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Description for 3M AF111
An epoxy, thermoset film adhesive developed for structural bonding of metals and high-strength plastic materials (epoxy and phenolic).Chemical Resistance Chemical Resistance: Isopropyl Alcohol, Chemical Resistance: Methyl Ethyl Ketone, Chemical Resistance: Heptane, Chemical Resistance: 3M™ Citrus Base Cleaner Application Type Bond 1 Part or 2 Part 1-Part Material Form Film Substrate Al (etched), Borosilicate Glass, Metals, PEN Plastic, Polyester Film, Phenolic Board, Polyimide Film, High-strength plastic materials (epoxy and phenolic), Stainless Steel, Phenolic Board, Al (sanded, solvent wiped), Polyetherimide, Stainless Steel (solvent wiped), Al (scour pad abraded, solvent wiped), Ultem®1000, Al (solvent wiped), Etched Aluminum Industry Electronics applications Manufacturer 3M Chemistry Epoxy Cure Method Heat Cure Temperature (°C) 113, 121, 135, 149, 163, 177, 204 Cure Time (min) 90, 60, 40, 35, 20, 10, 5.00 Color Off-white Total Thickness (mm) 0.254 Single Sided Single Sided High Temperature Resistance (°C) 121 Low Temperature Resistance (°C) -55 Volume Resistivity (O) 4.1e16 (ohm-cm) (10 mil) -
Technical Data for 3M AF111
Overview
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Chemical Resistance
- Chemical Resistance : Relative Solvent Resistance - Isopropyl Alcohol, Methyl Ethyl Ketone, Heptane, 3M™ Citrus Base Cleaner
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Application Type
- Adhesive - Bond
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1 Part or 2 Part
- 1-Part
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Material Form
- Film
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Substrate
- Glass - Borosilicate Glass
- Metal - Metals
- Aluminum - Al (etched), Al (sanded, solvent wiped), Al (scour pad abraded, solvent wiped), Al (solvent wiped), Etched Aluminum
- Plastic - PEN Plastic, Polyetherimide, Ultem®1000
- Polyimide (PI) - Polyimide Film
- Epoxy - High-strength plastic materials (epoxy and phenolic)
- Phenolic - Phenolic Board
- Wood - Phenolic Board
- Polyester - Polyester Film
- Stainless Steel - Stainless Steel (solvent wiped)
- Other - CRS (scour pad abraded, solvent wiped), FR-4 (solvent wiped), LCP (solvent wiped), Black E-coat
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Industry
- Electronics - Electronics applications
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Chemistry
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Cure Method
- Heat
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Color
- Off-White
Specifications
Cure Specs
Cure Temperature (°C) 113, 121, 135, 149, 163, 177, 204 Cure Time (min) 90, 60, 40, 35, 20, 10, 5.00 Work / Pot Time (min) 40,320 Test Method Bond Strength
Structural/Load-Bearing Structural Peel Strength (piw) 33, 33, 32, 35, 33, 25, 33, 33, 20, 38, 36, 36, 36, 35, 3, 33, 4, 20, 3, 34, 19, 26, 14, 1 Test Method Shear Strength (psi) 5,300, 3,500, 3,250, 3,100, 2,450, 450, 1,150, 300, 1,750, 1,075, 1,150, 1,100, 650, 450, 2,300, 2,600, 1,200, 1,600, 2,400, 2,700, 2,300, 2,700, 2,250 Test Method Tensile Strength (psi) 7,200 Tape Properties
Total Thickness (mm) 0.254 Single Sided Single Sided Material Resistance
High Temperature Resistance (°C) 121 Low Temperature Resistance (°C) -55 Conductivity
Dissipation Factor 0.00500, 0.00700, 0.01100 Test Method Dielectric Strength (V/mil) 650 Test Method Dielectric Constant 4.20, 4.00, 3.90 Test Method Volume Resistivity (O) 4.1e16 (ohm-cm) (10 mil) Test Method Hardness
Elongation (%) 10 Modulus (psi) 150,000 Other Properties
Glass Transition Temp (Tg) (°C) 107, 118, 114 Test Method Coefficient of Thermal Expansion (CTE) 28e-6 (units/unit/°C), 67e-6 (units/unit/°C) Test Method Business Information
Shelf Life Details Bonding Film AF111 must be stored at or below 40°F (4°C) before use. Shelf Life Temperature (°F) 70, 40, 0 Shelf Life Type From date of shipment Shelf Life (mon) 1, 6, 12 -
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Best Practices for 3M AF111
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Surface Preparation
A thoroughly cleaned, dry, grease-free surface is essential for maximum performance. Cleaning methods which will produce a break-free water film on metal surfaces are generally satisfactory.
