• Description for 3M DP270

    Long worklife potting compound • 8-12 hrs. handling strength • Rigid epoxy • Many electronic applications

    *See Terms of Use Below

    Application Type Bond, Potting, Seal, Encapsulate
    1 Part or 2 Part 2 Part
    Material Form Liquid
    Substrate Aluminum, Copper, Glass, Plastic, Rubber, Steel, Etched Aluminum
    Industry Electronics: Coil, Electronics: Sensors, Electronics: Transformer
    Manufacturer 3M
    Cure Method 2-Part Cure
    Cure Temperature (°C) 23, 50, 80, 100
    Cure Time (min) 2,880, 240, 60, 30
    Viscosity (cPs) Low, 12,000
    Color Black, Clear
    Chemical Resistance 1, 1, 1-Trichlorethane, Acetone, Freon TF, Freon TMC, Isopropyl Alcohol, RMA Flux, Solvent
    High Temperature Resistance (°C) 82
    Low Temperature Resistance (°C) -55
    Other Resistance Good thermal shock resistance
    Key Specifications UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): Meets UL 94 HB (File No. E61941), Mil-Spec (United States Military Standard): Mil S-46163
  • Technical Data

    Overview
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    Specifications
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  • Best Practices

    *See Terms of Use Below

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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
23°C Fully Cured
50°C
80°C
100°C
Cure Time Test Methods
Cure Time Test Method
2,880 min Fully Cured
240 min
60 min
30 min
Tack Free Time Test Methods
Tack Free Time Tack Free Temperature
180 min 23°C
Viscosity Test Methods
Viscosity Temperature
Low
12,000 cPs 23°C
Work / Pot Time Test Methods
Work / Pot Time Temperature
70 min
Long
60 to 70 min 23°C
Shear Strength Test Methods
Shear Strength Type Cure Time Cure Temperature Substrate Test Temperature Test Method
1,200 to 1,250 psi Overlap shear strength 10,080 min 23°C Alum./Alum. (etched) -55°C ASTM D-1002-72
2,450 to 2,500 psi Overlap shear strength 10,080 min 23°C Alum./Alum. (etched) 23°C ASTM D-1002-72
300 to 350 psi Overlap shear strength 10,080 min 23°C Alum./Alum. (etched) 82°C ASTM D-1002-72
1,750 to 1,800 psi Overlap shear strength 10,080 min 23°C FR-4/FR-4 (MEK Wiped) 23°C ASTM D-1002-72
1,700 to 1,750 psi Overlap shear strength 10,080 min 23°C Copper/Copper (MEK Wiped) 23°C ASTM D-1002-72
Peel Strength Test Methods
Peel Strength Type Substrate Test Temperature Test Method
<2 piw 90° Peel strength Alum./Alum. (etched) 23°C ASTM D-1876-61T
Compressive Strength Test Methods
Compressive Strength Test Temperature Test Method
8,100 psi 23°C ASTM D-695-68T
Dielectric Constant Test Methods
Dielectric Constant Temperature Test Method
3.50 23°C ASTM D-150, 1 KHz
Dielectric Strength Test Methods
Dielectric Strength Test Method
850 V/mil ASTM D-149
Dissipation Factor Test Methods
Dissipation Factor Temperature Test Method
0.01800 23°C ASTM D-150, @ 1 KHz @ 23°C (73°F)
Insulation Resistance Test Methods
Insulation Resistance Test Method
Insulation Resistance 60°C/96% R.H./100 volts d.c.
2e11 (ohms) 1000 hrs., (.8 mm/.8 mm comb pattern on FR-4) 60°C/96% R.H./100 volts d.c.)
3e13 (ohms) Initial, (.8 mm/.8 mm comb pattern on FR-4) 60°C/96% R.H./100 volts d.c.)
Thermal Conductivity Test Methods
Thermal Conductivity Temperature Test Method
0.18 W/m°K 43°C @ 110°F on .250" samples
0.426e3 (Cal./sec. - cm - °C) 43°C @ 110°F on .250" samples
0.18 W/m°K 43°C @ 110°F on .250" samples
Volume Resistivity Test Methods
Volume Resistivity Test Method
4.1e14 (ohms/cm) ASTM D-257
Shore D Hardness Test Methods
Shore D Hardness Shore Hardness Test Method
83 ASTM D-2240
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Temperature (°C) CTE Test Method
80e-6 (units/unit /°C) 5 to 30°C by TMA, Below Tg
180e-6 (units/unit /°C) 60 to 125°C by TMA, Above Tg
Glass Transition Temp (Tg) Test Methods
Glass Transition Temp (Tg) Glass Transition Temperature (Tg) Test Method
43°C by DSC, Onset
49°C by DSC, Mid-point
Light Refractive Index (RI) Test Methods
Light Refractive Index (RI) Temperature
1.6560 25°C