Application Type Bond, Potting, Seal, Encapsulate 1 Part or 2 Part 2 Part Material Form Liquid Substrate Aluminum, Copper, Glass, Plastic, Rubber, Steel, Etched Aluminum Industry Electrical, Coil, Sensors, Transformer, Many electronic components, Glass diodes, Relay Manufacturer 3M Application Method Trowel, Spatula Cure Method 2-Part Cure Cure Temperature (°C) 23, 50, 80, 100 Cure Time (min) 2,880, 240, 60, 30 Viscosity (cPs) Low, 12,000 Color Black, Clear Chemical Resistance 1, 1, 1-Trichlorethane, Acetone, Freon TF, Freon TMC, Isopropyl Alcohol, RMA Flux Relative Solvent Resistance Chemical Resistance: Solvent High Temperature Resistance (°C) 82, Good thermal shock resistance Low Temperature Resistance (°C) -55 Light Refractive Index (RI) 1.6560 Key Specifications UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): Meets UL 94 HB (File No. E61941), Mil-Spec (United States Military Standard): Mil S-46163
Technical Data for 3M DP270
1 Part or 2 Part
- 1 Part or 2 Part - 2 Part
- Dispenser - Flow equipment
- Spatula/Trowel - Spatula, Trowel
- 2-Part Cure
- Clear / Transparent - Clear
- UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94 HB - Meets UL 94 HB (File No. E61941)
- Mil-Spec (United States Military Standard): S-46163 - Mil S-46163
Cure Temperature (°C) 23, 50, 80, 100 Test Method Cure Time (min) 2,880, 240, 60, 30 Test Method Viscosity (cPs) Low, 12,000 Test Method Fixture or Handling Strength Time (min) 480 to 720 Tack Free Time (min) 180 Test Method Work / Pot Time (min) 70, Long, 60 to 70 Test Method Mix Ratio 1:1 (by volume), 1:0.85 (by weight)
Structural/Load-Bearing High structural Peel Strength (piw) <2 Test Method Shear Strength (psi) 1,200 to 1,250, 2,450 to 2,500, 300 to 350, 1,750 to 1,800, 1,700 to 1,750 Test Method Compressive Strength (psi) 8,100 Test Method
Non-Corrosive Noncorrosive Chemical Resistance 1, 1, 1-Trichlorethane, Acetone, Freon TF, Freon TMC, Isopropyl Alcohol, RMA Flux Relative Solvent Resistance Chemical Resistance: Solvent High Temperature Resistance (°C) 82, Good thermal shock resistance Low Temperature Resistance (°C) -55 Moisture/Humidity Resistance Moisture/humidity resistance
Dissipation Factor 0.01800 Test Method Insulation Resistance (O) Insulation Resistance, 2e11 (ohms), 3e13 (ohms) Test Method Dielectric Strength (V/mil) 850 Test Method Dielectric Constant 3.50 Test Method Thermal Conductivity (W/m°K) 0.18, 0.426e3 (Cal./sec. - cm - °C), 0.18 Test Method Volume Resistivity (O) 4.1e14 (ohms/cm) Test Method
Shore D Hardness Rigid, 83 Test Method
Glass Transition Temp (Tg) (°C) 43, 49 Test Method Light Refractive Index (RI) 1.6560 Test Method Coefficient of Thermal Expansion (CTE) 80e-6 (units/unit /°C), 180e-6 (units/unit /°C) Test Method
Shelf Life Details Store product at 60-80°F (16-27°C) for maximum storage life.;These products when stored in original, unopened container have a shelf life of two years for bulk containers and 15 months in duo-pak containers., Store product at 60-80°F (16-27°C) for maximum storage life.;These products when stored in original, unopened container have a shelf life of two years for bulk containers and 15 months in duo-pak containers., These products when stored in original, unopened container have a shelf life of 18 months from date of manufacture. Shelf Life Temperature (°F) 61 to 81, 61 to 81, 61 to 81 Shelf Life Type From date of manufacture Shelf Life (mon) 24, 15, 18
Best Practices for 3M DP270
For high strength structural bonds, paint, oxide films, oils, dust, mold release agents and all other surface contaminants must be completely removed. However, the amount of surface preparation directly depends on the required bond strength and the environmental aging resistance desired by user.
The cleaning methods are suggested for common surfaces: Steel: 1. Wipe free of dust with oil-free solvent such as acetone, isopropyl or alcohol solvents.
2. Sandblast or abrade using clean fine grit abrasives.
3. Wipe again with solvent to remove loose particles.
4. If a primer is used, it should be applied within 4 hours after surface preparation.
Aluminum: 1. Alkaline Degrease: Oakite 164 solution (9-11 oz./gallon water) at 190°F ± 10°F (88°C ± 5°C) for 10-20 minutes. Rinse immediately in large quantities of cold running water.
2. Acid Etch: Place panels in the following solution for 10 minutes at 150°F ± 5°F (66°C ± 2°C).
Sodium Dichromate: 4.1 - 4.9 oz./gallon, Sulfuric Acid, 66°Be: 38.5 - 41.5 oz./gallon, 2024-T3 aluminum (dissolved): 0.2 oz./gallon minimum, Tap water as needed to balance
3. Rinse: Rinse panels in clear running tap water.
4. Dry: Air dry 15 minutes
force dry 10 minutes at 150°F ± 10°F (66°C ± 5°C).