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Curing
The suggested curing condition for Bonding Film AF111 is 60 minutes at 250°F (121°C). The adhesive may be cured either under pressure or in a vacuum bag
During cure, pressure is required to keep parts in alignment and in intimate contact. A minimum of 20 psi is suggested, but higher psi is acceptable if resultant flow during cure is not excessive.
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Clean-Up
Uncured 3M™ Bonding Film AF111 can be removed using acetone, MEK or 3M™ Citrus Base Cleaner.
Note: When using solvents, extinguish all ignition sources and follow the manufacturer’s precautions and directions for use.
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Comparable Materials for 3M AF111
Spec Engine® Results
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Work / Pot Time Test Methods
Work / Pot Time | Temperature |
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40,320 min | 20 to 25°C |
Peel Strength Test Methods
Peel Strength | Type | Cure Time | Cure Temperature | Cure Humidity | Substrate | Test Time | Test Temperature | Test Method |
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33 piw | 67 min | 121°C | etched aluminum | 43,200 min | 25°C | Peel bonds consisted of 10 mil etched aluminum strips bonded to 0.047" FR-4. Panels were cured 60 minutes + 7 minutes (ramp time) at 250°F (121°C) and peeled at 2"/minute speed. | ||
33 piw | 67 min | 121°C | etched aluminum | 43,200 min | 71°C | Peel bonds consisted of 10 mil etched aluminum strips bonded to 0.047" FR-4. Panels were cured 60 minutes + 7 minutes (ramp time) at 250°F (121°C) and peeled at 2"/minute speed. | ||
32 piw | 67 min | 121°C | 100 % | etched aluminum | 43,200 min | 49°C | Peel bonds consisted of 10 mil etched aluminum strips bonded to 0.047" FR-4. Panels were cured 60 minutes + 7 minutes (ramp time) at 250°F (121°C) and peeled at 2"/minute speed. | |
35 piw | 17 (hours), 5 (hours) | 121°C | etched aluminum | 43,200 min | Peel bonds consisted of 10 mil etched aluminum strips bonded to 0.047" FR-4. Panels were cured 60 minutes + 7 minutes (ramp time) at 250°F (121°C) and peeled at 2"/minute speed. | |||
33 piw | 120 (F), -5 (F) | etched aluminum | 17 (hours), 5 (hours) | -55°C | Peel bonds consisted of 10 mil etched aluminum strips bonded to 0.047" FR-4. Panels were cured 60 minutes + 7 minutes (ramp time) at 250°F (121°C) and peeled at 2"/minute speed., Hot/cold cycle was 17 hours at 120°F (49°C) and 5 hours at -5°F (-21°C) with one hour at room temperature between temperature changes. | |||
25 piw | etched aluminum | 24°C | Peel bonds were 0.5" wide, 10 mil etched aluminum strips bonded to 0.047" FR-4 board. | |||||
33 piw | etched aluminum | 82°C | Peel bonds were 0.5" wide, 10 mil etched aluminum strips bonded to 0.047" FR-4 board. | |||||
33 piw | etched aluminum | 121°C | Peel bonds were 0.5" wide, 10 mil etched aluminum strips bonded to 0.047" FR-4 board. | |||||
20 piw | 67 min | etched aluminum | Peel bonds were 0.5" wide, 10 mil etched aluminum strips bonded to 0.047" FR-4 board. | |||||
38 piw | 90° Peel Strenth | 67 min | 121°C | Al (etched) | ASTM D1876, 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute. | |||
36 piw | 90° Peel Strenth | 67 min | 121°C | Al (sanded, solvent wiped) | ASTM D1876, 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute. | |||
36 piw | 90° Peel Strenth | 67 min | 121°C | Al (scour pad abraded, solvent wiped) | ASTM D1876, 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute. | |||
36 piw | 90° Peel Strenth | 67 min | 121°C | Al (solvent wiped) | ASTM D1876, 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute. | |||
