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Description for 3M DP460EG
• Lower outgassing • Lower ionics • Cures in 24 hours at room temperature • Heat accelerated cure.Application Type Bond, Pot 1 Part or 2 Part 2-Part Material Form Liquid Substrate Anodized Aluminum , Etched Aluminum Industry Hard Disk Drive Assembly, Spindle Motor Assembly, Magnet Manufacturer 3M Cure Method 2 Part Cure Temperature (°C) 20 to 25 Cure Time (min) 1,440 Viscosity (cPs) 15,000 to 25,000 -
Technical Data for 3M DP460EG
Overview
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Application Type
- Adhesive - Bond
- Pottant / Encapsulant - Pot
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1 Part or 2 Part
- 2-Part
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Material Form
- Liquid
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Substrate
- Aluminum - Etched Aluminum
- Anodized Aluminum - Anodized Aluminum
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Industry
- Disk Drive - Hard Disk Drive Assembly
- Motors - Spindle Motor Assembly
- Magnet
- Other - Bearing Cartridge Assembly, E-Block Assembly
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Cure Method
- 2-Part Cure - 2 Part
Specifications
Cure Specs
Cure Temperature (°C) 20 to 25 Cure Time (min) 1,440 Viscosity (cPs) 15,000 to 25,000 Test Method Work / Pot Time (min) 110 Test Method Mix Ratio 2:1 (by volume), 2:0:0.96 (by weight) Bond Strength
Peel Strength (piw) 60 (lbf/in), 59 (lbf/in), 43 (lbf/in), 39 (lbf/in), 45 (lbf/in) Test Method Shear Strength (psi) > 5000 (lbf/in2), > 5000 (lbf/in2), > 5500 (lbf/in2), > 5500 (lbf/in2), > 5500 (lbf/in2) Test Method Conductivity
Thermal Conductivity (W/m°K) 0.18 Test Method Dielectric Constant 4.70 Test Method Other Properties
Outgassing lower, < 1000 (µg/g), <= 5 (µg/g) Test Method Coefficient of Thermal Expansion (CTE) 59e-6 (in./in./ºC), 159e-6 (in./in./ºC) Business Information
Shelf Life Details Store 3M™ Scotch-Weld™ Epoxy Adhesive DP-460 EG at 60-80°F (15-27°C) or refrigerate for maximum shelf life.;3M™ Scotch-Weld™ Epoxy Adhesive DP-460 EG has a shelf life of 15 months in its original container. Shelf Life Temperature (°F) 59 to 81 Shelf Life (mon) 15 -
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Best Practices for 3M DP460EG
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Curing
This adhesive will cure in 24 hours at room temperature. Heating will accelerate the cure and can result in a higher Tg than room temperature curing yields.
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Comparable Materials for 3M DP460EG
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Viscosity Test Methods
Viscosity | Temperature |
---|---|
15,000 to 25,000 cPs | 23°C |
Work / Pot Time Test Methods
Work / Pot Time | Temperature |
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110 min | 23°C |
Shear Strength Test Methods
Shear Strength | Type | Cure Time | Cure Temperature | Substrate | Test Method |
---|---|---|---|---|---|
> 5000 (lbf/in2) | Overlap shear Strength | 1,440 min | 23°C | Etched aluminum | ASTM D-1002-72, 0.060 inch thick, etched aluminum pulled at 0.10 inches/minute. |
> 5000 (lbf/in2) | Overlap shear Strength | 270 min | 49°C | Etched aluminum | ASTM D-1002-72, 0.060 inch thick, etched aluminum pulled at 0.10 inches/minute. |
> 5500 (lbf/in2) | Overlap shear Strength | 90 min | 71°C | Etched aluminum | ASTM D-1002-72, 0.060 inch thick, etched aluminum pulled at 0.10 inches/minute. |
> 5500 (lbf/in2) | Overlap shear Strength | 30 min | 93°C | Etched aluminum | ASTM D-1002-72, 0.060 inch thick, etched aluminum pulled at 0.10 inches/minute. |
> 5500 (lbf/in2) | Overlap shear Strength | 10 min | 121°C | Etched aluminum | ASTM D-1002-72, 0.060 inch thick, etched aluminum pulled at 0.10 inches/minute. |
Peel Strength Test Methods
Peel Strength | Type | Cure Time | Cure Temperature | Substrate | Test Method |
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60 (lbf/in) | T-Peel Strength | 1,440 min | 23°C | Anodized aluminum | ASTM D1876-61T, 0.032 inch thick, etched aluminum pulled at 20 inches/minute, Cohesive failure mode |
59 (lbf/in) | T-Peel Strength | 270 min | 49°C | Anodized aluminum | ASTM D1876-61T, 0.032 inch thick, etched aluminum pulled at 20 inches/minute, Cohesive failure mode |
43 (lbf/in) | T-Peel Strength | 90 min | 71°C | Anodized aluminum | ASTM D1876-61T, 0.032 inch thick, etched aluminum pulled at 20 inches/minute, Cohesive failure mode |
39 (lbf/in) | T-Peel Strength | 30 min | 93°C | Anodized aluminum | ASTM D1876-61T, 0.032 inch thick, etched aluminum pulled at 20 inches/minute, Adhesive failure mode |
45 (lbf/in) | T-Peel Strength | 10 min | 121°C | Anodized aluminum | ASTM D1876-61T, 0.032 inch thick, etched aluminum pulled at 20 inches/minute, Adhesive failure mode. |
Thermal Conductivity Test Methods
Thermal Conductivity | Temperature |
---|---|
0.18 W/m°K | 45°C |
Dielectric Constant Test Methods
Dielectric Constant | Temperature | Test Method |
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4.70 | 23°C | 1 KHZ |
Outgassing Test Methods
Outgassing | Temperature (°C) | Test Method |
---|---|---|
lower | ||
< 1000 (µg/g) | 85°C | via GC/MS, 85°C for 3 hours |
<= 5 (µg/g) | 85°C | via GC/MS, 85°C for 3 hours, Siloxane outgassing |