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Description for 3M DP270
A two-part, low viscosity epoxy resin system designed primarily for potting, sealing, and encapsulation of many electronic components and is available in clear or black.Brand Scotch-weld Chemical Resistance Chemical Resistance: 1, 1, 1-Trichlorethane, Chemical Resistance: Acetone, Chemical Resistance: Freon TF, Chemical Resistance: Freon TMC, Chemical Resistance: Isopropyl alcohol, Chemical Resistance: RMA Flux Application Type Bond, Potting, Sealing, Encapsulation 1 Part or 2 Part 2-Part Material Form Liquid Substrate Aluminum, FR-4, Copper, Glass, Plastic, Rubber, Steel, Etched Aluminum Industry Ideal for the potting of many heat sensitive components, Ideal for the sensors, Ideal for the transformers, Ideal for the coils, Designed primarily for many electronic components, Ideal for the potting of many delicate components, Ideal for the encapsulation of many heat sensitive components, Ideal for the encapsulation of many delicate components, Ideal for the glassdiodes, Ideal for the chokes, Ideal for the relays Manufacturer 3M Chemistry Epoxy resin system Application Method Trowel, Spatula Cure Method 2-Part Cure Cure Temperature (°C) 23, 50, 80, 100 Coverage 320 (sqft/gallon) Cure Time (min) 2,880, 240, 60, 30 Viscosity (cPs) Low Color Black, Clear High Temperature Resistance (°C) Good thermal shock resistance, Pass 5 cycles without cracking Volume Resistivity (O) 4.1e14 (ohms-cm) Light Refractive Index (RI) 1.6560 Key Specifications UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): Meets UL 94 HB (File No. E61941) -
Technical Data for 3M DP270
Overview
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Chemical Resistance
- Chemical Resistance : Relative Solvent Resistance - 1, 1, 1-Trichlorethane, Acetone, Freon TF, Freon TMC, Isopropyl alcohol, RMA Flux
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Application Type
- Adhesive - Bond
- Pottant / Encapsulant - Potting, Encapsulation
- Sealant - Sealing
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1 Part or 2 Part
- 2-Part
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Material Form
- Liquid
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Industry
- Electronics - Ideal for the potting of many heat sensitive components, Designed primarily for many electronic components, Ideal for the potting of many delicate components, Ideal for the encapsulation of many heat sensitive components, Ideal for the chokes, Ideal for the encapsulation of many delicate components, Ideal for the glassdiodes, Ideal for the relays
- Sensors - Ideal for the sensors
- Transformers - Ideal for the transformers
- Coils - Ideal for the coils
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Chemistry
- Epoxy - Epoxy resin system
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Application Method
- Flow - Flow equipment
- Spatula/Trowel - Spatula, Trowel
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Cure Method
- 2-Part Cure
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Color
- Black
- Clear / Transparent - Clear
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Key Specifications
- UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association) : UL 94 HB - Meets UL 94 HB (File No. E61941)
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Brand
- Scotch-weld
Specifications
Cure Specs
Cure Temperature (°C) 23, 50, 80, 100 Test Method Coverage 320 (sqft/gallon) Test Method Cure Time (min) 2,880, 240, 60, 30 Test Method Viscosity (cPs) Low Test Method Fixture or Handling Strength Time (min) 180 Test Method Linear Shrinkage (%) 0.08 Test Method Tack Free Time (min) 180 Test Method Work / Pot Time (min) Long, 60 to 70 Test Method Open Time (min) 60 Mix Ratio 1:1 (by volume), 1:0.85 (by weight) Bond Strength
Peel Strength (piw) <2 (lb/in) Test Method Shear Strength (psi) 1,200 to 1,250, 2,450 to 2,500, 300 to 350, 1,750 to 1,800, 1,700 to 1,750 Test Method Compressive Strength (psi) 8,100 Test Method Material Resistance