35 piw | 90° Peel Strenth | 67 min | 121°C | CRS (scour pad abraded, solvent wiped) | ASTM D1876, 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute. | |||
3 piw | 90° Peel Strenth | 67 min | 121°C | Stainless Steel (solvent wiped) | ASTM D1876, 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute. | |||
33 piw | 90° Peel Strenth | 67 min | 121°C | FR-4 (solvent wiped) | ASTM D1876, 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute. | |||
4 piw | 90° Peel Strenth | 67 min | 121°C | LCP (solvent wiped) | ASTM D1876, 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute. | |||
20 piw | 90° Peel Strenth | 67 min | 121°C | Polyimide Film | ASTM D1876, 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute. | |||
3 piw | 90° Peel Strenth | 67 min | 121°C | Polyester Film | ASTM D1876, 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute. | |||
34 piw | 90° Peel Strenth | 67 min | 121°C | Black E-coat | ASTM D1876, 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute. | |||
19 piw | 90° Peel Strenth | 67 min | 121°C | Phenolic Board | ASTM D1876, 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute. | |||
26 piw | 90° Peel Strenth | 67 min | 121°C | Ultem® 1000 | ASTM D1876, 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute. | |||
14 piw | 90° Peel Strenth | 67 min | 121°C | PEN Plastic | ASTM D1876, 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute. | |||
1 piw | 90° Peel Strenth | 121°C | Borosilicate Glass | ASTM D1876, 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute. |
Shear Strength Test Methods
Shear Strength | Type | Cure Time | Cure Temperature | Cure Humidity | Substrate | Test Time | Test Temperature | Test Method |
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5,300 psi | Overlap shear strength | 67 min | 121°C | Al (etched) | ASTM D-1002., OLS bonds were 1" x 0.5" and tested at 0.2"/minute. | |||
3,500 psi | Overlap shear strength | 67 min | 121°C | Al (sanded, solvent wiped) | ASTM D-1002., OLS bonds were 1" x 0.5" and tested at 0.2"/minute. | |||
3,250 psi | Overlap shear strength | 67 min | 121°C | Al (scour pad abraded, solvent wiped) | ASTM D-1002., OLS bonds were 1" x 0.5" and tested at 0.2"/minute. | |||
3,100 psi | Overlap shear strength | 67 min | 121°C | Al (solvent wiped) | ASTM D-1002., OLS bonds were 1" x 0.5" and tested at 0.2"/minute. | |||
2,450 psi | Overlap shear strength | 67 min | 121°C | CRS (scour pad abraded, solvent wiped) | ASTM D-1002., OLS bonds were 1" x 0.5" and tested at 0.2"/minute. | |||
450 psi | Overlap shear strength | 67 min | 121°C | Stainless Steel (solvent wiped) | ASTM D-1002., OLS bonds were 1" x 0.5" and tested at 0.2"/minute. | |||
1,150 psi | Overlap shear strength | 67 min | 121°C | FR-4 (solvent wiped) | ASTM D-1002., OLS bonds were 1" x 0.5" and tested at 0.2"/minute. | |||
300 psi | Overlap shear strength | 67 min | 121°C | LCP (solvent wiped) | ASTM D-1002., OLS bonds were 1" x 0.5" and tested at 0.2"/minute. | |||
1,750 psi | Overlap shear strength | 67 min | 121°C | Polyimide Film | ASTM D-1002., OLS bonds were 1" x 0.5" and tested at 0.2"/minute. | |||
1,075 psi | Overlap shear strength | 67 min | 121°C | Polyester Film | ASTM D-1002., OLS bonds were 1" x 0.5" and tested at 0.2"/minute. | |||
1,150 psi | Overlap shear strength | 67 min | 121°C | Black E-coat | ASTM D-1002., OLS bonds were 1" x 0.5" and tested at 0.2"/minute. | |||
1,100 psi | Overlap shear strength | 67 min | 121°C | Phenolic Board | ASTM D-1002., OLS bonds were 1" x 0.5" and tested at 2"/minute. | |||
