3M DP270 Datasheet 3M DP270

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  • Description for 3M DP270

    A two-part, low viscosity epoxy resin system designed primarily for potting, sealing, and encapsulation of many electronic components and is available in clear or black.

    *See Terms of Use Below

    Brand Scotch-weld
    Chemical Resistance Chemical Resistance: 1, 1, 1-Trichlorethane, Chemical Resistance: Acetone, Chemical Resistance: Freon TF, Chemical Resistance: Freon TMC, Chemical Resistance: Isopropyl alcohol, Chemical Resistance: RMA Flux
    Application Type Bond, Potting, Sealing, Encapsulation
    1 Part or 2 Part 2-Part
    Material Form Liquid
    Substrate Aluminum, FR-4, Copper, Glass, Plastic, Rubber, Steel, Etched Aluminum
    Industry Ideal for the potting of many heat sensitive components, Ideal for the sensors, Ideal for the transformers, Ideal for the coils, Designed primarily for many electronic components, Ideal for the potting of many delicate components, Ideal for the encapsulation of many heat sensitive components, Ideal for the encapsulation of many delicate components, Ideal for the glassdiodes, Ideal for the chokes, Ideal for the relays
    Manufacturer 3M
    Chemistry Epoxy resin system
    Application Method Trowel, Spatula
    Cure Method 2-Part Cure
    Cure Temperature (°C) 23, 50, 80, 100
    Coverage 320 (sqft/gallon)
    Cure Time (min) 2,880, 240, 60, 30
    Viscosity (cPs) Low
    Color Black, Clear
    High Temperature Resistance (°C) Good thermal shock resistance, Pass 5 cycles without cracking
    Volume Resistivity (O) 4.1e14 (ohms-cm)
    Light Refractive Index (RI) 1.6560
    Key Specifications UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): Meets UL 94 HB (File No. E61941)

  • Technical Data for 3M DP270

    *See Terms of Use Below

    Overview
    • Chemical Resistance
      • Chemical Resistance : Relative Solvent Resistance - 1, 1, 1-Trichlorethane, Acetone, Freon TF, Freon TMC, Isopropyl alcohol, RMA Flux
    • Application Type
    • 1 Part or 2 Part
      • 2-Part
    • Material Form
      • Liquid
    • Substrate
    • Industry
      • Electronics - Ideal for the potting of many heat sensitive components, Designed primarily for many electronic components, Ideal for the potting of many delicate components, Ideal for the encapsulation of many heat sensitive components, Ideal for the chokes, Ideal for the encapsulation of many delicate components, Ideal for the glassdiodes, Ideal for the relays
      • Sensors - Ideal for the sensors
      • Transformers - Ideal for the transformers
      • Coils - Ideal for the coils
    • Chemistry
      • Epoxy - Epoxy resin system
    • Application Method
      • Flow - Flow equipment
      • Spatula/Trowel - Spatula, Trowel
    • Cure Method
      • 2-Part Cure
    • Color
      • Black
      • Clear / Transparent - Clear
    • Key Specifications
      • UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association) : UL 94 HB - Meets UL 94 HB (File No. E61941)
    • Brand
      • Scotch-weld
    Specifications
    Cure Specs
    Cure Temperature (°C) 23, 50, 80, 100 Test Method
    Coverage 320 (sqft/gallon) Test Method
    Cure Time (min) 2,880, 240, 60, 30 Test Method
    Viscosity (cPs) Low Test Method
    Fixture or Handling Strength Time (min) 180 Test Method
    Linear Shrinkage (%) 0.08 Test Method
    Tack Free Time (min) 180 Test Method
    Work / Pot Time (min) Long, 60 to 70 Test Method
    Open Time (min) 60
    Mix Ratio 1:1 (by volume), 1:0.85 (by weight)
    Bond Strength
    Peel Strength (piw) <2 (lb/in) Test Method
    Shear Strength (psi) 1,200 to 1,250, 2,450 to 2,500, 300 to 350, 1,750 to 1,800, 1,700 to 1,750 Test Method
    Compressive Strength (psi) 8,100 Test Method
    Material Resistance
    Non-Corrosive Noncorrosive
    High Temperature Resistance (°C) Good thermal shock resistance, Pass 5 cycles without cracking Test Method
    Conductivity
    Dissipation Factor 0.01800 Test Method
    Insulation Resistance (O) 3e13 (ohms), 2e11 (ohms) Test Method
    Dielectric Strength (V/mil) Excellent retention of electrical insulation, Excellent electrical properties, 850 Test Method
    Dielectric Constant 3.50 Test Method
    Thermal Conductivity (W/m°K) 0.18 Test Method
    Volume Resistivity (O) 4.1e14 (ohms-cm) Test Method
    Hardness
    Shore D Hardness 83 Test Method
    Other Properties
    Glass Transition Temp (Tg) (°C) 43, 49 Test Method
    Light Refractive Index (RI) 1.6560 Test Method
    Outgassing 5 (%), 10 (%) Test Method
    Coefficient of Thermal Expansion (CTE) 80e-6 (units/unit /°C), 180e-6 (units/unit /°C) Test Method
    Business Information
    Shelf Life Details Store product at 60-80°F (16-27°C) for maximum storage life.;These products when stored in original, unopened container have a shelf life of two years for bulk containers and 15 months in duo-pak containers., Store product at 60-80°F (16-27°C) for maximum storage life.;These products when stored in original, unopened container have a shelf life of two years for bulk containers and 15 months in duo-pak containers., Store product at 60-80°F (16-27°C) for maximum storage life.; These products when stored in original, unopened container have a shelf life of 18 months from date of manufacture.
    Shelf Life Temperature (°F) 61 to 81, 61 to 81, 61 to 81
    Shelf Life Type From date of manufacture
    Shelf Life (mon) 24, 15, 18

