| Application Type | Bond, Pot |
|---|---|
| 1 Part or 2 Part | 2 Part |
| Material Form | Liquid |
| Substrate | Anodized Aluminum , Etched Aluminum |
| Industry | Hard Disk Drive Assembly |
| Manufacturer | 3M |
| Cure Method | 2 Part |
| Cure Temperature (°C) | 20 to 25 |
| Cure Time (min) | 1,440 |
| Viscosity (cPs) | 15,000 to 25,000 |
This adhesive will cure in 24 hours at room temperature. Heating will accelerate the cure and can result in a higher Tg than room temperature curing yields.
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| Viscosity | Temperature |
|---|---|
| 15,000 to 25,000 cPs | 23°C |
| Work / Pot Time | Temperature |
|---|---|
| 110 min | 23°C |
| Shear Strength | Type | Cure Time | Cure Temperature | Substrate | Test Method |
|---|---|---|---|---|---|
| > 5000 (lbf/in2) | Overlap shear Strength | 1,440 min | 23°C | etched aluminum | ASTM D-1002-72, 0.060 inch thick, etched aluminum pulled at 0.10 inches/minute. |
| > 5000 (lbf/in2) | Overlap shear Strength | 270 min | 49°C | etched aluminum | ASTM D-1002-72, 0.060 inch thick, etched aluminum pulled at 0.10 inches/minute. |
| > 5500 (lbf/in2) | Overlap shear Strength | 90 min | 71°C | etched aluminum | ASTM D-1002-72, 0.060 inch thick, etched aluminum pulled at 0.10 inches/minute. |
| > 5500 (lbf/in2) | Overlap shear Strength | 30 min | 93°C | etched aluminum | ASTM D-1002-72, 0.060 inch thick, etched aluminum pulled at 0.10 inches/minute. |
| > 5500 (lbf/in2) | Overlap shear Strength | 10 min | 121°C | etched aluminum | ASTM D-1002-72, 0.060 inch thick, etched aluminum pulled at 0.10 inches/minute. |
| Peel Strength | Type | Cure Time | Cure Temperature | Substrate | Test Method |
|---|---|---|---|---|---|
| 60 (lbf/in) | T-Peel Strength | 1,440 min | 23°C | anodized aluminum | ASTM D1876-61T, 0.032 inch thick, etched aluminum pulled at 20 inches/minute, Cohesive failure mode |
| 59 (lbf/in) | T-Peel Strength | 270 min | 49°C | anodized aluminum | ASTM D1876-61T, 0.032 inch thick, etched aluminum pulled at 20 inches/minute, Cohesive failure mode |
| 43 (lbf/in) | T-Peel Strength | 90 min | 71°C | anodized aluminum | ASTM D1876-61T, 0.032 inch thick, etched aluminum pulled at 20 inches/minute, Cohesive failure mode |
| 39 (lbf/in) | T-Peel Strength | 30 min | 93°C | anodized aluminum | ASTM D1876-61T, 0.032 inch thick, etched aluminum pulled at 20 inches/minute, Adhesive failure mode |
| 45 (lbf/in) | T-Peel Strength | 10 min | 121°C | anodized aluminum | ASTM D1876-61T, 0.032 inch thick, etched aluminum pulled at 20 inches/minute, Adhesive failure mode. |
| Thermal Conductivity | Temperature |
|---|---|
| 0.18 W/m°K | 45°C |
| Dielectric Constant | Temperature | Test Method |
|---|---|---|
| 4.70 | 23°C | 1 KHZ |
| Outgassing | Temperature (°C) | Test Method |
|---|---|---|
| lower | ||
| < 1000 (µg/g) | 85°C | via GC/MS, 85°C for 3 hours |
| <= 5 (µg/g) | 85°C | via GC/MS, 85°C for 3 hours, Siloxane outgassing |
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