Non-Corrosive Noncorrosive High Temperature Resistance (°C) Good thermal shock resistance, Pass 5 cycles without cracking Test Method Conductivity
Dissipation Factor 0.01800 Test Method Insulation Resistance (O) 3e13 (ohms), 2e11 (ohms) Test Method Dielectric Strength (V/mil) Excellent retention of electrical insulation, Excellent electrical properties, 850 Test Method Dielectric Constant 3.50 Test Method Thermal Conductivity (W/m°K) 0.18 Test Method Volume Resistivity (O) 4.1e14 (ohms-cm) Test Method Hardness
Shore D Hardness 83 Test Method Other Properties
Glass Transition Temp (Tg) (°C) 43, 49 Test Method Light Refractive Index (RI) 1.6560 Test Method Outgassing 5 (%), 10 (%) Test Method Coefficient of Thermal Expansion (CTE) 80e-6 (units/unit /°C), 180e-6 (units/unit /°C) Test Method Business Information
Shelf Life Details Store product at 60-80°F (16-27°C) for maximum storage life.;These products when stored in original, unopened container have a shelf life of two years for bulk containers and 15 months in duo-pak containers., Store product at 60-80°F (16-27°C) for maximum storage life.;These products when stored in original, unopened container have a shelf life of two years for bulk containers and 15 months in duo-pak containers., Store product at 60-80°F (16-27°C) for maximum storage life.; These products when stored in original, unopened container have a shelf life of 18 months from date of manufacture. Shelf Life Temperature (°F) 61 to 81, 61 to 81, 61 to 81 Shelf Life Type From date of manufacture Shelf Life (mon) 24, 15, 18 -
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Best Practices for 3M DP270
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Surface Preparation
For high strength structural bonds, paint, oxide films, oils, dust, mold release agents and all other surface contaminants must be completely removed. However, the amount of surface preparation directly depends on the required bond strength and the environmental aging resistance desired by user. For specific surface preparations on common substrates, see the section on surface preparation.
The following cleaning methods are suggested for common surfaces: Steel: 1. Wipe free of dust with oil-free solvent such as acetone, isopropyl or alcohol solvents.
2. Sandblast or abrade using clean fine grit abrasives.
3. Wipe again with solvent to remove loose particles.
4. If a primer is used, it should be applied within 4 hours after surface preparation.
Aluminum: 1. Alkaline Degrease: Oakite 164 solution (9-11 oz./gallon water) at 190°F ± 10°F (88°C ± 5°C) for 10-20 minutes. Rinse immediately in large quantities of cold running water.
2. Acid Etch: Place panels in the following solution for 10 minutes at 150°F ± 5°F (66°C ± 2°C).
Sodium Dichromate 4.1 - 4.9 oz./gallon
Sulfuric Acid, 66°Be 38.5 - 41.5 oz./gallon 2024-T3 aluminum (dissolved) 0.2 oz./gallon minimum Tap water as needed to balance
3. Rinse: Rinse panels in clear running tap water.
4. Dry: Air dry 15 minutes
force dry 10 minutes at 150°F ± 10°F (66°C ± 5°C).
5. If primer is to be used, it should be applied within 4 hours after surface preparation.
Plastics/Rubber: 1. Wipe with isopropyl alcohol.
2. Abrade using fine grit abrasives.
3. Wipe with isopropyl alcohol.
Glass: 1. Solvent wipe surface using acetone or MEK.
2. Apply a thin coating (0.0001 in. or less) of 3M™ Scotch-Weld™ Metal Primer EC3901 to the glass surfaces to be bonded and allow the primer to dry 60 minutes before bonding.
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Application
For maximum bond strength apply product evenly to both surfaces to be joined.
Application to the substrates should be made within 70 minutes. Larger quantities and/or higher temperatures will reduce this working time.
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Mixing
Two part mixing/proportioning/dispensing equipment is available for intermittent or production line use. These systems are ideal because of their variable shot size and flow rate characteristics and are adaptable to most applications.
These products consist of two parts.