5. If primer is to be used, it should be applied within 4 hours after surface preparation.
Plastics/Rubber: 1. Wipe with isopropyl alcohol.
2. Abrade using fine grit abrasives.
3. Wipe with isopropyl alcohol.
Glass: 1. Solvent wipe surface using acetone or MEK.
2. Apply a thin coating (0.0001 in. or less) of 3M™ Scotch-Weld™ Metal Primer EC3901 to the glass surfaces to be bonded and allow the primer to dry 60 minutes before bonding.
For maximum bond strength apply product evenly to both surfaces to be joined.
Application to the substrates should be made within 70 minutes. Larger quantities and/or higher temperatures will reduce this working time.
For Duo-Pak Cartridges: If mixing of Part A and Part B is desired, attach the EPX applicator mixing nozzle to the duo-pak cartridge and begin dispensing the adhesive. For hand mixing, expel the desired amount of material and mix thoroughly to obtain a uniform color.
EPX Applicator systems.
Mix thoroughly by weight or volume in the proportions specified in the typical uncured properties section to obtain a uniform color.
For Bulk Containers: Mix thoroughly by weight or volume in the proportions specified in the typical uncured properties section to obtain a uniform color.
Join the adhesive coated surfaces and allow to cure at 60°F (16°C) or above until firm. Heat up to 200°F (93°C) will speed curing.
Keep parts from moving during cure. Contact pressure necessary. Maximum shear strength is obtained with a 3-5 mil bond line.
Excess uncured adhesive can be cleaned up with ketone type solvents.
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Cure Temperature Test Methods
|Cure Temperature||Cure Time Test Method|
Cure Time Test Methods
|Cure Time||Test Method|
|2,880 min||Fully Cured|
Tack Free Time Test Methods
|Tack Free Time||Tack Free Temperature|
Viscosity Test Methods
Work / Pot Time Test Methods
|Work / Pot Time||Temperature|
|60 to 70 min||23°C|
Compressive Strength Test Methods
|Compressive Strength||Test Temperature||Test Method|
|8,100 psi||23°C||ASTM D-695-68T|
Peel Strength Test Methods
|Peel Strength||Type||Substrate||Test Temperature||Test Method|
|<2 piw||90° Peel strength||Alum./Alum. (etched)||23°C||ASTM D-1876-61T|
Shear Strength Test Methods
|Shear Strength||Type||Cure Time||Cure Temperature||Substrate||Test Temperature||Test Method|
|1,200 to 1,250 psi||Overlap shear strength||10,080 min||23°C||Alum./Alum. (etched)||-55°C||ASTM D-1002-72|
|2,450 to 2,500 psi||Overlap shear strength||10,080 min||23°C||Alum./Alum. (etched)||23°C||ASTM D-1002-72|
|300 to 350 psi||Overlap shear strength||10,080 min||23°C||Alum./Alum. (etched)||82°C||ASTM D-1002-72|
|1,750 to 1,800 psi||Overlap shear strength||10,080 min||23°C||FR-4/FR-4 (MEK Wiped)||23°C||ASTM D-1002-72|
|1,700 to 1,750 psi||Overlap shear strength||10,080 min||23°C||Copper/Copper (MEK Wiped)||23°C||ASTM D-1002-72|
Dielectric Constant Test Methods
|Dielectric Constant||Temperature||Test Method|
|3.50||23°C||ASTM D-150, 1 KHz|
Dielectric Strength Test Methods
|Dielectric Strength||Test Method|
|850 V/mil||ASTM D-149|
Dissipation Factor Test Methods
|Dissipation Factor||Temperature||Test Method|
|0.01800||23°C||ASTM D-150, @ 1 KHz @ 23°C (73°F)|
Insulation Resistance Test Methods
|Insulation Resistance||Test Method|
|Insulation Resistance||60°C/96% R.H./100 volts d.c.|
|2e11 (ohms)||1000 hrs., (.8 mm/.8 mm comb pattern on FR-4) 60°C/96% R.H./100 volts d.c.)|
|3e13 (ohms)||Initial, (.8 mm/.8 mm comb pattern on FR-4) 60°C/96% R.H./100 volts d.c.)|
Thermal Conductivity Test Methods
|Thermal Conductivity||Temperature||Test Method|
|0.18 W/m°K||43°C||@ 110°F on .250" samples|
|0.426e3 (Cal./sec. - cm - °C)||43°C||@ 110°F on .250" samples|
|0.18 W/m°K||43°C||@ 110°F on .250" samples|
Volume Resistivity Test Methods
|Volume Resistivity||Test Method|
|4.1e14 (ohms/cm)||ASTM D-257|
Shore D Hardness Test Methods
|Shore D Hardness||Shore Hardness Test Method|
Coefficient of Thermal Expansion (CTE) Test Methods
|Coefficient of Thermal Expansion (CTE)||CTE Temperature (°C)||CTE Test Method|
|80e-6 (units/unit /°C)||5 to 30°C||by TMA, Below Tg|
|180e-6 (units/unit /°C)||60 to 125°C||by TMA, Above Tg|
Glass Transition Temp (Tg) Test Methods
|Glass Transition Temp (Tg)||Glass Transition Temperature (Tg) Test Method|
|43°C||by DSC, Onset|
|49°C||by DSC, Mid-point|
Light Refractive Index (RI) Test Methods
|Light Refractive Index (RI)||Temperature|