scotch-Brite™ Scour Pad (green) abraded CRS to CRS, cured 60 minutes + 7 minutes (ramp time) at 250°F (121°C) and tested at 0.2"/minute speed.
1,200 psi Overlap shear strength 67 min 121°C 100 % 2,592,000 sec 49°C OLS (overlap shear) bonds consisted of 3M™ Scotch-Brite™ Scour Pad (green) abraded CRS to CRS, cured 60 minutes + 7 minutes (ramp time) at 250°F (121°C) and tested at 0.2"/minute speed.
1,600 psi Overlap shear strength 67 min 120 (F), -5 (F) 2,592,000 sec OLS (overlap shear) bonds consisted of 3M™ Scotch-Brite™ Scour Pad (green) abraded CRS to CRS, cured 60 minutes + 7 minutes (ramp time) at 250°F (121°C) and tested at 0.2"/minute speed.
2,400 psi Overlap shear strength 17 (hours), 5 (hours) -55°C OLS (overlap shear) bonds consisted of 3M™ Scotch-Brite™ Scour Pad (green) abraded CRS to CRS, cured 60 minutes + 7 minutes (ramp time) at 250°F (121°C) and tested at 0.2"/minute speed, Hot/cold cycle was 17 hours at 120°F (49°C) and 5 hours at -5°F (-21°C) with one hour at room temperature between temperature changes.
2,700 psi Overlap shear strength 24°C OLS bonds were 0.5" x 1" (CRS, 3M™ Scotch-Brite™ Scour Pad [green] abraded, solvent wiped).
2,300 psi Overlap shear strength 82°C OLS bonds were 0.5" x 1" (CRS, 3M™ Scotch-Brite™ Scour Pad [green] abraded, solvent wiped).
2,700 psi Overlap shear strength 121°C OLS bonds were 0.5" x 1" (CRS, 3M™ Scotch-Brite™ Scour Pad [green] abraded, solvent wiped).
2,250 psi Overlap shear strength OLS bonds were 0.5" x 1" (CRS, 3M™ Scotch-Brite™ Scour Pad [green] abraded, solvent wiped).
Dielectric Constant Test Methods
Dielectric Constant Test Method
4.20 ASTM D150, @ 1 kilohertz
4.00 ASTM D150, @ 10 kilohertz
3.90 ASTM D150, @ 100 kilohertz
Dielectric Strength Test Methods
Dielectric Strength Test Method
650 V/mil ASTM D-149, (10 mil)
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.00500 ASTM D-150, 1 kilohertz
0.00700 ASTM D-150, 10 kilohertz
0.01100 ASTM D-150, 100 kilohertz
Volume Resistivity Test Methods
Volume Resistivity Test Method
4.1e16 (ohm-cm) (10 mil) ASTM D-257
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Test Method
28e-6 (units/unit/°C) 1st heat values, by TMA @ 10°C/min.
67e-6 (units/unit/°C) 2nd heat values, by TMA @ 10°C/min.
Glass Transition Temp (Tg) Test Methods
Glass Transition Temp (Tg) Glass Transition Temperature (Tg) Test Method
107°C by TMA @ 10°C/min., onset
118°C by DSC @ 5°C/min.,1st heat values, midpoint
114°C by Dsc @ 5°C/min., 2nd heat values, midpoint