3M AF111 Datasheet 3M AF111

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  • Description for 3M AF111

    An epoxy, thermoset film adhesive developed for structural bonding of metals and high-strength plastic materials (epoxy and phenolic).

    *See Terms of Use Below

    Chemical Resistance Chemical Resistance: Isopropyl Alcohol, Chemical Resistance: Methyl Ethyl Ketone, Chemical Resistance: Heptane, Chemical Resistance: 3M™ Citrus Base Cleaner
    Application Type Bond
    1 Part or 2 Part 1 Part
    Material Form Film
    Substrate Al (etched), Polyimide Film, Phenolic Board, Borosilicate Glass, Metals, High-strength plastic materials (epoxy and phenolic), PEN Plastic, Polyester Film, Stainless Steel, Phenolic Board, Al (sanded, solvent wiped), Polyetherimide, Stainless Steel (solvent wiped), Al (scour pad abraded, solvent wiped), Ultem®1000, Al (solvent wiped), Etched Aluminum
    Industry Electronics applications
    Manufacturer 3M
    Chemistry Epoxy
    Cure Method Heat
    Cure Temperature (°C) 113, 121, 135, 149, 163, 177, 204
    Cure Time (min) 90, 60, 40, 35, 20, 10, 5.00
    Color Off-white
    Total Thickness (mm) 0.254
    High Temperature Resistance (°C) 121
    Low Temperature Resistance (°C) -55

  • Best Practices for 3M AF111

    *See Terms of Use Below

    1. Surface Preparation

      A thoroughly cleaned, dry, grease-free surface is essential for maximum performance. Cleaning methods which will produce a break-free water film on metal surfaces are generally satisfactory.

    2. Curing

      The suggested curing condition for Bonding Film AF111 is 60 minutes at 250°F (121°C). The adhesive may be cured either under pressure or in a vacuum bag

      During cure, pressure is required to keep parts in alignment and in intimate contact. A minimum of 20 psi is suggested, but higher psi is acceptable if resultant flow during cure is not excessive.

    3. Clean-Up

      Uncured 3M™ Bonding Film AF111 can be removed using acetone, MEK or 3M™ Citrus Base Cleaner.

      Note: When using solvents, extinguish all ignition sources and follow the manufacturer’s precautions and directions for use.