Mixing: For Duo-Pak Cartridges: 3M™ Scotch-Weld™ epoxy potting compound/adhesive DP270 Clear and Black are supplied in a dual syringe plastic duo-pak cartridge as part of the 3M™ EPX™ Applicator systems. To use, simply insert the duo-pak cartridge into the EPX applicator and start the plunger into the cylinders using light pressure on the trigger. Next, remove the duo-pak cartridge cap and expel a small amount of adhesive to be sure both sides of the duo-pak cartridge are flowing evenly and freely. If mixing of Part A and Part B is desired, attach the EPX applicator mixing nozzle to the duo-pak cartridge and begin dispensing the adhesive. For hand mixing, expel the desired amount of material and mix thoroughly to obtain a uniform color.
For Bulk Containers: Mix thoroughly by weight or volume in the proportions specified in the typical uncured properties section to obtain a uniform color.
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Curing
Join the adhesive coated surfaces and allow to cure at 60°F (16°C) or above until firm. Heat up to 200°F (93°C) will speed curing.
Keep parts from moving during cure. Contact pressure necessary. Maximum shear strength is obtained with a 3-5 mil bond line.
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Curing
Join the adhesive coated surfaces and allow to cure at 60°F (16°C) or above until firm. Heat up to 200°F (93°C) will speed curing.
Keep parts from moving during cure. Contact pressure necessary. Maximum shear strength is obtained with a 3-5 mil bond line.
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Clean-Up
Excess uncured adhesive can be cleaned up with ketone type solvents.
Note: When using solvents, extinguish all ignition sources, including pilot lights, and follow the manufacturer’s precautions and directions for use.
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Cure Temperature Test Methods
Cure Temperature | Cure Time Test Method |
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23°C | Fully Cured, Notes: The cure time is defined as that time required for the adhesive to achieve a minimum of 80% of the ultimate strength as measured by aluminum-aluminum OLS |
50°C | |
80°C | |
100°C |
Cure Time Test Methods
Cure Time | Test Method |
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2,880 min | Fully Cured, Notes: The cure time is defined as that time required for the adhesive to achieve a minimum of 80% of the ultimate strength as measured by aluminum-aluminum OLS |
240 min | |
60 min | |
30 min |
Fixture or Handling Strength Time Test Methods
Fixture or Handling Strength Time | Fixture-Handling Strength Test Method | Fixture-Handling Strength Time Temperature |
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180 min | Notes: Minimum time required to achieve 50 psi of overlap shear strength. Cure times are approximate and depend on adhesive temperature | 23°C |
Linear Shrinkage Test Methods
Linear Shrinkage | Test Method |
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0.08 % | Cure |
Tack Free Time Test Methods
Tack Free Time | Tack Free Temperature |
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180 min | 23°C |
Viscosity Test Methods
Viscosity | Test Method |
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Low |
Work / Pot Time Test Methods
Work / Pot Time | Test Method | Temperature |
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Long | Worklife | |
60 to 70 min | Worklife | 23°C |
Coverage Test Methods
Coverage | Test Method |
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320 (sqft/gallon) | Adhesion Coverage: A 0.005 in thick bondline will yield |
Compressive Strength Test Methods
Compressive Strength | Test Temperature | Test Method |
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8,100 psi | 23°C | ASTM D695, Notes: 3M™ Scotch-Weld™ Epoxy Potting Compound/Adhesive DP270 and 270 B/A can be used for, potting, encapsulation, and adhesive applications |
Peel Strength Test Methods
Peel Strength | Substrate | Test Temperature | Test Method |
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<2 (lb/in) | Aluminum to etched aluminum | 23°C | T-Peel adhesion 23C, Width, ASTM D1876, Notes: 3M™ Scotch-Weld™ Epoxy Potting Compound/Adhesive DP270 and 270 B/A can be used for, potting, encapsulation, and adhesive applications |