650 psi | Overlap shear strength | 67 min | 121°C | Ultem® 1000 | ASTM D-1002., OLS bonds were 1" x 0.5" and tested at 0.2"/minute. | |||
450 psi | Overlap shear strength | 67 min | 121°C | PEN Plastic | ASTM D-1002., OLS bonds were 1" x 0.5" and tested at 0.2"/minute. | |||
2,300 psi | Overlap shear strength | 67 min | 121°C | 2,592,000 sec | 25°C | OLS (overlap shear) bonds consisted of 3M™ Scotch-Brite™ Scour Pad (green) abraded CRS to CRS, cured 60 minutes + 7 minutes (ramp time) at 250°F (121°C) and tested at 0.2"/minute speed. | ||
2,600 psi | Overlap shear strength | 67 min | 121°C | 2,592,000 sec | 71°C | OLS (overlap shear) bonds consisted of 3M™ Scotch-Brite™ Scour Pad (green) abraded CRS to CRS, cured 60 minutes + 7 minutes (ramp time) at 250°F (121°C) and tested at 0.2"/minute speed. | ||
1,200 psi | Overlap shear strength | 67 min | 121°C | 100 % | 2,592,000 sec | 49°C | OLS (overlap shear) bonds consisted of 3M™ Scotch-Brite™ Scour Pad (green) abraded CRS to CRS, cured 60 minutes + 7 minutes (ramp time) at 250°F (121°C) and tested at 0.2"/minute speed. | |
1,600 psi | Overlap shear strength | 67 min | 120 (F), -5 (F) | 2,592,000 sec | OLS (overlap shear) bonds consisted of 3M™ Scotch-Brite™ Scour Pad (green) abraded CRS to CRS, cured 60 minutes + 7 minutes (ramp time) at 250°F (121°C) and tested at 0.2"/minute speed. | |||
2,400 psi | Overlap shear strength | 17 (hours), 5 (hours) | -55°C | OLS (overlap shear) bonds consisted of 3M™ Scotch-Brite™ Scour Pad (green) abraded CRS to CRS, cured 60 minutes + 7 minutes (ramp time) at 250°F (121°C) and tested at 0.2"/minute speed, Hot/cold cycle was 17 hours at 120°F (49°C) and 5 hours at -5°F (-21°C) with one hour at room temperature between temperature changes. | ||||
2,700 psi | Overlap shear strength | 24°C | OLS bonds were 0.5" x 1" (CRS, 3M™ Scotch-Brite™ Scour Pad [green] abraded, solvent wiped). | |||||
2,300 psi | Overlap shear strength | 82°C | OLS bonds were 0.5" x 1" (CRS, 3M™ Scotch-Brite™ Scour Pad [green] abraded, solvent wiped). | |||||
2,700 psi | Overlap shear strength | 121°C | OLS bonds were 0.5" x 1" (CRS, 3M™ Scotch-Brite™ Scour Pad [green] abraded, solvent wiped). | |||||
2,250 psi | Overlap shear strength | OLS bonds were 0.5" x 1" (CRS, 3M™ Scotch-Brite™ Scour Pad [green] abraded, solvent wiped). |
Dielectric Constant Test Methods
Dielectric Constant | Test Method |
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4.20 | ASTM D150, @ 1 kilohertz |
4.00 | ASTM D150, @ 10 kilohertz |
3.90 | ASTM D150, @ 100 kilohertz |
Dielectric Strength Test Methods
Dielectric Strength | Test Method |
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650 V/mil | ASTM D-149, (10 mil) |
Dissipation Factor Test Methods
Dissipation Factor | Test Method |
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0.00500 | ASTM D-150, 1 kilohertz |
0.00700 | ASTM D-150, 10 kilohertz |
0.01100 | ASTM D-150, 100 kilohertz |
Volume Resistivity Test Methods
Volume Resistivity | Test Method |
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4.1e16 (ohm-cm) (10 mil) | ASTM D-257 |
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) | CTE Test Method |
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28e-6 (units/unit/°C) | 1st heat values, by TMA @ 10°C/min. |
67e-6 (units/unit/°C) | 2nd heat values, by TMA @ 10°C/min. |
Glass Transition Temp (Tg) Test Methods
Glass Transition Temp (Tg) | Glass Transition Temperature (Tg) Test Method |
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107°C | by TMA @ 10°C/min., onset |
118°C | by DSC @ 5°C/min.,1st heat values, midpoint |
114°C | by Dsc @ 5°C/min., 2nd heat values, midpoint |