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Work / Pot Time Test Methods
Work / Pot Time Temperature
40,320 min 20 to 25°C
Shear Strength Test Methods
Shear Strength Type Cure Time Cure Temperature Cure Humidity Substrate Test Time Test Temperature Test Method
5,300 psi Overlap shear strength 67 min 121°C Al (etched) ASTM D-1002., OLS bonds were 1" x 0.5" and tested at 0.2"/minute.
3,500 psi Overlap shear strength 67 min 121°C Al (sanded, solvent wiped) ASTM D-1002., OLS bonds were 1" x 0.5" and tested at 0.2"/minute.
3,250 psi Overlap shear strength 67 min 121°C Al (scour pad abraded, solvent wiped) ASTM D-1002., OLS bonds were 1" x 0.5" and tested at 0.2"/minute.
3,100 psi Overlap shear strength 67 min 121°C Al (solvent wiped) ASTM D-1002., OLS bonds were 1" x 0.5" and tested at 0.2"/minute.
2,450 psi Overlap shear strength 67 min 121°C CRS (scour pad abraded, solvent wiped) ASTM D-1002., OLS bonds were 1" x 0.5" and tested at 0.2"/minute.
450 psi Overlap shear strength 67 min 121°C Stainless Steel (solvent wiped) ASTM D-1002., OLS bonds were 1" x 0.5" and tested at 0.2"/minute.
1,150 psi Overlap shear strength 67 min 121°C FR-4 (solvent wiped) ASTM D-1002., OLS bonds were 1" x 0.5" and tested at 0.2"/minute.
300 psi Overlap shear strength 67 min 121°C LCP (solvent wiped) ASTM D-1002., OLS bonds were 1" x 0.5" and tested at 0.2"/minute.
1,750 psi Overlap shear strength 67 min 121°C Polyimide Film ASTM D-1002., OLS bonds were 1" x 0.5" and tested at 0.2"/minute.
1,075 psi Overlap shear strength 67 min 121°C Polyester Film ASTM D-1002., OLS bonds were 1" x 0.5" and tested at 0.2"/minute.
1,150 psi Overlap shear strength 67 min 121°C Black E-coat ASTM D-1002., OLS bonds were 1" x 0.5" and tested at 0.2"/minute.
1,100 psi Overlap shear strength 67 min 121°C Phenolic Board ASTM D-1002., OLS bonds were 1" x 0.5" and tested at 2"/minute.
650 psi Overlap shear strength 67 min 121°C Ultem® 1000 ASTM D-1002., OLS bonds were 1" x 0.5" and tested at 0.2"/minute.
450 psi Overlap shear strength 67 min 121°C PEN Plastic ASTM D-1002., OLS bonds were 1" x 0.5" and tested at 0.2"/minute.
2,300 psi Overlap shear strength 67 min 121°C 2,592,000 sec 25°C OLS (overlap shear) bonds consisted of 3M™ Scotch-Brite™ Scour Pad (green) abraded CRS to CRS, cured 60 minutes + 7 minutes (ramp time) at 250°F (121°C) and tested at 0.2"/minute speed.
2,600 psi Overlap shear strength 67 min 121°C 2,592,000 sec 71°C OLS (overlap shear) bonds consisted of 3M™ Scotch-Brite™ Scour Pad (green) abraded CRS to CRS, cured 60 minutes + 7 minutes (ramp time) at 250°F (121°C) and tested at 0.2"/minute speed.
1,200 psi Overlap shear strength 67 min 121°C 100 % 2,592,000 sec 49°C OLS (overlap shear) bonds consisted of 3M™ Scotch-Brite™ Scour Pad (green) abraded CRS to CRS, cured 60 minutes + 7 minutes (ramp time) at 250°F (121°C) and tested at 0.2"/minute speed.
1,600 psi Overlap shear strength 67 min 120 (F), -5 (F) 2,592,000 sec OLS (overlap shear) bonds consisted of 3M™ Scotch-Brite™ Scour Pad (green) abraded CRS to CRS, cured 60 minutes + 7 minutes (ramp time) at 250°F (121°C) and tested at 0.2"/minute speed.
2,400 psi Overlap shear strength 17 (hours), 5 (hours) -55°C OLS (overlap shear) bonds consisted of 3M™ Scotch-Brite™ Scour Pad (green) abraded CRS to CRS, cured 60 minutes + 7 minutes (ramp time) at 250°F (121°C) and tested at 0.2"/minute speed, Hot/cold cycle was 17 hours at 120°F (49°C) and 5 hours at -5°F (-21°C) with one hour at room temperature between temperature changes.
2,700 psi Overlap shear strength 24°C OLS bonds were 0.5" x 1" (CRS, 3M™ Scotch-Brite™ Scour Pad [green] abraded, solvent wiped).
2,300 psi Overlap shear strength 82°C OLS bonds were 0.5" x 1" (CRS, 3M™ Scotch-Brite™ Scour Pad [green] abraded, solvent wiped).
2,700 psi Overlap shear strength 121°C OLS bonds were 0.5" x 1" (CRS, 3M™ Scotch-Brite™ Scour Pad [green] abraded, solvent wiped).
2,250 psi Overlap shear strength OLS bonds were 0.5" x 1" (CRS, 3M™ Scotch-Brite™ Scour Pad [green] abraded, solvent wiped).
Peel Strength Test Methods
Peel Strength Type Cure Time Cure Temperature Cure Humidity Substrate Test Time Test Temperature Test Method
33 piw 67 min 121°C etched aluminum 43,200 min 25°C Peel bonds consisted of 10 mil etched aluminum strips bonded to 0.047" FR-4. Panels were cured 60 minutes + 7 minutes (ramp time) at 250°F (121°C) and peeled at 2"/minute speed.