  • Best Practices for 3M DP270

    *See Terms of Use Below

    1. Surface Preparation

      For high strength structural bonds, paint, oxide films, oils, dust, mold release agents and all other surface contaminants must be completely removed. However, the amount of surface preparation directly depends on the required bond strength and the environmental aging resistance desired by user. For specific surface preparations on common substrates, see the section on surface preparation.

      The following cleaning methods are suggested for common surfaces: Steel: 1. Wipe free of dust with oil-free solvent such as acetone, isopropyl or alcohol solvents.

      2. Sandblast or abrade using clean fine grit abrasives.

      3. Wipe again with solvent to remove loose particles.

      4. If a primer is used, it should be applied within 4 hours after surface preparation.

      Aluminum: 1. Alkaline Degrease: Oakite 164 solution (9-11 oz./gallon water) at 190°F ± 10°F (88°C ± 5°C) for 10-20 minutes. Rinse immediately in large quantities of cold running water.

      2. Acid Etch: Place panels in the following solution for 10 minutes at 150°F ± 5°F (66°C ± 2°C).

      Sodium Dichromate 4.1 - 4.9 oz./gallon

      Sulfuric Acid, 66°Be 38.5 - 41.5 oz./gallon 2024-T3 aluminum (dissolved) 0.2 oz./gallon minimum Tap water as needed to balance

      3. Rinse: Rinse panels in clear running tap water.

      4. Dry: Air dry 15 minutes

      force dry 10 minutes at 150°F ± 10°F (66°C ± 5°C).

      5. If primer is to be used, it should be applied within 4 hours after surface preparation.

      Plastics/Rubber: 1. Wipe with isopropyl alcohol.

      2. Abrade using fine grit abrasives.

      3. Wipe with isopropyl alcohol.

      Glass: 1. Solvent wipe surface using acetone or MEK.

      2. Apply a thin coating (0.0001 in. or less) of 3M™ Scotch-Weld™ Metal Primer EC3901 to the glass surfaces to be bonded and allow the primer to dry 60 minutes before bonding.