Shear Strength Test Methods
Shear Strength | Type | Cure Time | Cure Temperature | Substrate | Test Method |
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1,200 to 1,250 psi | Overlap shear | 10,080 min | -55°C | Alum./Alum. (etched) | ASTM D-1002-72 |
2,450 to 2,500 psi | Overlap shear | 10,080 min | 23°C | Alum./Alum. (etched) | ASTM D-1002-72 |
300 to 350 psi | Overlap shear | 10,080 min | 82°C | Alum./Alum. (etched) | ASTM D-1002-72 |
1,750 to 1,800 psi | Overlap shear | 10,080 min | 23°C | FR-4/FR-4 (MEK Wiped) | ASTM D-1002-72, Surface Preparation: MEK wipe, Notes: 3M™ Scotch-Weld™ Epoxy Potting Compound/Adhesive DP270 and 270 B/A can be used for, potting,encapsulation, and adhesive applications. The following shows typical shear and peel values determined on several common substrates. 0.005-0.008in bondline |
1,700 to 1,750 psi | Overlap shear | 10,080 min | 23°C | Copper/Copper (MEK Wiped) | ASTM D-1002-72, Surface Preparation: MEK wipe, Notes: 3M™ Scotch-Weld™ Epoxy Potting Compound/Adhesive DP270 and 270 B/A can be used for, potting, encapsulation, and adhesive applications. The following shows typical shear and peel values determined on several common substrates. 0.005-0.008in bondline |
High Temperature Resistance Test Methods
High Temperature Resistance | Test Method |
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Good thermal shock resistance | |
Pass 5 cycles without cracking | 3M C3174 |
Dielectric Constant Test Methods
Dielectric Constant | Temperature | Test Method |
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3.50 | 23°C | ASTM D-150, 1 KHz |
Dielectric Strength Test Methods
Dielectric Strength | Test Method |
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Excellent retention of electrical insulation | |
Excellent electrical properties | |
850 V/mil | ASTM D-149 |
Dissipation Factor Test Methods
Dissipation Factor | Temperature | Test Method |
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0.01800 | 23°C | ASTM D150, 1KHz |
Insulation Resistance Test Methods
Insulation Resistance | Test Method |
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3e13 (ohms) | Notes: 0.8 mm/0.8 mm comb pattern on FR-4, 60°C/96% R.H./100 volts d.c |
2e11 (ohms) | Notes: 0.8 mm/0.8 mm comb pattern on FR-4, 60°C/96% R.H./100 volts d.c |
Thermal Conductivity Test Methods
Thermal Conductivity | Temperature | Test Method |
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0.18 W/m°K | 43°C | C177, Notes: Thermal conductivity determined using C-matic Instrument using 2 in. diameter samples |
Volume Resistivity Test Methods
Volume Resistivity | Temp (°C) | Test Method |
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4.1e14 (ohms-cm) | 23°C | ASTM D-257 |
Shore D Hardness Test Methods
Shore D Hardness | Shore Hardness Test Method | Hardness Temperature |
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83 | ASTM D-2240 | 23°C |
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) | CTE Temperature (°C) | CTE Test Method |
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80e-6 (units/unit /°C) | 5 to 30°C | By TMA, Below Tg |
180e-6 (units/unit /°C) | 60 to 125°C | By TMA, Above Tg |
Glass Transition Temp (Tg) Test Methods
Glass Transition Temp (Tg) | Glass Transition Temperature (Tg) Test Method |
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43°C | By DSC, Onset, Notes: Glass Transition Temperature (Tg) determined using DSC Analyzer with a heating rate of 68°F (20°C) per minute. Second heat values given |
49°C | By DSC, Mid-point, Notes: Glass Transition Temperature (Tg) determined using DSC Analyzer with a heating rate of 68°F (20°C) per minute. Second heat values given |
Light Refractive Index (RI) Test Methods
Light Refractive Index (RI) | Temperature |
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1.6560 | 25°C |
Outgassing Test Methods
Outgassing | Temperature (°C) | Test Method |
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5 (%) | 175°C | Weight loss by thermal gravimetric analysis (TGA) |
10 (%) | 210°C | Weight loss by thermal gravimetric analysis (TGA) |