33 piw 67 min 121°C etched aluminum 43,200 min 71°C Peel bonds consisted of 10 mil etched aluminum strips bonded to 0.047" FR-4. Panels were cured 60 minutes + 7 minutes (ramp time) at 250°F (121°C) and peeled at 2"/minute speed.
32 piw 67 min 121°C 100 % etched aluminum 43,200 min 49°C Peel bonds consisted of 10 mil etched aluminum strips bonded to 0.047" FR-4. Panels were cured 60 minutes + 7 minutes (ramp time) at 250°F (121°C) and peeled at 2"/minute speed.
35 piw 17 (hours), 5 (hours) 121°C etched aluminum 43,200 min Peel bonds consisted of 10 mil etched aluminum strips bonded to 0.047" FR-4. Panels were cured 60 minutes + 7 minutes (ramp time) at 250°F (121°C) and peeled at 2"/minute speed.
33 piw 120 (F), -5 (F) etched aluminum 17 (hours), 5 (hours) -55°C Peel bonds consisted of 10 mil etched aluminum strips bonded to 0.047" FR-4. Panels were cured 60 minutes + 7 minutes (ramp time) at 250°F (121°C) and peeled at 2"/minute speed., Hot/cold cycle was 17 hours at 120°F (49°C) and 5 hours at -5°F (-21°C) with one hour at room temperature between temperature changes.
25 piw etched aluminum 24°C Peel bonds were 0.5" wide, 10 mil etched aluminum strips bonded to 0.047" FR-4 board.
33 piw etched aluminum 82°C Peel bonds were 0.5" wide, 10 mil etched aluminum strips bonded to 0.047" FR-4 board.
33 piw etched aluminum 121°C Peel bonds were 0.5" wide, 10 mil etched aluminum strips bonded to 0.047" FR-4 board.
20 piw 67 min etched aluminum Peel bonds were 0.5" wide, 10 mil etched aluminum strips bonded to 0.047" FR-4 board.
38 piw 90° Peel Strenth 67 min 121°C Al (etched) ASTM D1876, 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute.
36 piw 90° Peel Strenth 67 min 121°C Al (sanded, solvent wiped) ASTM D1876, 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute.
36 piw 90° Peel Strenth 67 min 121°C Al (scour pad abraded, solvent wiped) ASTM D1876, 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute.
36 piw 90° Peel Strenth 67 min 121°C Al (solvent wiped) ASTM D1876, 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute.
35 piw 90° Peel Strenth 67 min 121°C CRS (scour pad abraded, solvent wiped) ASTM D1876, 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute.
3 piw 90° Peel Strenth 67 min 121°C Stainless Steel (solvent wiped) ASTM D1876, 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute.
33 piw 90° Peel Strenth 67 min 121°C FR-4 (solvent wiped) ASTM D1876, 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute.
4 piw 90° Peel Strenth 67 min 121°C LCP (solvent wiped) ASTM D1876, 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute.
20 piw 90° Peel Strenth 67 min 121°C Polyimide Film ASTM D1876, 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute.
3 piw 90° Peel Strenth 67 min 121°C Polyester Film ASTM D1876, 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute.
34 piw 90° Peel Strenth 67 min 121°C Black E-coat ASTM D1876, 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute.
19 piw 90° Peel Strenth 67 min 121°C Phenolic Board ASTM D1876, 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute.
26 piw 90° Peel Strenth 67 min 121°C Ultem® 1000 ASTM D1876, 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute.
14 piw 90° Peel Strenth 67 min 121°C PEN Plastic ASTM D1876, 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute.
1 piw 90° Peel Strenth 121°C Borosilicate Glass ASTM D1876, 90° peel test of 1/2" wide, 4 mil thick etched aluminum foil bonded to each test substrate., Peel rate 2”/minute.
Dielectric Constant Test Methods
Dielectric Constant Test Method
4.20 ASTM D150, @ 1 kilohertz
4.00 ASTM D150, @ 10 kilohertz
3.90 ASTM D150, @ 100 kilohertz
Dielectric Strength Test Methods
Dielectric Strength Test Method
650 V/mil ASTM D-149, (10 mil)
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.00500 ASTM D-150, 1 kilohertz
0.00700 ASTM D-150, 10 kilohertz
0.01100 ASTM D-150, 100 kilohertz
Volume Resistivity Test Methods
Volume Resistivity Test Method
4.1e16 (ohm-cm) (10 mil) ASTM D-257
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Test Method
28e-6 (units/unit/°C) 1st heat values, by TMA @ 10°C/min.
67e-6 (units/unit/°C) 2nd heat values, by TMA @ 10°C/min.
Glass Transition Temp (Tg) Test Methods
Glass Transition Temp (Tg) Glass Transition Temperature (Tg) Test Method
107°C by TMA @ 10°C/min., onset
118°C by DSC @ 5°C/min.,1st heat values, midpoint
114°C by Dsc @ 5°C/min., 2nd heat values, midpoint