    2. Application

      For maximum bond strength apply product evenly to both surfaces to be joined.

      Application to the substrates should be made within 70 minutes. Larger quantities and/or higher temperatures will reduce this working time.

    3. Mixing

      Two part mixing/proportioning/dispensing equipment is available for intermittent or production line use. These systems are ideal because of their variable shot size and flow rate characteristics and are adaptable to most applications.

      These products consist of two parts.

      Mixing: For Duo-Pak Cartridges: 3M™ Scotch-Weld™ epoxy potting compound/adhesive DP270 Clear and Black are supplied in a dual syringe plastic duo-pak cartridge as part of the 3M™ EPX™ Applicator systems. To use, simply insert the duo-pak cartridge into the EPX applicator and start the plunger into the cylinders using light pressure on the trigger. Next, remove the duo-pak cartridge cap and expel a small amount of adhesive to be sure both sides of the duo-pak cartridge are flowing evenly and freely. If mixing of Part A and Part B is desired, attach the EPX applicator mixing nozzle to the duo-pak cartridge and begin dispensing the adhesive. For hand mixing, expel the desired amount of material and mix thoroughly to obtain a uniform color.

      For Bulk Containers: Mix thoroughly by weight or volume in the proportions specified in the typical uncured properties section to obtain a uniform color.

    4. Curing

      Join the adhesive coated surfaces and allow to cure at 60°F (16°C) or above until firm. Heat up to 200°F (93°C) will speed curing.

      Keep parts from moving during cure. Contact pressure necessary. Maximum shear strength is obtained with a 3-5 mil bond line.

    5. Curing

      Join the adhesive coated surfaces and allow to cure at 60°F (16°C) or above until firm. Heat up to 200°F (93°C) will speed curing.

      Keep parts from moving during cure. Contact pressure necessary. Maximum shear strength is obtained with a 3-5 mil bond line.

    6. Clean-Up

      Excess uncured adhesive can be cleaned up with ketone type solvents.

      Note: When using solvents, extinguish all ignition sources, including pilot lights, and follow the manufacturer’s precautions and directions for use.

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    *See Terms of Use Below

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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
23°C Fully Cured, Notes: The cure time is defined as that time required for the adhesive to achieve a minimum of 80% of the ultimate strength as measured by aluminum-aluminum OLS
50°C
80°C
100°C
Cure Time Test Methods
Cure Time Test Method
2,880 min Fully Cured, Notes: The cure time is defined as that time required for the adhesive to achieve a minimum of 80% of the ultimate strength as measured by aluminum-aluminum OLS
240 min
60 min
30 min
Fixture or Handling Strength Time Test Methods
Fixture or Handling Strength Time Fixture-Handling Strength Test Method Fixture-Handling Strength Time Temperature
180 min Notes: Minimum time required to achieve 50 psi of overlap shear strength. Cure times are approximate and depend on adhesive temperature 23°C
Linear Shrinkage Test Methods
Linear Shrinkage Test Method
0.08 % Cure
Tack Free Time Test Methods
Tack Free Time Tack Free Temperature
180 min 23°C
Viscosity Test Methods
Viscosity Test Method
Low
Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
Long Worklife
60 to 70 min Worklife 23°C
Coverage Test Methods
Coverage Test Method
320 (sqft/gallon) Adhesion Coverage: A 0.005 in thick bondline will yield
Compressive Strength Test Methods
Compressive Strength Test Temperature Test Method
8,100 psi 23°C ASTM D695, Notes: 3M™ Scotch-Weld™ Epoxy Potting Compound/Adhesive DP270 and 270 B/A can be used for, potting, encapsulation, and adhesive applications
Peel Strength Test Methods
Peel Strength Substrate Test Temperature Test Method
<2 (lb/in) Aluminum to etched aluminum 23°C T-Peel adhesion 23C, Width, ASTM D1876, Notes: 3M™ Scotch-Weld™ Epoxy Potting Compound/Adhesive DP270 and 270 B/A can be used for, potting, encapsulation, and adhesive applications
Shear Strength Test Methods
Shear Strength Type Cure Time Cure Temperature Substrate Test Method
1,200 to 1,250 psi Overlap shear 10,080 min -55°C Alum./Alum. (etched) ASTM D-1002-72
2,450 to 2,500 psi Overlap shear 10,080 min 23°C Alum./Alum. (etched) ASTM D-1002-72
300 to 350 psi Overlap shear 10,080 min 82°C Alum./Alum. (etched) ASTM D-1002-72
1,750 to 1,800 psi Overlap shear 10,080 min 23°C FR-4/FR-4 (MEK Wiped) ASTM D-1002-72, Surface Preparation: MEK wipe, Notes: 3M™ Scotch-Weld™ Epoxy Potting Compound/Adhesive DP270 and 270 B/A can be used for, potting,encapsulation, and adhesive applications. The following shows typical shear and peel values determined on several common substrates. 0.005-0.008in bondline
1,700 to 1,750 psi Overlap shear 10,080 min 23°C Copper/Copper (MEK Wiped) ASTM D-1002-72, Surface Preparation: MEK wipe, Notes: 3M™ Scotch-Weld™ Epoxy Potting Compound/Adhesive DP270 and 270 B/A can be used for, potting, encapsulation, and adhesive applications. The following shows typical shear and peel values determined on several common substrates. 0.005-0.008in bondline
High Temperature Resistance Test Methods
High Temperature Resistance Test Method
Good thermal shock resistance
Pass 5 cycles without cracking 3M C3174
Dielectric Constant Test Methods
Dielectric Constant Temperature Test Method
3.50 23°C ASTM D-150, 1 KHz
Dielectric Strength Test Methods
Dielectric Strength Test Method
Excellent retention of electrical insulation
Excellent electrical properties
850 V/mil ASTM D-149
Dissipation Factor Test Methods
Dissipation Factor Temperature Test Method
0.01800 23°C ASTM D150, 1KHz
Insulation Resistance Test Methods
Insulation Resistance Test Method
3e13 (ohms) Notes: 0.8 mm/0.8 mm comb pattern on FR-4, 60°C/96% R.H./100 volts d.c
2e11 (ohms) Notes: 0.8 mm/0.8 mm comb pattern on FR-4, 60°C/96% R.H./100 volts d.c
Thermal Conductivity Test Methods
Thermal Conductivity Temperature Test Method
0.18 W/m°K 43°C C177, Notes: Thermal conductivity determined using C-matic Instrument using 2 in. diameter samples
Volume Resistivity Test Methods
Volume Resistivity Temp (°C) Test Method
4.1e14 (ohms-cm) 23°C ASTM D-257
Shore D Hardness Test Methods
Shore D Hardness Shore Hardness Test Method Hardness Temperature
83 ASTM D-2240 23°C
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Temperature (°C) CTE Test Method
80e-6 (units/unit /°C) 5 to 30°C By TMA, Below Tg
180e-6 (units/unit /°C) 60 to 125°C By TMA, Above Tg
Glass Transition Temp (Tg) Test Methods
Glass Transition Temp (Tg) Glass Transition Temperature (Tg) Test Method
43°C By DSC, Onset, Notes: Glass Transition Temperature (Tg) determined using DSC Analyzer with a heating rate of 68°F (20°C) per minute. Second heat values given
49°C By DSC, Mid-point, Notes: Glass Transition Temperature (Tg) determined using DSC Analyzer with a heating rate of 68°F (20°C) per minute. Second heat values given
Light Refractive Index (RI) Test Methods
Light Refractive Index (RI) Temperature
1.6560 25°C
Outgassing Test Methods
Outgassing Temperature (°C) Test Method
5 (%) 175°C Weight loss by thermal gravimetric analysis (TGA)
10 (%) 210°C Weight loss by thermal gravimetric analysis (TGA)